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Preparation method of alkali phenolic resin for 3D sand mold printing

A technology of phenolic resin and sand mold, which is applied in the field of foundry adhesives and organic chemistry, can solve the problems of unfavorable secondary curing and fluidity of resin sand, unable to meet the needs of 3D sand mold printing, poor high temperature resistance, etc., to achieve good application and Development prospects, good development potential and application prospects, and the effect of improving curing speed and strength

Active Publication Date: 2018-09-14
SUZHOU XINGYE MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the synthesis of alkali phenolic resin, its molecular weight must be strictly controlled: if the molecular weight is too small, the viscosity will be low, the curing speed will be slow, and the final strength will be low; if the molecular weight is too large, the viscosity will be high, which is not conducive to the secondary curing and the fluidity of resin sand. , uneven curing, which also leads to a decrease in final strength
The viscosity of ordinary alkali phenolic resin is mostly above 60mpa.s, which obviously cannot meet the needs of 3D sand printing and directly hinders its application in the field of 3D sand printing
In addition, the bonding bridge in the crosslinking process of phenolic resin is mainly connected by methylene bonds and ether bonds, which is relatively brittle and poor in high temperature resistance, so it must be improved to make it widely used in the field of 3D sand printing

Method used

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  • Preparation method of alkali phenolic resin for 3D sand mold printing
  • Preparation method of alkali phenolic resin for 3D sand mold printing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] In a 250ml four-neck flask equipped with a stirrer, a thermometer, a high-efficiency reflux condenser, and a drying tube at the top of the condenser, replace the air in the bottle with nitrogen, and add 26.2g (0.1mol) (2-hydroxy Ethyl) isocyanurate and 50ml tetrachloroethane, and heated up to 50 ~ 70 ℃, dissolved under stirring; 4.68g (0.05mol) of dimethyl chlorosilane was added dropwise, and the reaction temperature was controlled during the dropwise addition process. Not higher than 70°C; after dripping, raise the temperature to 90°C, and react for 5 hours; after the HCl gas is released, add 0.9g sodium hydroxide, keep stirring for 1 hour, and detect that the pH of the solution is 5-6 as the reaction end point; Organic solvents are recycled for use to obtain phenolic resin modifiers;

[0036] Weigh 100g of phenol, 30g of modifier, and 8.4g of 30% sodium hydroxide solution in a 500ml reaction kettle, and raise the temperature to 78-80°C, then add 140g of formaldehyde d...

Embodiment 2

[0038] In a 250ml four-neck flask equipped with a stirrer, a thermometer, a high-efficiency reflux condenser, and a drying tube on the top of the condenser, replace the air in the bottle with nitrogen, and add 26.2g (0.1mol) (2-hydroxy Ethyl) isocyanurate and 45ml of dioxane, and heated to 50 ~ 70 ° C, dissolved under stirring; 4.68g (0.05mol) of dimethyl chlorosilane was added dropwise, and the reaction temperature was controlled during the dropwise addition process. Not higher than 70°C; after dripping, raise the temperature to 95°C, and react for 2 hours; after the HCl gas is released, add 0.7g sodium hydroxide, keep stirring for 1 hour, and detect that the pH of the solution is 5-6 as the reaction end point; Organic solvents are recycled for use to obtain phenolic resin modifiers;

[0039] Weigh 90g of phenol, 10g of resorcinol, 20g of modifier and 4.9g of 40% potassium hydroxide solution into a 500ml reaction kettle, and raise the temperature to 74-76°C, then add 105g of ...

Embodiment 3

[0041] In a 250ml four-neck flask equipped with a stirrer, a thermometer, a high-efficiency reflux condenser, and a drying tube on the top of the condenser, replace the air in the bottle with nitrogen, and add 26.2g (0.1mol) (2-hydroxy Ethyl) isocyanurate and 60ml ethylene glycol dimethyl ether, and heated to 50 ~ 70 ° C, dissolved under stirring; dropwise added 4.68g (0.05mol) of dimethyl chlorosilane, dropwise process control The reaction temperature is not higher than 70°C; after dripping, raise the temperature to 90°C, and react for 4 hours; after the HCl gas is released, add 0.7g of sodium hydroxide, keep stirring for 1 hour, and detect that the pH of the solution is 5-6 as the reaction end point; Evaporate the organic solvent and recycle it for later use to obtain a phenolic resin modifier;

[0042] Weigh 80g of phenol, 20g of o-cresol, 10g of modifier and 7.6g of 30% sodium hydroxide solution in a 500ml reaction kettle, and raise the temperature to 78-80°C, then add 95g o...

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Abstract

The invention discloses a preparation method of alkali phenolic resin for 3D sand mold printing. The preparation method has the advantages that modifying agents, obtained from compounding of dimethylchlorosilane and 1,3,5-tris(2-hydroxyethyl)cyanuric acid, react with phenolic compounds, aldehyde compounds and alkali catalysts under a certain condition, and the obtained phenolic resin has excellentperformance of high curing speed, low viscosity, high strength and high-temperature resistance, and a good application and development prospect.

Description

technical field [0001] The invention belongs to the technical field of organic chemistry, in particular to the technical field of casting binders, in particular to an alkali phenolic resin for 3D sand printing and a preparation method thereof, especially a fast-curing, low-viscosity, high-strength, high-temperature-resistant phenolic resin Resins and methods for their preparation. Background technique [0002] Restricted by the development of domestic 3D testing machines and the technical limitations of foreign commercial equipment for material research, domestic research on 3D materials is still at an elementary level, and there are very few binders that can be used for 3D sand printing. At present, the binder system used for supporting 3D sand printing casting has extremely high requirements: the resin requires extremely low viscosity, good fluidity, rapid hardening, and high temperature strength at the same time. Therefore, it is imminent to develop 3D printing binders t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G12/42
CPCC08G12/425
Inventor 戴旭朱文英王锦程王文浩
Owner SUZHOU XINGYE MATERIALS TECH
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