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Preparation method for phenolic aldehyde plate thermal insulation material for building exterior wall

A technology for thermal insulation materials and building exterior walls, applied in the field of building materials, can solve the problems of economic waste, reduce fire protection level, and high brittleness, and achieve the effects of reducing water absorption, improving fire protection and thermal insulation performance, and improving brittleness.

Inactive Publication Date: 2018-10-23
安徽润晟建设有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The phenolic foam insulation board has the following disadvantages: 1. Small toughness, high brittleness, easy to break, easy to drop powder; 2. Use low boiling point naphthene series (cyclopentane, cyclohexane, cyclobutane, etc.) organic solvents as foaming agents , pay attention to safety in transportation, economical waste in use, strictly control the aging time of phenolic foam insulation board after production, otherwise the fire protection level will be reduced

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A kind of preparation method of the phenolic board thermal insulation material that the present invention proposes, comprises the following steps:

[0020] S1. Mix 30 parts of expanded perlite and 2.7 parts of inorganic mineral powder, spray the surface of the mixture with 15 parts of water, let it dry after 15 hours, and then use 22 parts of 10% thermosetting dodecyltrimethoxysilane to modify the phenolic resin Spray the ethanol solution on the surface of the mixture, solidify and dry to obtain material a;

[0021] S2. Add 100 parts of phenolic resin and 8 parts of carboxylated nitrile rubber into the internal mixer, and banbury at 110° C. for 10 minutes to obtain material b;

[0022] S3. Mix 4 parts of glass fiber, 10 parts of aluminum borate whiskers, 5 parts of mica powder, 10 parts of sepiolite powder, 1 part of silane coupling agent, and 15 parts of ethanol, stir, and then add 70 parts of material b, 19 1 part of silica airgel, 1 part of castor oil polyoxyethylen...

Embodiment 2

[0025] A kind of preparation method of the phenolic board thermal insulation material that the present invention proposes, comprises the following steps:

[0026] S1. Mix 40 parts of expanded perlite and 4.3 parts of inorganic mineral powder, spray the surface of the mixture with 24 parts of water, let it dry after 20 hours, and then use 29 parts of 10% thermosetting dodecyltrimethoxysilane to modify the phenolic resin Spray the ethanol solution on the surface of the mixture, solidify and dry to obtain material a;

[0027] S2. Add 100 parts of phenolic resin and 15 parts of carboxylated nitrile rubber into the internal mixer, and banbury at 120° C. for 20 minutes to obtain material b;

[0028] S3. Mix 8 parts of glass fiber, 5 parts of aluminum borate whiskers, 10 parts of mica powder, 5 parts of sepiolite powder, 2 parts of silane coupling agent, and 22 parts of ethanol, stir, and then add 90 parts of material b, 12 1 part of silica airgel, 2 parts of castor oil polyoxyethyl...

Embodiment 3

[0031] A kind of preparation method of the phenolic board thermal insulation material that the present invention proposes, comprises the following steps:

[0032] S1. Mix 34 parts of expanded perlite and 4 parts of inorganic mineral powder, spray the surface of the mixture with 21 parts of water, let it dry after 18 hours, and then use 27 parts of 10% thermosetting dodecyltrimethoxysilane to modify the phenolic resin Spray the ethanol solution on the surface of the mixture, solidify and dry to obtain material a;

[0033] S2. Add 100 parts of phenolic resin and 10 parts of carboxylated nitrile rubber into the internal mixer, and banbury at 115° C. for 10 minutes to obtain material b;

[0034] S3. Mix 7 parts of glass fiber, 6 parts of aluminum borate whiskers, 8 parts of mica powder, 6 parts of sepiolite powder, 1 part of silane coupling agent, and 18 parts of ethanol, stir, and then add 78 parts of material b, 15 1 part of silica airgel, 2 parts of castor oil polyoxyethylene ...

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PUM

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Abstract

The invention discloses a preparation method for a phenolic aldehyde plate thermal insulation material for a building exterior wall, and relates to the technical field of building materials. The preparation method comprises the following steps that expanded perlite and inorganic mineral powder are mixed, the surface is sprayed with water, placing and drying are carried out, the surface of a mixture is sprayed by using an ethanol solution of thermosetting dodecyltrimethoxysilane modified phenolic resin, and curing and drying are carried out so as to obtain a material a; the phenolic resin and carboxyl nitrile rubber are mixed so as to obtain a material b; glass fibers, aluminum borate whiskers, mica powder, sepiolite powder, a silane coupling agent and ethanol are mixed and stirred, then the material b, silicon dioxide aerogel and castor oil polyoxyethylene ether are added, mixing and stirring are carried out, then dichloromethane, lauryl sodium sulfate, a curing agent and the materiala are added, and stirring is carried out so as to obtain a material c; and the material c is poured into a mold, hot-press molding is carried out, and pressure maintaining and cooling are carried outso as to obtain the phenolic aldehyde plate thermal insulation material. The phenolic aldehyde plate thermal insulation material is good in thermal insulation performance and high in strength, powderfalling and scaling-off are not liable to occur, and the fireproofing grade can reach A1 grade.

Description

technical field [0001] The invention relates to the technical field of building materials, in particular to a preparation method of a phenolic board insulation material for building exterior walls. Background technique [0002] The phenolic foam insulation board is made of thermosetting phenolic resin as the main raw material, adding surfactants, using cyclopentane and other low-boiling point organic solvents as foaming agents, and under the action of an acidic catalyst, the components are fully mixed and heated at 60 ° C. Foaming and curing molding at a temperature of ~75°C. The phenolic foam insulation board has the following disadvantages: 1. Small toughness, high brittleness, easy to break, easy to drop powder; 2. Use low boiling point naphthene series (cyclopentane, cyclohexane, cyclobutane, etc.) organic solvents as foaming agents , pay attention to safety in transportation, economical waste in use, strictly control the aging time of phenolic foam insulation board aft...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/06C08L13/00C08L71/02C08K13/06C08K9/10C08K7/26C08K7/14C08K7/08C08K3/34C08K3/36C08K5/41C08J9/14
CPCC08J9/0033C08J9/0061C08J9/0066C08J9/145C08J2203/142C08J2361/06C08J2413/00C08J2471/02C08K3/34C08K3/36C08K5/41C08K7/08C08K7/14C08K7/26C08K9/10C08K13/06
Inventor 奚程翀
Owner 安徽润晟建设有限公司
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