Ultrahigh-speed cooling and rewarming method and ultrahigh-speed cooling and rewarming device
An ultra-high-speed, chip technology, applied in the field of biomedicine, can solve the problems that the processing results depend on the experience and technology of the operator, the uniformity of cooling inside the sample cannot be guaranteed, and it is difficult to ensure standardization and consistency, so as to achieve process consistency and surface Uniform heat transfer efficiency and good consistency
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[0033] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0034] Such as figure 1 As shown, the ultra-high-speed cooling and reheating device in this embodiment includes a chip assembly 1 and an outer box 2 . The chip assembly 1 is formed by laser welding of chips 1a and 1b, such as figure 2 As shown, the thickness of 1a is 1 mm, and the thickness of 1b is 1.5 mm, and the materials are all copper. One side of the chip 1a is engraved with a parallel microchannel array, the channel depth is 0.75 mm, the width is 0.25 mm, and the channel wall thickness is 0.25 mm; one side of the chip 1b is engraved with the same microchannel array, and the other side is ...
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