A Longitudinal Gradient Bandgap Distribution Al and Fe Co-doped Ga 2 o 3 film production method
A gradient distribution and co-doping technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of unstable electrical performance, uneven electric field distribution, large leakage current, etc., and achieve superior performance, wide application range, thin film dense effect
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Embodiment 1
[0055] This embodiment provides a longitudinal gradient distribution of bandgap Al and Fe co-doped Ga 2 o 3 The preparation method of thin film, comprises the following steps:
[0056] 1) With the cleaned c-plane sapphire as the substrate, a layer of Ga was first deposited on the substrate by laser molecular beam epitaxy 2 o 3 ultra-thin layer, and then deposited a layer of Fe2 o 3 Ultra-thin layer, deposited Ga 2 o 3 with Fe 2 o 3 The number of laser pulses for the ultra-thin layer is selected: 200 / 20, 200 / 40, 200 / 60, 200 / 80, 200 / 100; alternate growth, so cycle 20 times;
[0057] Among them, the specific conditions for laser molecular beam epitaxy are: the background vacuum is 1×10 -6 Pa, substrate temperature is 750℃, oxygen pressure is 5×10 -1 Pa, the laser energy is 400mJ, the laser pulse frequency is 1Hz, and the distance between the target and the substrate is 4.5cm;
[0058] 2) Deposit Ga 2 o 3 and Fe 2 o 3 After the ultra-thin layer, in-situ annealing at...
Embodiment 2
[0065] This embodiment provides a longitudinal gradient distribution of bandgap Al and Fe co-doped Ga 2 o 3 The preparation method of thin film, comprises the following steps:
[0066] 1) With the cleaned c-plane sapphire as the substrate, a layer of Ga was first deposited on the substrate by laser molecular beam epitaxy 2 o 3 ultra-thin layer, and then deposited a layer of Fe 2 o 3 Ultra-thin layer, deposited Ga 2 o 3 with Fe 2 o 3 The number of laser pulses for the ultra-thin layer is selected: 100 / 30 alternate growth, so that the cycle is 100 cycles;
[0067] Among them, the specific conditions for laser molecular beam epitaxy are: the background vacuum is 1×10 -6 Pa, substrate temperature is 750℃, oxygen pressure is 5×10 -1 Pa, the laser energy is 400mJ, the laser pulse frequency is 1Hz, and the distance between the target and the substrate is 4.5cm;
[0068] 2) Deposit Ga 2 o 3 and Fe 2 o 3 After the ultra-thin layer, in-situ annealing at 750 °C for 30 min...
Embodiment 3
[0071] This embodiment provides a longitudinal gradient distribution of bandgap Al and Fe co-doped Ga 2 o 3 The difference between the method of making the film and Example 2 is that the annealing temperature in step 3) is 800°C.
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