Electroplating wastewater repair agent for circuit board electroplating

Abstract

The invention discloses an electroplating wastewater repair agent for circuit board electroplating. The electroplating wastewater repair agent for the circuit board electroplating is characterized bybeing composed of the following ingredients in parts by mass: 40-60 parts of bentonite, 3-7 parts of ethylenediaminetetraacetic acid disodium salt, 10-20 parts of sodium sulfide, 3-8 parts of ferroussulfate, 5-15 parts of sodium metabisulfite, 2-9 parts of ethanol, 2-8 parts of citric acid, 2-5 parts of polyethylene copolymers, 10-20 parts of walnut shell powder, 5-15 parts of iron powder, 12-18parts of bran, 3-8 parts of shell powder, and 10-20 parts of active nanometer carbon powder. The electroplating wastewater repair agent for the circuit board electroplating disclosed by the inventioncomprises the bentonite, the walnut shell powder, the iron powder, the bran, the shell powder and the active nanometer carbon powder; and the iron powder is added in a small amount while the walnut shell powder, the bran and the shell powder are added in relatively large amounts so that the repair agent is rapid in reaction rate and high in reaction efficiency, and thus, a large amount of iron powder is saved with cost of electroplating wastewater treatment reduced. In addition, the ethanol and the citric acid are added, so that the repair agent is capable of improving bacterium resistance ofthe electroplating wastewater.

Description

technical field [0001] The invention belongs to the technical field of electroplating sewage treatment, and in particular relates to an electroplating sewage restoration agent for circuit board electroplating. Background technique [0002] At present, in the electroplating process of printed circuit boards, the metal is electrolytically plated on the surface of the product, and a large amount of waste water will be generated during the electroplating process. There are many types of highly toxic substances contained in the waste water, and its harmfulness is very big. Untreated electroplating wastewater discharged into rivers and ponds and seeped into the ground will not only endanger the environment, but also pollute drinking water and industrial water. Electroplating wastewater contains heavy metal ions such as chromium, zinc, copper, cadmium, lead, nickel, and highly toxic sundries such as acid and alkali cyanide, and some are highly toxic substances that cause cancer an...

AI Technical Summary

Problems solved by technology

[0003] The existing repairing agent for electroplating wastewater applied to circuit boards has poor repairing ability for electroplating wastewater, slow response, long repair time, and low repair efficiency. The content of heavy metals after treatment still does not meet the discharge requirements, and A lot of iron powder was wasted in the process