Preparation method of SiC reaction modified PP (polypropylene) thermal conductive composite material

Abstract

The invention relates to a preparation method of an SiC reaction modified PP (polypropylene) thermal conductive composite material. The preparation method comprises the following steps: adding a reaction type flexibilizer into dilute sulphuric acid for full infiltration, and stirring and drying the mixture; dissolving a silane coupling agent in an ethanol solution, stirring and hydrolyzing the silane coupling agent, adding the prepared reaction type flexibilizer powder, stirring the powder in a water bath at 70 DEG C for 3 h, and obtaining modified reaction type flexibilizer powder at the endof the reaction; preparing modified silicon carbide by the same method, fully mixing polypropylene and the modified silicon carbide according to the formula, and adding the silane coupling agent, themodified reaction type flexibilizer and an antioxidant, and blending to obtain a premixed material; and adding the premixed material into a double-screw extruder, performing ultrasonic treatment in anextruding stage, and after the extrusion is completed, obtaining the composite material through steps of cooling and the like. By the adoption of reaction modification, ultrasonic treatment and extrusion flexibilizing technologies, the preparation method solves the problem of non-uniform dispersion of a thermal conductive filler and is favorable for improving the interfacial compatibility of thesilicon carbide and the polypropylene.

Description

technical field

[0001] The invention relates to a method for preparing a heat-conducting composite material, in particular to a method for preparing a SiC reaction-modified PP heat-conducting composite material. Background technique

[0002] With the gradual development of electronic components in the direction of miniaturization, integration, high density and high speed, its heat dissipation has become a very serious problem, and traditional inorganic heat-conducting materials (metals and ceramics, etc.) can no longer meet the current requirements of electronic products. Cooling requirements. Thermally conductive polymer composite materials not only have excellent thermal conductivity, but also have incomparable formability, electrical insulation, corrosion resistance and specific strength that traditional inorganic thermally conductive materials have. hotspot.

[0003] At present, there are two main methods for preparing thermally conductive polymer composite materials: ...

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