Light-emitting element reception package, light-emitting device and lighting device

A technology of light-emitting elements and light-emitting devices, which is applied in the direction of electrical components, semiconductor devices, and electric solid-state devices, and can solve problems such as unavailable, light-emitting wavelength deviation, and reduced efficiency, so as to suppress the reduction of luminous efficiency and improve light output or brightness. , The effect of improving the wavelength conversion efficiency

Inactive Publication Date: 2005-05-04
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the light-emitting device of the third prior art, if the current value input to the light-emitting element 35 is further increased in order to increase the intensity of radiated light, the luminous intensity of the light-emitting element 35 is proportional to the current value and does not increase, which is easy. The problem of deviation and the inability to obtain a stable radiation intensity
[0026] More specifically, if the current value input to the light-emitting element 35 is further increased in order to increase the radiation intensity, the junction temperature (junction temperature) of the light-emitting element 35 rises, and the luminous efficiency of the light-emitting element 35 decreases remarkably, so there is no possibility of Get the radiation intensity proportional to the input current
In addition, there is a problem that stable radiation intensity cannot be obtained due to variations in emission wavelengths that are expected to be caused by heat.
[0027] In addition, in the transparent resin 33 containing the phosphor 34 that covers the light-emitting element 35 and converts the wavelength of light from the light-emitting element 35, if the content of the phosphor 34 is increased to improve the efficiency of wavelength conversion, the The wavelength-converted light by the phosphor 34 is easily disturbed by other phosphors 34, so there is a problem that the radiation intensity cannot be increased.
[0028] On the other hand, if the content of the phosphor 34 is reduced, the efficiency of wavelength conversion is reduced, and light of a desired wavelength cannot be obtained. As a result, there is a problem that the radiation intensity cannot be increased.
[0029] In addition, the heat generated from the light-emitting element 35 is transferred in the base body 31, and is easily transferred to the reflective member 32. Due to the thermal expansion difference between the reflective member 32 and the base body 31, the reflective member 32 is thermally expanded and deformed, and the radiation angle is deviated or the radiation intensity is reduced. The problem

Method used

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  • Light-emitting element reception package, light-emitting device and lighting device
  • Light-emitting element reception package, light-emitting device and lighting device
  • Light-emitting element reception package, light-emitting device and lighting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0274] Examples of the light emitting device 41 according to the first embodiment of the present invention will be shown below.

[0275] First, an alumina ceramic matrix composed of crystal grains of various grain sizes to be the matrix 42 is prepared. Also, wiring conductors for electrically connecting the light emitting element 44 and an external circuit board via internal wiring formed inside the base body 42 are formed around the placement portion 42a where the light emitting element 44 is placed. Moreover, the metallization layer of the wiring conductor on the substrate 42 made of Mo-Mn powder is shaped into a circular pad with a diameter of 0.1 mm, and its surface is sequentially coated with a Ni plating layer with a thickness of 3 μm and an Au plating layer with a thickness of 2 μm. In addition, the internal wiring inside the base body 42 is formed by an electrical connection portion constituted by a through-conductor, a so-called through-hole. The via holes are also m...

Embodiment 2

[0282] Next, a light-emitting device 41 having the same structure as that of the above-mentioned example and in which the average grain size of the ceramic crystal grains after sintering of the substrate 42 is 1 (μm), 5 (μm), and 10 (μm) was produced, and the relative light emission to the direction was measured. The full beam (light output) of the load current of the element 44. Furthermore, the light-emitting device 41 was installed in heat radiation equipment with the same cooling function everywhere, and the light output was measured with an integrating sphere. The result is as Figure 7 shown.

[0283] Such as Figure 27 As shown, when the rated current of the load current to the light-emitting element 44 is 20 (mA) and the rated voltage is 3.4 (V), the light emission of the light-emitting device 41 with the average grain size of ceramic crystal grains being 1 (μm) The output was 0.96 (lm), and the luminous efficiency was 14 (lm / W). In addition, the light output of th...

Embodiment 3

[0288] according to Figure 7 , for the light emitting device 60C of the sixth embodiment of the present invention, examples are shown below.

[0289] First, an alumina ceramic substrate to be the base body 61 is prepared. Furthermore, the base 61 is integrally formed with the convex portion 61b having the seating portion 61a, and the upper surface of the seating portion 61a is parallel to the upper surface of the base 61 at a location other than the seating portion 61a.

[0290] The base body 61 has a cylindrical convex portion 61b having a diameter of 0.4mm×thickness (various values) formed on the upper central portion of a cylindrical plate having a diameter of 0.8mm×thickness 0.5mm.

[0291] In addition, an electrical connection pattern for electrically connecting the light emitting element 65 and an external circuit board through internal wiring formed inside the base body 61 is formed on the mounting portion 61a of the convex portion 61b where the light emitting element...

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PUM

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Abstract

The package has a base body (51) with a mounting portion for mounting a light-emitting unit. A frame body is joined to an outer edge of the body (51) to surround the portion. A wiring conductor has its one end formed on an upper surface of the base body, to electrically connect an electrode of the light emitting unit. The light transmitting unit (53) is inside the frame body to cover the light emitting unit. - Independent claims are also included for the following: - (A) a light-emitting apparatus comprising a package for housing a light emitting unit - (B) an illumination apparatus constructed by setting up a light-emitting apparatus in a predetermined arrangement.

Description

technical field [0001] The present invention relates to a package for housing a light-emitting element, a light-emitting device, and a lighting device for housing a light-emitting element, and also relates to a package for housing a light-emitting element, a light-emitting device, and lighting fixtures. Background technique [0002] exist Figure 31 In the figure, a plurality of phosphors (not shown) that fluoresce in red, green, blue, and yellow, etc., convert light such as near-ultraviolet light and blue light emitted from a light-emitting element 14 such as a light-emitting diode (LED) A light-emitting device of the first prior art that performs wavelength conversion and further emits white light. exist Figure 31 Among them, the light-emitting device 11 is mainly composed of a base 12 made of an insulator, a frame-shaped frame 13 , a translucent member 15 , and a light-emitting element 14 . The base body 12 has a mounting portion 12a for mounting the light emitting ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L21/56
CPCH01L33/00H01L2224/13H01L2224/48091H01L2224/73265H01L2224/45144H01L33/483H01L33/504H01L2924/00014H01L2924/00
Inventor 浦谷贡作本大辅三宅彻关根史明柳泽美津夫森裕树柴山博司松浦真吾
Owner KYOCERA CORP
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