Compound processing method of micropore

Abstract

The invention discloses a compound processing method of a micropore. According to the compound processing method of the micropore, firstly, an additive manufacturing technique is adopted to preliminarily process the micropore, and then an extrusion honing finishing technique and an electric spark finishing technique are combined to perform postprocessing finishing, so that the surface roughness and the shape accuracy of the micropore can be increased, and the purpose of processing the micropore with an ultra-high depth-to-diameter ratio in pure metal with a high melting point is realized. Thecompound processing method of the micropore is a novel processing method of the micropore with the ultra-high depth-to-diameter ratio on the basis of additive and subtractive compound processing, andthe problems of difficulty in discharging electroerosion products, serious attenuation of energy spread to the bottom of a pore by laser, difficulty in guaranteeing the pore forming precision and thelike of a traditional micropore processing method during processing are solved. The compound processing method of the micropore can be used for processing circular micropores and can also be expandedin other processing fields of deep micropores with high melting points and in any complex shape.

Description

technical field [0001] The invention belongs to the field of deep microhole processing with large depth-to-diameter ratio, and in particular relates to a microhole composite processing method. Background technique [0002] In precision manufacturing, micropores with a large depth-to-diameter ratio, that is, micropores with a ratio of pore depth to pore diameter exceeding 50, as a common structure, are widely used in aviation, biology, chemical industry, energy and other fields. For example, in high-energy physics experiments, micropore imaging is an important means of experimental monitoring. In order to shield the impact of high-energy ray transmission on imaging quality, the microporous material is usually made of high-density materials such as pure tungsten metal, with a thickness of 20 cm, and the thickness exceeds 50 cm under special conditions. The image resolution of the imaging quality is mainly determined by the pinhole aperture, the smaller the aperture, the highe...

AI Technical Summary

Problems solved by technology

However, for pure metal materials such as microholes, with a diameter of hundreds of microns, a thickness of 100mm, and high-precision small holes, EDM deep holes also have the following disadvantages: 1) The electrode diameter is small, the length is large, and the rigidity is very high. Poor, easy to bend and break due to the impact of working fluid and extrusion of electro-corrosion products during processing

3) EDM relies on the local high temperature generated b

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