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Preparing method of Ti2AlC particle reinforced copper base composite

A copper-based composite material and particle reinforcement technology, which is applied in the field of composite material preparation, can solve the problems affecting the reinforcement effect of AlC particles, affecting the electrical and mechanical properties of composite materials, etc., to improve hardness and strength, easy preparation method, and improve dispersion sexual effect

Active Publication Date: 2018-08-24
YANCHENG INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Traditional powder metallurgy, casting, spray deposition and other processes cannot effectively solve Ti 2 The dispersion of AlC particles in the copper matrix material directly affects the Ti 2 The reinforcement effect of AlC particles, which in turn affects the electrical and mechanical properties of composite materials

Method used

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  • Preparing method of Ti2AlC particle reinforced copper base composite
  • Preparing method of Ti2AlC particle reinforced copper base composite

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0023] A kind of Ti 2 The preparation method of AlC particle reinforced copper-based composite material, comprises the steps:

[0024] Step 1: Put Ti 2 AlC particles are put into the mixed solution of alcohol and acetone, and dispersed at high speed to make dispersed Ti 2 AlC particle suspension;

[0025] Step 2: Perform surface treatment on the fully annealed oxygen-free pure copper plate to remove surface oil and oxide film;

[0026] Step 3: Distributed Ti 2 The AlC particle suspension is evenly sprayed on the surface of the treated pure copper plate, and then a layer of pure copper plate is laminated on the surface. After fastening, rolling, and cutting in half, repeat the above process, and continue to spray Ti 2 AlC particles, Ti as sprayed 2 The volume fraction of AlC is 2 to 4% of the pure copper plate, and the plate is obtained by cumulative rolling of multiple passes;

[0027] Step 4: Do not add Ti 2 AlC particles, the plate obtained in step 3 continues to be a...

Embodiment 1

[0037] In this embodiment, 2vol% Ti is added 2 Preparation of Ti by Cumulative Rolling of AlC Particles 2 AlC particle reinforced copper matrix composite material is taken as an example, the size of oxygen-free pure copper plate is 200mm×25mm×1mm, Ti 2 The size of AlC particles is 100-200nm. The Ti 2 The preparation method of AlC particle reinforced copper matrix composite material is:

[0038] Step 1: Add 0.45g of Ti 2 Put the AlC particles into the mixed solution of 200ml alcohol and acetone and disperse at high speed for 30min to make Ti 2 AlC particle suspension;

[0039] Step 2: Perform surface treatment on the fully annealed oxygen-free pure copper plate to remove surface oil and oxide film;

[0040] Step 3: Put half of the dispersed Ti 2 The AlC particle suspension is evenly sprayed on the surface of the copper plate, and then the two copper plates are superimposed, fastened, rolled, cut in half, repeat the above process, and add Ti 2 AlC particles, carry out 2 ...

Embodiment 2

[0044] In this embodiment, 2vol% Ti is added 2 Preparation of Ti by Cumulative Rolling of AlC Particles 2 AlC particle reinforced copper matrix composite material is taken as an example, the size of oxygen-free pure copper plate is 200mm×25mm×1mm, Ti 2 The size of AlC particles is 100-200nm. The Ti 2 The preparation method of AlC particle reinforced copper matrix composite material is:

[0045] Step 1: Add 0.45g of Ti 2 Put the AlC particles into the mixed solution of 200ml alcohol and acetone and disperse at high speed for 30min to make Ti 2 AlC particle suspension;

[0046] Step 2: Perform surface treatment on the fully annealed oxygen-free pure copper plate to remove surface oil and oxide film;

[0047] Step 3: Put half of the dispersed Ti 2 The AlC particle suspension is evenly sprayed on the surface of the copper plate, and then the two copper plates are superimposed, fastened, rolled, cut in half, repeat the above process, and add Ti 2 AlC particles, carry out 2 ...

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Abstract

The invention discloses a preparing method of a Ti2AlC particle reinforced copper base composite, and belongs to the field of composite preparing. The method comprises the specific steps that Ti2AlC particle suspension is prepared; an oxygen-free pure copper plate in the completely annealed state is subject to surface treatment; the dispersed Ti2AlC particle suspension is evenly sprayed to the surfaces of copper plates, the two copper plates are overlapped, fastened, rolled, and cut in half, the above process is repeated few times, Ti2AlC particles are continuously added, and finally, a boardis continuously subject to accumulative roll-bonding at multiple passes. According to the preparing method, dispersion of reinforced particles in a base body can be obviously improved, through the coordinative effect of particle reinforcing, refined crystalline strengthening and work hardening, the hardness and the strength of the composite can be obviously improved, conductive performance is notobviously reduced, and the preparing method is easy to operate, simple in process, low in cost and capable of being produced in batch.

Description

technical field [0001] The invention belongs to the field of composite material preparation, in particular to a Ti 2 Preparation method of AlC particle reinforced copper matrix composite material. Background technique [0002] With the rapid development of industries such as machine manufacturing, electronic communication, rail transit, instrumentation and military industry, people have higher and higher requirements for the strength, electrical conductivity, thermal conductivity and fatigue performance of copper and its alloys. [0003] The strength and wear resistance of the matrix can be effectively enhanced by adding reinforcing phases (ceramic particles, whiskers, fibers, carbon nanotubes, graphene, etc.) to copper and its alloys. In general, the mechanical properties of Cu-based composites increase with the increase of the reinforcement phase content, however, the electrical conductivity of the composite material decreases significantly when the reinforcement phase co...

Claims

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Application Information

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IPC IPC(8): C22C1/10C22C9/00C22C32/00
CPCC22C1/1026C22C9/00C22C32/0052
Inventor 刘学然曹宇豪安晶庞绍平苏桂花姜翠凤杨子润
Owner YANCHENG INST OF TECH
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