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Gold micro-nano array and preparation method thereof

A micro-nano and array technology, applied in the nano field, can solve the problems of cumbersome preparation process, harsh conditions, poor template wettability, etc., and achieve the effect of high chemical activity, mild conditions and strong binding force

Active Publication Date: 2018-11-06
深圳市勃望初芯半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in this method, the wettability of the template is poor, and the unevenness of the metal conductive layer at the bottom of the hole will lead to inconsistent growth rate of the nano-array, low hole filling rate, and its preparation process is cumbersome and the conditions are harsh.
3. Electrochemical deposition method, such as Hang et al. (J.Electrochem.Soc., 2010,157,12,624-627) proposed a new method for preparing surface micro-nano array materials without a template, and prepared by directional electrocrystallization Nickel micro-nano needle cone array material, but this method requires the use of corresponding electrochemical equipment, has high environmental requirements, and is relatively time-consuming and expensive

Method used

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  • Gold micro-nano array and preparation method thereof
  • Gold micro-nano array and preparation method thereof
  • Gold micro-nano array and preparation method thereof

Examples

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Effect test

example 1

[0046] A method for preparing a gold micro-nano needle cone array, comprising the following steps:

[0047] (1) At room temperature, add 1L of water, 1mmol of gold chloride (AuCl) and 3mmol of formic acid (HCOOH) into the container, gently shake and mix to form a chemical deposition solution;

[0048] (2) Put the gold foil in the above-mentioned chemical deposition solution, store it at room temperature for 12 hours, put the gold foil in water, and ultrasonicate for 30 minutes under the condition of power of 600W and frequency of 40KHz, to remove the strong adhesion with the gold foil. For poor gold micro-nano needle cones, a layer of gold micro-nano needle cones with good biocompatibility, large surface area and good binding force is formed on the surface of the substrate, that is, an array of gold micro-nano needle cones is obtained.

[0049] Figure 1-3 The scanning electron microscope pictures of the front and side of the gold micro-nano needle-cone array in this example,...

example 2

[0051] A method for preparing a gold micro-nano needle cone array, comprising the following steps:

[0052] (1) At room temperature, add 1L of water, 20mmol of chloroauric acid trihydrate (HAuCl4 3H2O) and 3mmol of sodium citrate (Na3C6H5O7) into the container, shake and mix gently to form a chemical deposition solution;

[0053] (2) Put the titanium sheet in the above chemical deposition solution, store it at room temperature for 12 hours, put the titanium sheet in water, and ultrasonicate for 30 minutes under the condition of power of 600W and frequency of 40KHz, to remove the adhesion with the titanium sheet. For gold micro-nano needle cones with poor adhesion, a layer of gold micro-nano needle cones with good biocompatibility, large surface area and good binding force is formed on the surface of the substrate, that is, an array of gold micro-nano needle cones is obtained.

example 3

[0055] A method for preparing a gold micro-nano needle cone array, comprising the following steps:

[0056] (1) At room temperature, add 1L of water, 4 mmol of potassium chloroaurate dihydrate (KAuCl4 2H2O) and 8 mmol of hydroxylamine hydrochloride (NH2OH HCl) into the container, shake and mix gently to form a chemical deposition solution;

[0057] (2) Place the silicon chip in the above chemical deposition solution, store it at room temperature for 12 hours, put the silicon chip in water, and ultrasonicate for 30 minutes under the condition of power of 600W and frequency of 40KHz to remove the silicon chip. For gold micro-nano needle cones with poor adhesion, a layer of gold micro-nano needle cones with good biocompatibility, large surface area and good binding force is formed on the surface of the substrate, that is, an array of gold micro-nano needle cones is obtained.

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Abstract

The invention provides a preparation method of a gold micro-nano array. A gold micro-nano structure modification layer is arranged on the surface of the micro-nano array. The micro-nano array uses a gold micro-nano structure as a surface modification layer, the binding force of the modification layer and a substrate is high, the situation that the modification layer falls off and consequently an electrode loses efficacy is not prone to occur, the superficial area of the modified substrate is increased greatly, the chemical activity of the micro-nano array is increased significantly, the properties of the catalysis, optics and electricity aspects of the micro-nano array are improved significantly, and thus the micro-nano array has wide application prospects in the fields of microelectronics, new energy, chemical industry and the like. The preparation method comprises the steps that a chemical deposition solution is provided or prepared, and the chemical deposition solution contains a gold salt solution and a weak reducing agent; and the substrate is put into the chemical deposition solution, and the gold micro-nano array is formed on the surface of the substrate.

Description

technical field [0001] The present invention generally relates to the field of nanotechnology, in particular to a gold micro-nano array and a preparation method thereof. Background technique [0002] Micro-nano array material, due to its special surface micro-nano structure, high chemical activity, etc., determines its good functional properties in catalysis, optics, magnetism, electronics, etc. , chemical, military and other fields have broad application prospects, has become one of the hot spots of today's research. [0003] At present, the methods for preparing micro-nano array structure materials mainly include the following: 1. Photolithography, which is mainly realized by sacrificial layer technology. First, a layer of sacrificial layer material is deposited on the substrate, and then photolithography, etching Form a certain pattern by etching; then deposit a layer of material as a mechanical structure and photoetch the required pattern; finally etch away the supporti...

Claims

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Application Information

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IPC IPC(8): C23C18/44B82Y30/00B82Y40/00
CPCB82Y30/00B82Y40/00C23C18/1646C23C18/44
Inventor 张翊
Owner 深圳市勃望初芯半导体科技有限公司