Preparation method for electric conduction flake silver-coated copper powder

A technology of flake copper powder and silver-coated copper powder, applied in transportation and packaging, metal processing equipment, coating and other directions, can solve the problems of easy oxidation, high temperature resistance, poor electrical conductivity, etc., and is not easy to be oxidized. , storage stability, good electrical conductivity

Active Publication Date: 2018-11-16
深圳市绚图新材科技有限公司
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AI-Extracted Technical Summary

Problems solved by technology

[0003] At present, the silver-coated copper powder prepared by the method commonly used in the industry has a low silver content, and the silver coated on the surface accumulates in a tree shape,...
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Method used

The first step cleans the copper powder surface with the ethanolic solution of tin protochloride, simultaneously makes tin ion be adsorbed to the copper powder surface, selects ethanol as solvent, can effectively wash off the oily substance on surface, avoids copper and simultaneously Exposure to large areas of water leads to secondary oxidation of the sur...
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Abstract

The invention discloses a preparation method for electric conduction flake silver-coated copper powder. The preparation method comprises the steps that the flake copper powder is washed and activated;crystal points on the surface of the copper powder are formed; silver is subjected to deposition to completely wrap the copper powder; and the silver-coated copper powder is firstly washed with water, then washed with ethyl alcohol and finally dried to prepare the electric conduction flake silver-coated copper powder. Compared with an existing preparing technology, the content of the coated silver powder can be very high, the prepared silver-coated copper powder is even in wrapping, exposure into air is avoided, oxidation is not prone to happening, the electric conduction performance is good,and storage is stable.

Application Domain

Technology Topic

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  • Preparation method for electric conduction flake silver-coated copper powder
  • Preparation method for electric conduction flake silver-coated copper powder

Examples

  • Experimental program(5)

Example Embodiment

[0016] The preparation method of conductive flaky silver-coated copper powder proposed in the present invention uses stannous chloride to activate the copper powder first to form crystal points on its surface and uniformly coat the surface of the flaky copper powder to improve the performance of the flaky copper powder. Conductivity and stability. The main preparation process is:
[0017] The first step is to clean the surface of the copper powder with an ethanol solution of stannous chloride, and at the same time make tin ions adsorb to the surface of the copper powder. Using ethanol as the solvent can effectively wash off the oily substances on the surface and avoid large areas of copper and water. Contact causes secondary oxidation of the surface.
[0018] The second step uses tin ions adsorbed on the surface to form a layer of silver crystal points on the surface of the copper.
[0019] In the third step, the oxidation-reduction reaction continues to deposit silver on the copper surface to form a uniform silver coating on the copper surface.
[0020] In the fourth step, the silver-coated copper powder is first washed with water, then washed with ethanol, and finally dried.

Example Embodiment

[0021] Example 1
[0022] The first step: cleaning and activation of copper surface
[0023] Add 20 g of flake copper powder to the cleaning solution and stir for 20 minutes. After removing the oxide layer and oily substances on the surface of the flaky copper powder, it is filtered, the filter cake is added to the reactor, and then the organic amine aqueous solution is added to the reactor once, and the mixture is stirred evenly.
[0024] Wherein, the cleaning solution is obtained by adding 1 g of stannous chloride to 130 ml of ethanol and stirring uniformly. The primary organic amine aqueous solution is formed by mixing 75 ml of deionized (DI) water and 1 g of tetraethylenepentamine.
[0025] Step 2: Formation of crystal points on the copper surface
[0026] 0.2 g of gum arabic is added to the secondary organic amine aqueous solution to obtain a mixed solution, and then the mixed solution is added to the reaction kettle. The silver nitrate solution was added dropwise to the reaction kettle, the reaction was continued at room temperature for 30 minutes, and then filtered, washed with DI water four times, and 350 ml of DI water was added to the filter cake.
[0027] Wherein, the secondary organic amine aqueous solution is formed by mixing 200 ml of water and 5 g of tetraethylenepentamine. The silver nitrate solution is made by dissolving 2 g of silver nitrate in 20 ml of deionized (DI) water.
[0028] Step 3: Silver deposition
[0029] The reaction kettle containing the washed flake copper powder was heated to 70°C, and the silver ammonia solution and the reducing solution solution were added dropwise in about 90 minutes. After the addition, the reaction was continued for 30 minutes to make the reducing agent solution The silver solution reacts with the flake copper powder and is completely coated to obtain a silver-coated copper paste, which is filtered after the reaction.
[0030] Among them, the silver ammonia solution is obtained by dissolving 8g silver nitrate into 40g DI water, adding ammonia water to make the solution transparent and clear; the reducing solution solution is obtained by dissolving 10g glucose in 90ml DI water.
[0031] Step 4: Wash the silver-coated copper slurry filter cake twice with DI water, and then rinse twice with ethanol, and dry in a vacuum oven to obtain conductive flake-shaped silver-coated copper powder.

Example Embodiment

[0032] Example 2
[0033] The first step: cleaning and activation of copper surface
[0034] Add 20 g of flake copper powder to the cleaning solution and stir for 20 minutes. After removing the oxide layer and oily substances on the surface of the flaky copper powder, it is filtered, the filter cake is added to the reactor, and then the organic amine aqueous solution is added to the reactor once, and the mixture is stirred evenly.
[0035] Wherein, the cleaning solution is obtained by adding 1 g of stannous chloride to 130 ml of ethanol and stirring uniformly. The primary organic amine aqueous solution is formed by mixing 75 ml of deionized (DI) water and 1 g of tetraethylenepentamine.
[0036] Step 2: Formation of crystal points on the copper surface
[0037] 0.2 g of gum arabic is added to the secondary organic amine aqueous solution to obtain a mixed solution, and then the mixed solution is added to the reaction kettle. The silver nitrate solution was added dropwise to the reaction kettle, the reaction was continued at room temperature for 30 minutes, and then filtered, washed with DI water four times, and 350 ml of DI water was added to the filter cake.
[0038] Wherein, the secondary organic amine aqueous solution is formed by mixing 200 ml of water and 5 g of tetraethylenepentamine. The silver nitrate solution is made by dissolving 2 g of silver nitrate in 20 ml of deionized (DI) water.
[0039] Step 3: Silver deposition
[0040] The reaction kettle containing the washed flake copper powder was heated to 70°C, and the silver ammonia solution and the reducing solution solution were added dropwise in about 90 minutes. After the addition, the reaction was continued for 30 minutes to make the reducing agent solution The silver solution reacts with the flake copper powder and is completely coated to obtain a silver-coated copper paste, which is filtered after the reaction.
[0041] Among them, the silver ammonia solution is obtained by dissolving 3g silver nitrate into 17g DI water, adding ammonia water to make the solution transparent and clear; the reducing solution solution is obtained by dissolving 5g glucose in 70ml DI water.
[0042] Step 4: Wash the silver-coated copper slurry filter cake twice with DI water, and then rinse twice with ethanol, and dry in a vacuum oven to obtain conductive flake-shaped silver-coated copper powder.
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Description & Claims & Application Information

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