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A light and flexible thermal interface material and its preparation method

A technology of thermal interface materials and film materials, which is applied in the field of polymer materials, can solve the problems of poor thermal interface materials and devices, limit practical applications, and harsh preparation conditions, and achieve excellent thermal conductivity, low cost, and simple process.

Active Publication Date: 2019-10-18
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In the prior art, pure graphene films with a thermal conductivity as high as 1940W / mK can be prepared by hot pressing, but their harsh preparation conditions (3000°C, 300MPa) and large brittleness limit their practical application (Advanced Materials.2017 ;29(27):1700589)
CN103213973A discloses a highly oriented pure graphite heat-conducting material with higher thermal conductivity; but because the inorganic materials and metal materials themselves are difficult to compress, it will cause poor contact between the thermal interface material and the device, resulting in higher interface heat Resistance; and the larger density will limit its application in aerospace, military and other fields

Method used

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  • A light and flexible thermal interface material and its preparation method
  • A light and flexible thermal interface material and its preparation method
  • A light and flexible thermal interface material and its preparation method

Examples

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Embodiment 1

[0036] A kind of natural rubber / graphene nanosheet lightweight flexible thermal interface material is prepared by vacuum filtration, and its preparation is carried out according to the following steps:

[0037] 1) First, ultrasonically disperse 10g of thermally conductive filler graphene nanosheets, 1g of dispersant polyvinyl alcohol and 50ml of deionized water for 30min; then mechanically stir for 2 hours;

[0038] 2) Add 4.17g natural rubber latex to the above system, and mechanically stir for 1 hour, the solid content of the rubber is 20% of the total mass of the sample;

[0039] 3) Then, add a vulcanization system, the vulcanization system includes sulfur 0.02g, ZDC 0.01g, zinc oxide 0.01g, and mechanically stir for 2 hours;

[0040] 4) The mixture of thermally conductive filler and rubber emulsion obtained in step 3) is prepared into a composite membrane material by vacuum filtration: the mixture is added to a frosted suction filter bottle equipped with a filter membrane,...

Embodiment 2

[0045] A kind of natural rubber / BN lightweight flexible thermal interface material is prepared by vacuum filtration, and its preparation is carried out according to the following steps:

[0046] 1) First, ultrasonically disperse 10g of thermally conductive filler BN, 5g of dispersant sodium dodecylsulfonate and 50ml of deionized water for 30 minutes; then mechanically stir for 2 hours;

[0047] 2) Add 6.26g natural latex to the above system, and mechanically stir for 1 hour, the solid content of the rubber is 30% of the total mass of the sample;

[0048] 3) Then, add the vulcanization system, the vulcanization system includes vulcanization agent sulfur 0.125g, accelerator ZDC 0.063g, activator zinc oxide 0.063g, and mechanically stir for 2 hours;

[0049] 4) The mixture of thermally conductive filler and rubber emulsion obtained in step 3) is prepared into a composite membrane material by vacuum filtration: the mixture is added to a frosted suction filter bottle equipped with ...

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Abstract

The invention belongs to the technical field of polymer materials, and specifically refers to a lightweight and flexible thermal interface material and a preparation method thereof. The thermal interface material of the present invention, the thermal interface material is a film material formed by self-assembly of latex and thermal conductive filler dispersion through vacuum filtration method, in the film material, the rubber particles in the latex are distributed between the thermal conductive fillers, and conduct heat The filler forms an orientation structure along the direction perpendicular to the thickness of the film; wherein, the thermally conductive filler is a sheet or rod-shaped thermally conductive filler, and the ratio of the thermally conductive filler to the latex is: 50-1000 parts by weight of the thermally conductive filler and 100 parts by weight of the latex. The thermal interface material obtained in the invention has higher thermal conductivity, better flexibility, lower hardness, lower density, smaller thickness and high performance of being bendable and foldable.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and specifically refers to a lightweight and flexible thermal interface material and a preparation method thereof. Background technique [0002] With the rapid development of miniaturization, high integration, high performance and multi-functionalization of electronic and electrical equipment, more and more heat is generated during the use of electronic and electrical equipment, which has a greater impact on the performance of electronic and electrical equipment. Therefore, the problem of heat dissipation in the use of electronic appliances becomes more and more important. Studies have shown that the failure rate of electronic equipment will increase exponentially with the increase of temperature. For any cooling system and structure, the radiator is an essential component. In order to achieve effective heat dissipation during the use of electronic and electrical equipment, high-perfo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L7/02C08K13/04C08K7/00C08K3/04C08K3/38C08J5/18
Inventor 杨伟冯昌平白露包睿莹刘正英杨鸣波
Owner SICHUAN UNIV