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Epoxy resin composition for sealing semiconductor device and semiconductor device sealed using same

A technology of epoxy resin and composition, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electric solid-state devices, etc., can solve the problem of low adhesion of silicon nitride film, and achieve the suppression of interface delamination and good strength , toughness and the effect of minimizing deterioration of flow balance

Active Publication Date: 2021-08-31
SAMSUNG SDI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, typical epoxy resin compositions used to encapsulate semiconductor devices have low adhesion to silicon nitride films, leading to interfacial delamination

Method used

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  • Epoxy resin composition for sealing semiconductor device and semiconductor device sealed using same
  • Epoxy resin composition for sealing semiconductor device and semiconductor device sealed using same
  • Epoxy resin composition for sealing semiconductor device and semiconductor device sealed using same

Examples

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Embodiment

[0126] Now, the present invention will be described in detail with reference to Examples and Comparative Examples.

[0127] The details of the components used in Examples and Comparative Examples are as follows:

[0128] (A) epoxy resin:

[0129] (A1) HP-4770 (DIC Corporation, equivalent weight: 204).

[0130] (A2) YX-8800 (Japan Epoxy Resin, equivalent weight: 181).

[0131] (B) curing agent:

[0132] (B1) MEH-7500-3S (Meiwa Chem, equivalent weight: 103).

[0133] (B2) MEH-7851S (Meiwa Chem, equivalent weight: 203).

[0134] (C) Inorganic filler:

[0135] A mixture of fused silica (Admatechs Co., Ltd.) with an average particle diameter of 20 μm and synthetic silica (Admatechs Co., Ltd.) with an average particle diameter of 0.5 μm (fused silica and synthetic silica The weight ratio: 9:1).

[0136] (D) Aromatic monomer: m-phenylenediamine (Sigma Aldrich, equivalent weight: 54).

[0137] (E) Reactive rubber: carboxy-terminated butadiene-acrylonitrile (Sigma Aldrich, equi...

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Abstract

The present invention relates to an epoxy resin composition for sealing semiconductor devices, the epoxy resin composition comprising: an epoxy resin; a curing agent; an inorganic filler; and an aromatic monomer containing two or more amine groups A body, wherein the aromatic monomer containing two or more amine groups is included in the epoxy resin composition in an amount of about 0.1 to 1.0 wt%.

Description

technical field [0001] The invention relates to an epoxy resin composition for packaging semiconductor devices and semiconductor devices packaged with the epoxy resin composition. More specifically, the present invention relates to an epoxy resin composition for encapsulating a semiconductor device, the epoxy resin composition has good adhesive strength to a silicon nitride film, and a semiconductor encapsulated using the epoxy resin composition device. Background technique [0002] In order to protect semiconductor devices such as integrated circuits (ICs) or large scale integration (LSI) devices from external environments such as moisture, a technique of encapsulating semiconductor devices using epoxy resin compositions has been widely used. Such epoxy resin compositions for encapsulating semiconductor devices generally include an epoxy resin, a curing agent, and a curing catalyst. In general, a technique for improving epoxy resin or phenol resin as a curing agent to enh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K3/10C08L63/00H01L23/29
CPCC08L63/00C09K3/10H01L23/29
Inventor 郑京学
Owner SAMSUNG SDI CO LTD
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