A chip oxygen sensor with two-part zirconia structure and its preparation method
An oxygen sensor and zirconia technology, applied in the field of sensors, can solve the problems of increased process complexity, unbearable sensors, and low thermal conductivity of zirconia, so as to reduce the sintering stress, reduce the accumulation of thermal stress, and improve the production pass rate. Effect
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Embodiment 1
[0032]A chip oxygen sensor with a two-part zirconia structure, including a porous and protective layer 1, a functional layer 2, an air cavity layer 3, a structural layer 4 and a heating layer 5 which are sequentially stacked and sintered from top to bottom; One end of the porous and protective layer 1 is a porous alumina substrate 11, and the other end of the porous and protective layer 1 is a first alumina substrate 12, and the functional layer 2 includes a first zirconia substrate 21 and is screen printed. Internal electrodes 23 and external electrodes 22 on both sides of the first zirconia substrate 21, wherein the external electrodes 22 are located on the first zirconia substrate 21 near the side of the porous and protective layer 1, and the porous alumina substrate 11 Completely cover the external electrode 22, the first aluminum oxide substrate 12 covers the external electrode lead, the air cavity layer 3 includes the second aluminum oxide substrate 31 and the air cavity ...
Embodiment 2
[0037] A method for preparing a chip oxygen sensor containing a two-part zirconia structure, comprising the following steps:
[0038] 1) Preparation of zirconia ceramic slurry, alumina ceramic slurry and porous alumina ceramic slurry:
[0039] In order to match the thermal expansion coefficient of alumina, the zirconia ceramic slurry is prepared according to the following mass percentage of raw materials: 90% of zirconia powder, 5% of yttrium oxide powder and 5% of the first alumina powder are formulated as inorganic components, Then add the dispersant accounting for 1% of the total mass of the inorganic components, the organic solvent accounting for 40% of the total mass of the inorganic components, the binder accounting for 5% of the total mass of the inorganic components and the plasticizer accounting for 5% of the total mass of the inorganic components; after ball milling That is to form a zirconia ceramic slurry;
[0040] In order to match the shrinkage rate and shrinkag...
Embodiment 3
[0048] A method for preparing a chip oxygen sensor containing a two-part zirconia structure, comprising the following steps:
[0049] 1) Preparation of zirconia ceramic slurry, alumina ceramic slurry and porous alumina ceramic slurry:
[0050] In order to match the thermal expansion coefficient of alumina, the zirconia ceramic slurry is prepared according to the following mass percentage of raw materials: 76.5% of zirconia powder, 13.5% of yttrium oxide powder and 10% of the first alumina powder are formulated as inorganic components, Then add dispersant accounting for 10% of the total mass of the inorganic components, an organic solvent accounting for 60% of the total mass of the inorganic components, an adhesive agent accounting for 15% of the total mass of the inorganic components and a plasticizer accounting for 15% of the total mass of the inorganic components; after ball milling That is to form a zirconia ceramic slurry;
[0051] In order to match the shrinkage rate and...
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