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SMT jig cleaning liquid and preparation method thereof

A cleaning liquid and fixture technology, applied in chemical instruments and methods, detergent compounding agents, detergent compositions, etc., can solve problems such as poor cleaning ability, poor compatibility of SMT fixtures, and fixture corrosion, and achieve The preparation method is simple, the production efficiency is high, and the effect of prolonging the service life

Inactive Publication Date: 2018-11-09
东莞市伟思化学科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, the water-based cleaning agents developed in China have problems such as poor cleaning ability, poor compatibility with SMT fixtures, and corrosion of fixtures after cleaning.

Method used

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  • SMT jig cleaning liquid and preparation method thereof
  • SMT jig cleaning liquid and preparation method thereof
  • SMT jig cleaning liquid and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] SMT fixture cleaning liquid of the present invention comprises each component of following percentage by weight:

[0034]

[0035] Wherein, the alkali agent is sodium hydroxide, the alcohol amine compound is monoethanolamine, the alcohol ether compound is diethylene glycol monomethyl ether, the surfactant is fatty alcohol polyoxyethylene ether, and the corrosion inhibitor It is sodium metasilicate pentahydrate.

[0036] The above-mentioned SMT fixture cleaning liquid preparation method comprises the following steps:

[0037] S1. Weigh each component according to the above formula, dissolve sodium hydroxide in pure water, and stir until transparent;

[0038] S2, then monoethanolamine and diethylene glycol monomethyl ether are added therein and stirred evenly;

[0039] S3, adding fatty alcohol polyoxyethylene ether into it and stirring until transparent;

[0040] S4. Finally, sodium metasilicate pentahydrate is added therein, stirred evenly and filtered to obtain th...

Embodiment 2

[0042] SMT fixture cleaning liquid of the present invention comprises each component of following percentage by weight:

[0043]

[0044]

[0045] Wherein, the alkali agent is potassium hydroxide, the alcohol amine compound is one isopropanolamine, the alcohol ether compound is triethylene glycol monomethyl ether, and the surfactant is isomerized alcohol polyoxyethylene ether, so The corrosion inhibitor is thiourea.

[0046] The preparation method of described SMT fixture cleaning solution comprises the following steps:

[0047] S1. Weigh each component according to the above formula, dissolve potassium hydroxide in pure water, and stir until transparent;

[0048] S2, then adding monoisopropanolamine and triethylene glycol monomethyl ether and stirring evenly;

[0049] S3, adding isomeric alcohol polyoxyethylene ether and stirring until transparent;

[0050] S4. Finally, thiourea is added therein, stirred evenly and filtered to obtain the finished product.

Embodiment 3

[0052] SMT fixture cleaning liquid of the present invention comprises each component of following percentage by weight:

[0053]

[0054] Wherein, the alkali agent is sodium carbonate, the alcohol amine compound is diglycol amine, the alcohol ether compound is diethylene glycol monobutyl ether, the surfactant is secondary alcohol polyoxyethylene ether, and the corrosion inhibitor The agent is hexamethylenetetramine.

[0055] The preparation method of described SMT fixture cleaning solution comprises the following steps:

[0056] S1. Weigh each component according to the above formula, dissolve sodium carbonate in pure water, and stir until transparent;

[0057] S2, then diglycolamine and diethylene glycol monobutyl ether are added wherein and stirred evenly;

[0058] S3, adding secondary alcohol polyoxyethylene ether and stirring until transparent;

[0059] S4. Finally, hexamethylenetetramine is added therein, stirred evenly and filtered to obtain the finished product. ...

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Abstract

The invention relates to SMT jig cleaning liquid. The SMT jig cleaning liquid contains the following components by weight percent: 1%-5% of an alkaline agent, 5%-20% of an alcohol amine compound, 5%-20% of an alcohol ether compound, 10%-20% of a surfactant, 0.1%-5% of a corrosion inhibitor and the balance of pure water. The SMT jig cleaning liquid has extremely strong cleaning capacity and is capable of well removing polar residues, nonpolar residues and solid particle residues remained on the surface of a jig of an SMT welding furnace, ideal surface cleanliness is provided for the SMT jig, and the smooth implementation of an electronic machining process is guaranteed; the SMT jig cleaning liquid has excellent material compatibility and has no possibility of corroding the SMT jig, so thatthe service life of the jig is prolonged; by utilizing environment-friendly materials, the SMT jig cleaning liquid does not contain a halogen solvent and an aromatic solvent, polluted gas and exhaustgas are not exhausted in the cleaning process, so that the SMT jig cleaning liquid is nontoxic and harmless to a human body and environmentally friendly; and a preparation method is simple, easy to operate, high in product yield and suitable for large-scale popularization and application.

Description

technical field [0001] The invention relates to the technical field of the formula and preparation method of cleaning liquid, in particular to a cleaning liquid for SMT fixtures and a preparation method thereof. Background technique [0002] With the continuous development of surface assembly technology, more and more various pollutants are introduced into the modern electronic manufacturing process, including non-polar pollutants based on rosin, resin and oil; flux active substances and inorganic salts. Polar pollutants; solid particle pollutants. These pollutants must be removed in a timely and effective manner, otherwise it will inevitably affect the smooth implementation of the process or the quality and reliability of the product, and will directly cause leakage, short circuit, open circuit or corrosion on the surface of printed circuit boards and components, resulting in failure. Moreover, as the demand for lead-free products in the electronics manufacturing industry ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C11D1/72C11D1/14C11D1/29C11D1/66C11D1/825C11D3/34C11D3/32C11D3/30C11D3/28C11D3/20C11D3/10C11D3/08C11D3/04C11D3/60
CPCC11D1/14C11D1/29C11D1/667C11D1/72C11D1/825C11D3/044C11D3/08C11D3/10C11D3/2068C11D3/28C11D3/30C11D3/32C11D3/323C11D3/349
Inventor 何国锐莫建强
Owner 东莞市伟思化学科技有限公司