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A kind of preparation method of graphene composite film with high thermal conductivity

A graphene composite and high thermal conductivity technology, which is applied in chemical instruments and methods, carbon compounds, semiconductor/solid-state device components, etc., can solve problems such as complexity, poor product controllability, unfavorable large-scale production, etc., and achieve simplified preparation Process, improve production efficiency, shorten the effect of carbonization and graphitization time

Active Publication Date: 2021-03-26
厦门呈昱实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above-mentioned thermal conductive films are all graphite films with high thermal conductivity, because they use polyimide as the film matrix material, the process of converting polyimide into graphite film is more complicated and requires First carbonization and then graphitization, which consumes time and energy continuously, and the prepared products are less controllable, which is not conducive to large-scale production

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Add m-phenylenediamine and pyromellitic dianhydride to N,N-dimethylformamide, stir evenly until completely dissolved to obtain solution A; take 1g of single-layer graphene oxide and disperse it in 10ml of the solution , under ultrasonic conditions at 40°C for 10min to obtain an orange-yellow graphene oxide colloidal dispersion B; keep stirring in a water bath at 50°C, and mix the solution A in step 1 and the dispersion B in step 2 evenly , form a stable block system C; place the polytetrafluoroethylene mold that has been sprayed with a release agent in an oven, and add some block system C in step 3 to the polytetrafluoroethylene mold , cured and dried at 100°C for 0.5h; the dried product D was obtained; the dried product D in step 4 was ablated with a plasma ablation machine, and after 70S ablation at 2500°C, a high thermal conductivity After the graphene composite film is naturally cooled to room temperature, the heat-conducting film is rolled using a hot press to obta...

Embodiment 2

[0035] Add some p-phenylenediamine and pyromellitic dianhydride in N,N-dimethylformamide, wherein the molar ratio of p-phenylenediamine and pyromellitic dianhydride is 10:11, stir evenly until Completely dissolve to obtain solution A; take 0.1g single-layer graphene oxide, disperse it in 10ml of solution, and ultrasonicate for 10min under ultrasonic conditions at 40°C to obtain orange-yellow graphene oxide colloidal dispersion B; in a water bath at 50°C Stir continuously in the pot, mix the solution A in step 1 and the dispersion B in step 2 evenly to form a stable block system C; place the polytetrafluoroethylene mold that has been sprayed with a release agent in an oven In the process, add some block system C in step 3 to the polytetrafluoroethylene mold, and perform curing and drying at 100°C for 1 hour; obtain the dried product D; use a plasma ablation machine to process the dried product D in step 4 Ablation, after 70S ablation at 2800°C, a graphene composite film with hi...

Embodiment 3

[0038]Add some p-phenylenediamine and pyromellitic dianhydride in N,N-dimethylformamide, wherein the molar ratio of m-phenylenediamine and pyromellitic dianhydride is 1:1, stir evenly until Completely dissolve to obtain solution A; take 0.5g single-layer graphene oxide, disperse it in 10ml of solution, and ultrasonicate for 10min under ultrasonic conditions at 40°C to obtain orange-yellow graphene oxide colloidal dispersion B; in a water bath at 50°C Stir continuously in the pot, mix the solution A in step 1 and the dispersion B in step 2 evenly to form a stable block system C; place the polytetrafluoroethylene mold that has been sprayed with a release agent in an oven In the process, add some block system C in step 3 to the polytetrafluoroethylene mold, and perform curing and drying at 100°C for 1 hour; obtain the dried product D; use a plasma ablation machine to process the dried product D in step 4 Ablation, after 70S ablation at 2800°C, a graphene composite film with high ...

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Abstract

Graphene has broad application prospect in every field due to excellent physicochemical characteristics and is widely applied to the field of heat conduction because of high heat conductivity coefficient being 3500 W / mK; according to the technical scheme, a plasma ablation machine is introduced into the preparation process of a graphene film with high thermal conductivity for the first time and used for performing ablation treatment on a prepared polyimide complex film, so that the carbonization and graphitization time is greatly shortened, graphene carbonization in an original technology is simplified into one step, high-temperature ablation is improved, carbonization and graphitization treatment of the polyimide film and reduction of graphene oxide are realized by one step, and a final product shows quite excellent thermal conductivity.

Description

technical field [0001] The invention belongs to the field of preparation of high thermal conductivity composite materials, and in particular relates to the technical field of preparation of high thermal conductivity film materials of graphene composite polymers. Background technique [0002] With the continuous development of the electronics industry, the integration of electronic products is getting higher and higher. At the same time, the heat generated by the chip has also increased sharply. Due to the miniaturization of products, the unit heat density of products has inevitably increased sharply. However, the traditional physical heat dissipation methods such as copper tubes and aluminum sheets are increasingly difficult to meet the actual needs. For example, the thermal conductivity of the current commercial copper tubes or aluminum sheets is only 380 W / mK and 200 W / mK respectively, and their density But they are 8.96g / cm 3 and 2.7g / cm 3 , this not only cannot solve t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C01B32/205
CPCC04B35/528C04B35/622C04B35/80C04B2235/425C04B2235/5436C04B2235/5445C04B2235/5454C04B2235/602C04B2235/606C04B2235/656C04B2235/6567C04B2235/666C04B2235/96C04B2235/9607H01L23/3672H01L23/3737H01L23/3738
Inventor 韩金玲吕振瑞
Owner 厦门呈昱实业有限公司