Unlock instant, AI-driven research and patent intelligence for your innovation.

A method for improving the reliability of ceramic copper-clad laminates with nano-silver paste

A technology of ceramic copper clad laminate and nano-silver paste, which is applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc. The effect of improving cycle ability, reducing residual stress, and high reliability

Active Publication Date: 2020-09-11
北京漠石科技有限公司
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the ceramic substrate has a large welding residual stress and is prone to cracks, failures and cracks during use, which affects the reliability of the entire power module.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method for improving the reliability of ceramic copper-clad laminates with nano-silver paste
  • A method for improving the reliability of ceramic copper-clad laminates with nano-silver paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] The process steps of the preparation method for high-voltage and high-power high-reliability ceramic copper-clad laminates in this embodiment are as follows:

[0049] (1) Ultrasonic cleaning the ceramic substrate and metal copper sheet in an organic solvent for 20-30 minutes to remove the oily dirt adhering to the surface of the ceramic substrate, and then drying at 100-200°C for 1-5 hours to make the surface of the ceramic substrate The organic matter and water are fully volatilized, and the surface of the ceramic substrate is bombarded with ions to make the surface of the ceramic substrate clean at the atomic level. The thickness of the silicon nitride ceramic substrate is 0.3mm, and the thickness of the metal copper sheet is 0.15mm.

[0050] (2) Deposit a Ti metal layer and a Cu metal layer on the surface of the aluminum nitride ceramic substrate cleaned in step (1) by vacuum magnetron sputtering or ion plating, and electroplate a silver layer to obtain a pre-metalliz...

Embodiment 2

[0055] The process steps of the preparation method for high-voltage and high-power high-reliability ceramic copper-clad laminates in this embodiment are as follows:

[0056] (1) Ultrasonic cleaning the ceramic substrate and metal copper sheet in an organic solvent for 20-30 minutes to remove the oily dirt adhering to the surface of the ceramic substrate, and then drying at 100-200°C for 1-5 hours to make the surface of the ceramic substrate The organic matter and water are fully volatilized, and the surface of the ceramic substrate is bombarded with ions to make the surface of the ceramic substrate clean at the atomic level. The thickness of the silicon nitride ceramic substrate is 0.3mm, and the thickness of the metal copper sheet is 0.15mm.

[0057] (2) Deposit a Ti metal layer and a Cu metal layer on the surface of the aluminum nitride ceramic substrate cleaned in step (1) by vacuum magnetron sputtering or ion plating, and electroplate a silver layer to obtain a pre-metalliz...

Embodiment 3

[0062] The process steps of the preparation method for high-voltage and high-power high-reliability ceramic copper-clad laminates in this embodiment are as follows:

[0063] (1) Ultrasonic cleaning the ceramic substrate and metal copper sheet in an organic solvent for 20-30 minutes to remove the oily dirt adhering to the surface of the ceramic substrate, and then drying at 100-200°C for 1-5 hours to make the surface of the ceramic substrate The organic matter and water are fully volatilized, and the surface of the ceramic substrate is bombarded with ions to make the surface of the ceramic substrate clean at the atomic level. The thickness of the silicon nitride ceramic substrate is 0.3mm, and the thickness of the metal copper sheet is 0.15mm.

[0064] (2) Deposit a Ti metal layer and a Cu metal layer on the surface of the aluminum nitride ceramic substrate cleaned in step (1) by vacuum magnetron sputtering or ion plating, and electroplate a silver layer to obtain a pre-metalliz...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to a method for improving the reliability of a ceramic copper clad plate by using nano silver paste. The method includes the following steps that: (1) a ceramic substrate is cleaned; (2) a Ti, Zr, Hf or Cr metal layer and a Cu metal layer is sequentially formed on the upper surface and lower surface of the ceramic substrate separately through vacuum magnetron sputtering or ion plating, chemical silver-plating is carried out; and (3) two sides of the ceramic substrate which are provided with the metal layers through deposition are coated with nano silver soldering paste layers, and silver-plated copper foils are clamped onto the ceramic substrate coated with the nano silver soldering paste layers, an obtained product is sintered in a vacuum furnace. With the above technical schemes of the invention adopted, the nano silver paste is adopted to realize thick copper connection of the ceramic substrate; the particle size of silver powder reaches a nanometer level, andthe surface effect of the silver powder makes the melting point of the nano silver paste much lower than that of a silver bulk material. Compared with an existing Ag-Cu alloy vacuum brazing process, the method of the present invention enables the ceramic copper clad plate which has been sintered under low temperature to be used under high temperature below the melting point of silver; the microporous structure of the ceramic copper clad plate, which is formed after sintering, can play an importable role in alleviating the thermal stress caused by the mismatch of thermal coefficients of expansion of the ceramic substrate.

Description

technical field [0001] The invention belongs to the technical field of manufacturing copper-clad substrates, and in particular relates to a high-voltage and high-power high-reliability ceramic-metal reliable connection method. Background technique [0002] The heat generated by high-voltage and high-power modules is mainly transmitted to the outside through the ceramic copper-clad laminate, so the ceramic copper-clad laminate is an indispensable key basic material for power module packaging in the field of power electronics. At present, the maximum allowable operating temperature of semiconductor devices not only depends on the nature of semiconductor materials, but also is limited by packaging technology. Ceramic copper clad laminate refers to a special process board that is metallized on the ceramic surface. However, due to the large difference in thermal expansion coefficient between ceramics and metals, large stresses will be generated during cooling and use, resulting i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02
CPCH01L21/02H01L21/02057H01L21/02518
Inventor 张珊珊杨会生高克玮颜鲁春庞晓露杨理航万晓玲靳卫超
Owner 北京漠石科技有限公司