An electroless copper plating solution
A technology of electroless copper plating and divalent copper, which is applied in the direction of liquid chemical plating, electrical connection formation of printing components, coating, etc., can solve problems such as surface roughness, unevenness, copper foil cracks, etc., to reduce surface roughness, The effect of small holes and improving brightness
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Embodiment 1
[0061] The present embodiment provides a kind of electroless copper plating liquid, by mass concentration, comprises following component:
[0062] Copper sulfate pentahydrate 10g / L, nickel sulfate hexahydrate 8g / L, formaldehyde 3g / L, potassium sodium tartrate 80g / L, thiourea 0.01g / L, bipyridyl 0.0001g / L and pH regulator;
[0063] Wherein, the solvent is deionized water, the pH regulator is sodium hydroxide, and the pH of the solution is 12.0.
[0064] Respectively put the rolled copper foil PCB board, electrolytic copper foil PCB board, FR4 resin board and PCB board with through holes (there are exposed glass fibers on the hole wall) after necessary pretreatment, and place them in the electroless plating provided in this embodiment. Apply plating 6min in copper liquid, form chemical copper deposition layer, clean, dry, then observe surface topography with scanning electron microscope (SEM), the result is respectively as follows Figure 1a-Figure 1d shown. Continue to electro...
Embodiment 2
[0075] The present embodiment provides a kind of electroless copper plating liquid, by mass concentration, comprises following component:
[0076] Copper sulfate pentahydrate 8g / L, nickel sulfate hexahydrate 1g / L, formaldehyde 5g / L, disodium edetate 40g / L, thiourea 0.0002g / L, 2-mercaptobenzothiazole 0.01g / L and pH regulator;
[0077] Wherein, the solvent is deionized water, the pH regulator is sodium hydroxide, and the pH of the solution is 11.8.
[0078] According to the method of embodiment 1, the electroless copper plating solution provided by this embodiment is used to form an electroless copper deposition layer on the surface of rolled copper and electrolytic copper respectively, wherein, the surface morphology of the electroless copper deposition layer of rolled copper is as follows Figure 4a shown. Continue to electroplate copper on the surface of the electroless copper deposition layer of rolled copper and electrolytic copper, and the surface morphology of the elect...
Embodiment 3
[0085] The present embodiment provides a kind of electroless copper plating liquid, by mass concentration, comprises following component:
[0086] Copper sulfate pentahydrate 6g / L, nickel sulfate hexahydrate 10g / L, formaldehyde 13g / L, sodium citrate 65g / L, bipyridyl 0.001g / L, 2-mercaptobenzothiazole 0.005g / L and pH regulator;
[0087] Wherein, the solvent is deionized water, the pH regulator is sodium hydroxide, and the pH of the solution is 12.5.
[0088] According to the method of embodiment 1, the electroless copper plating solution provided by this embodiment is used to form an electroless copper deposition layer on the surface of rolled copper and electrolytic copper respectively, wherein, the surface morphology of the electroless copper deposition layer of rolled copper is as follows Figure 6a shown. Continue to electroplate copper on the surface of the electroless copper deposition layer of rolled copper and electrolytic copper, and the surface morphology of the elect...
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