A storage and gating dual-function device and its preparation method
A dual-function, device technology, applied in the direction of electrical components, etc., can solve the problem of low device density and other issues
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[0031] The present invention also provides a method for preparing the storage and gating dual-function device described in the above technical solution, comprising the following steps:
[0032] (1) Using argon as the working gas and niobium pentoxide target as the sputtering target, perform the first sputtering on the surface of the bottom electrode to obtain the semi-finished product of the storage and gating dual-function device;
[0033] (2) Using argon as the working gas and a tungsten target as the sputtering target, perform the second sputtering on the niobium oxide surface of the semi-finished storage and gating dual function device to obtain the storage and gating dual function device.
[0034] In the present invention, a tungsten target and a niobium pentoxide target are preferably installed on the magnetron sputtering equipment, and then after the vacuum chamber of the magnetron sputtering equipment is evacuated, argon gas is introduced to the pressure required for th...
Embodiment 1
[0051] (1) will have an area of 1μm 2 The surface of the base material of the TiN bottom electrode is rinsed with high-pressure air for subsequent use; the TiN bottom electrode is square and has a thickness of 200nm;
[0052] (2) Install a tungsten target and a niobium pentoxide target in the magnetron sputtering equipment, place the mold carrier substrate with the TiN bottom electrode obtained in step (1) in the magnetron sputtering equipment, and place the vacuum chamber After evacuating, argon is introduced until the system pressure is 4 Torr;
[0053] (3) Turn on the radio frequency measurement and control sputtering power supply, and at a temperature of 300K, with a power of 120W, sputter niobium pentoxide to the surface of the TiN bottom electrode for 400s, then turn off the radio frequency magnetron sputtering to obtain a semi-finished product;
[0054] (4) Turn on the DC magnetron sputtering power supply, and sputter tungsten on the surface of the semi-finished produc...
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