Degreasing-sintering integrated production method of ITO target

Abstract

The invention discloses a degreasing-sintering integrated production method of an ITO target. The production method comprises the following steps: 1) mixing ITO powder, a dispersing agent and water, performing ball milling, adding a binder, and performing ultrasonic and vacuum defoaming to obtain slurry; 2) injecting the slurry into a mold, molding to obtain a target blank, demolding, and drying the target blank; and 3) placing the target blank on a load bearing board in a degreasing-sintering integrated furnace, and carrying out programmed heating and programmed cooling, so as to obtain the ITO target. In the process of densification of the target blank, the target billet is directly heated from the highest temperature of degreasing to perform sintering at a higher temperature, and a process of cooling, transferring and reheating the target blank after degreasing is omitted, so that the efficiency of degreasing and sintering is remarkably improved, the cracking caused by the transferof the target blank between a degreasing furnace and a sintering furnace is eliminated, the production effectiveness is improved, and the mass production of ITO targets is facilitated.

Description

technical field [0001] The invention relates to a degreasing-sintering integrated method for producing ITO targets. Background technique [0002] The ITO target is a sintered body of N-type oxide semiconductor indium tin oxide, which is the key material for preparing ITO thin films. The ITO film obtained by magnetron sputtering with an ITO target has excellent light transmission and conductivity, and has excellent processing performance, high hardness, wear resistance and corrosion resistance. , solar cells, automotive heat and defogging glass and other fields have been widely used. [0003] The ITO target needs to be densified during the production process, and the finally obtained ITO target has high density. Most of the existing processes realize the densification of the ITO target blank by degreasing and sintering the target material, and the degreasing and sintering are carried out independently, which has the following two disadvantages: 1) Long time-consuming and lo...

AI Technical Summary

Problems solved by technology

Most of the existing processes realize the densification of the ITO target blank by degreasing and sintering the target material, and the degreasing and sintering are carried out independently, which has the following two disadvantages: 1) Long time-consuming and low production efficiency: it needs to be processed first The good target blank is transported into the degreasing furnace for heating and degreasing (about 2 days). After the temperature of the debinding furnace drops from the debinding working temperature to room temperature (at least 4 days), the target blank is transported from the debinding furnace to the sintering furnace for sintering (about 2 days). 5 days); 2) Low yield: The mechanical strength of the target blank is greatly reduced after degreasing, and it is easy to crack due to uneven heating during the cooling process, and the target blank is also easily shaken and cracked during the process of transporting the target blank from the degreasing furnace to the sintering furnace

For example: CN 102173817 A discloses a method for preparing an ITO target material. The ITO powder is directly molded and cold-pressed to obtain a target blank without adding a binder, so it is not necessary to degrease the target blank and just sinter it directly. Due to the low plasticity of ITO powder, the target blank is prone to defects such as delamination or cracking, and the yield is low