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Silver alloy bonding wire and manufacturing method thereof

A silver alloy bond and silver alloy technology, which is applied in the field of bonding wire, can solve the problems of affecting the service life of the product, the anti-sulfurization performance and anti-aging performance of the silver alloy bonding wire are not ideal, and achieve cost reduction and market competitiveness. , good effect of burning ball

Active Publication Date: 2018-09-28
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the anti-sulfurization and anti-aging properties of this silver alloy bonding wire are still not ideal, which affects the service life of the packaged product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The copper alloy bonding wire of this embodiment contains Au 15%, Pd 5%, Ca 100ppm, Cu 500ppm, Pt 100ppm by weight, and the balance is silver.

[0029] The manufacture method of above-mentioned silver alloy bonding wire comprises the following steps:

[0030] (1) Melting and casting: Au, Pd, Ca and Cu are added to the silver raw material in proportion, and after vacuum melting and directional continuous casting process, a wire rod with a diameter of 8 mm is obtained;

[0031] (2) Wire drawing: drawing the wire rod obtained in step (1) to obtain a silver alloy wire with a diameter of 100um;

[0032] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is performed on the silver alloy wire, and N 2 As the annealing atmosphere, the effective length of the annealing furnace is 800mm, the annealing temperature is 500°C, and the annealing rate is 80m / min;

[0033] (4) Continue to draw the silver alloy wire after the intermediate annea...

Embodiment 2

[0037] The copper alloy bonding wire of this embodiment contains 17% by weight of Au, 7% of Pd, 900 ppm of Cu, 100 ppm of Si, and the balance is silver.

[0038] The manufacture method of above-mentioned silver alloy bonding wire comprises the following steps:

[0039] (1) Melting and casting: Au, Pd, Cu and Si are added to the silver raw material in proportion, and a wire rod with a diameter of 6 mm is obtained through vacuum melting and directional continuous casting process;

[0040] (2) Wire drawing: drawing the wire rod obtained in step (1) to obtain a silver alloy wire with a diameter of 60um;

[0041] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is performed on the silver alloy wire, and N 2 As the annealing atmosphere, the effective length of the annealing furnace is 600mm, the annealing temperature is 300°C, and the annealing rate is 60m / min;

[0042] (4) Continue to draw the silver alloy wire after the intermediate an...

Embodiment 3

[0046] The copper alloy bonding wire of this embodiment contains 19% by weight of Au, 3% of Pd, 100ppm of Ca, 20ppm of Be, 50ppm of In, and the balance is silver.

[0047]The manufacture method of above-mentioned silver alloy bonding wire comprises the following steps:

[0048] (1) Melting and casting: Au, Pd, Ca, Be and In are added to the silver raw material in proportion, and after vacuum melting and directional continuous casting process, a wire rod with a diameter of 8 mm is obtained;

[0049] (2) Wire drawing: drawing the wire rod obtained in step (1) to obtain a silver alloy wire with a diameter of 180um;

[0050] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is performed on the silver alloy wire, and N 2 As the annealing atmosphere, the effective length of the annealing furnace is 1000mm, the annealing temperature is 600°C, and the annealing rate is 120m / min;

[0051] (4) Continue to draw the silver alloy wire after the ...

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Abstract

The invention relates to a silver alloy bonding wire. The silver alloy bonding wire contains 11 to 30% of Au by weight, 0.1 to 10% of Pd by weight, 2 to 1000 ppm of a trace addition element, and the balance of Ag; the trace addition element is one element or a combination of two elements selected from Ca, Cu, Be, In, Si, Pt, and Ge. The present invention also provides a manufacturing method of thesilver alloy bonding wire. The silver alloy bonding wire of the invention has the advantages of excellent vulcanization resistance, excellent anti-aging property, excellent FAB burning, no ball slip,high bonding strength of welding points and high reliability. The silver alloy bonding wire can improve the reliability of a packaged product in a thermal shock test and can withstand 250 to 300 rounds of thermal shock under the same aging condition (-40 DEG C to 100 DEG C). During FAB burning, a nitrogen-hydrogen mixture gas of which the gas flow rate ranges from 0.3 to 0.6 L / min can be introduced or not introduced; and the use of the nitrogen-hydrogen mixture gas can be omitted with cost and safety considered.

Description

technical field [0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a silver alloy bonding wire and a manufacturing method thereof. Background technique [0002] Bonding wire (bonding wire, also known as bonding wire) is the main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, in terms of product direction, mainly includes wire diameter miniaturization, high floor life and high bobbin length; in terms of chemical composition, there are mainly copper wires (including bare copper wires, palladium-coated copper wires) , flash gold palladium-plated copper wire) has largely replaced gold wires in the semiconductor field, while silver wires and silver alloy wires have replaced gold wires in LED and some IC packaging applications. Due to the development requirements of miniaturization and thinning of electronic products, the sem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L21/60
CPCH01L21/4821H01L24/03H01L24/04H01L2224/02H01L2224/04H01L2224/05144H01L2224/05164
Inventor 周振基周博轩麦宏全彭政展
Owner NICHE TECH KAISER SHANTOU
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