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Liquid development photoimageable ink and preparation method thereof

A photosensitive solder resist ink, liquid technology, applied in the field of liquid development photosensitive solder resist ink and its preparation, can solve the problems of high brittleness of cured film, long curing time, low printing precision, etc., and achieve good compatibility and short curing time , the effect of high printing precision

Inactive Publication Date: 2018-09-14
江苏海田电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a liquid developing photosensitive solder resist ink suitable for flexible electric board printing and its preparation method to overcome the disadvantages of long curing time, high brittleness of the cured film and printing accuracy. low disadvantage

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Mix o-cresol novolac epoxy acrylate, butyl cellosolve, di-tert-butyl p-cresol polymerization inhibitor and triethylamine catalyst and heat up to 75° C. and stir for 45 minutes, then add the toluene solution of phthalic anhydride, (o The reaction molar ratio of cresol novolac epoxy acrylate, butyl cellosolve, di-tert-butyl p-cresol, triethylamine and phthalic anhydride is 3:1:0.2:0.3:2) to react until the acid value is the initial acid After half of the value, the solvent is distilled off under reduced pressure to obtain polybasic anhydride modified novolac epoxy acrylate.

Embodiment 2

[0040] Mix o-cresol novolak epoxy acrylate, butyl cellosolve, di-tert-butyl p-cresol polymerization inhibitor and triethylamine catalyst and heat up to 80° C. and stir for 30 minutes, then add the toluene solution of phthalic anhydride, (o The reaction molar ratio of cresol novolac epoxy acrylate, butyl cellosolve, di-tert-butyl p-cresol, triethylamine and phthalic anhydride is 3:1:0.2:0.3:5) to react until the acid value is the initial acid After half of the value, the solvent is distilled off under reduced pressure to obtain polybasic anhydride modified novolac epoxy acrylate.

Embodiment 3

[0042] Step 1: Get 28 parts of polybasic anhydride modified novolac epoxy acrylate prepared in Example 1, 12 parts of alkali-soluble photosensitive resin (E-51 type), 16 parts of acrylic acid active monomer (dipropylene glycol diacrylate and tetrahydrofuran Acrylate monomer, weight ratio is 1:1) and 8 parts of photoinitiator 2-hydroxy-2-methyl-1-phenyl-1-acetone are put into the feeding channel;

[0043] Step 2: Use a high-speed disperser at a speed of 900r / min to disperse at 75°C for 0.6h, stop stirring and keep warm;

[0044] Step 3: Add 7 parts of silicon dioxide, 4 parts of fluorine-containing surfactant, 2 parts of defoamer, 2 parts of water reducer and 2 parts of leveling agent to the feed liquid obtained in step 2, and continue to stir at 600r / min 0.4h;

[0045] Step 4: After stirring and mixing, use a hydraulic three-roller to grind until the particle size is below 300 nanometers;

[0046] Step 5: It is obtained after filtering with a 1 μm filter element filter.

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PUM

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Abstract

The invention discloses liquid development photoimageable ink and a preparation method thereof. The liquid development photoimageable ink comprises, by weight, 25-35 parts of multi-element anhydride modified linear phenolic epoxy acrylate, 10-15 parts of alkali-developable photosensitive resin, 10-20 parts of acrylic acid active monomer, 5-10 parts of photoinitiator, 5-15 parts of silicon dioxide,2-6 parts of fluorine-containing surfactant, 1-3 parts of defoaming agent, 1-3 parts of water reducing agent and 1-3 parts of leveling agent. The liquid development photoimageable ink and the preparation method thereof have the advantages that multi-element phthalic anhydride is used to modify o-cresol formaldehyde epoxy acrylate to obtain the multi-element anhydride modified linear phenolic epoxy acrylate, the multi-element anhydride modified linear phenolic epoxy acrylate combines with the alkali-developable photosensitive resin and the acrylic acid active monomer to prepare the liquid development photoimageable ink through the mutual coordination and promotion of the molecular structures of the three, the prepared liquid development photoimageable ink is short in curing time, good in compatibility, high in printing precision and applicable to flexible circuit board printing, and the problem that a cured film is high in brittleness is improved evidently.

Description

technical field [0001] The invention relates to a liquid developing photosensitive solder resist ink and a preparation method thereof, belonging to the field of solder resist inks. Background technique [0002] Liquid photosensitive ink is a special UV ink, which can be used for full-page printing without a printing plate. After the ink coating is photosensitive cured and developed, it can be processed by etching, electroplating, electrophoretic coloring, etc., which is suitable for the production of small batch, multi-variety, personalized and high-precision graphic products. The solder mask is a permanent protective layer coated on the surface of the printed board. It selectively protects the surface of the printed board and prevents short circuits and bridging between wires and pads when soldering components. In addition, it also has the functions of moisture proof, mildew proof and salt spray proof. Therefore, the quality of the solder mask not only affects the appeara...

Claims

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Application Information

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IPC IPC(8): C09D11/107C09D11/03G03F7/004
CPCC09D11/03C09D11/107G03F7/004
Inventor 王琦常红言
Owner 江苏海田电子材料有限公司
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