Wafer thinning grinding wheel and preparation method thereof

Abstract

The invention belongs to the technical field of wafer processing, and particularly relates to a wafer thinning grinding wheel and a preparation method thereof. The thinning grinding wheel comprises, by volume part, 12-18 parts of diamond, 3-7 parts of silicon carbide, 2-5 parts of hexagonal boron nitride, 6-10 parts of foaming agent, 35-45 parts of polyimide resin and 2-5 parts of coupling agent.The low-density thinning grinding wheel is prepared, at certain strength, the overall grinding material layer hardness is reduced, pressure stress in the grinding process is reduced, and therefore thedamage layer thickness is reduced, and the wafer thinning grinding wheel is especially suitable for wafer thinning and old operation equipment in the 3D packaging technology of thin wafers. The prepared grinding wheel can effectively reduce a wafer damage layer and cracks, and the yield is guaranteed.

Description

technical field The invention belongs to the technical field of wafer processing, and in particular relates to a low-density wafer thinning grinding wheel and a preparation method thereof. Background technique Silicon single crystal is widely used in the integrated circuit and photovoltaic industry. The integrated circuit uses semiconductor manufacturing technology to produce components such as transistors and capacitors on a small single crystal silicon chip, and according to multi-layer wiring or tunnel Wiring eventually forms a complete electronic circuit. Grinding is an essential part of the silicon crystal machining process. On the one hand, the current electronic products continue to develop in the direction of small, light, and thin, and on the other hand, they continue to develop in the integration of system integration and complete functions. In recent years, with the demand for other products such as ultra-thin mobile phones, Wafer packaging is gradually developi...

AI Technical Summary

Problems solved by technology

However, this patent is mainly used for the grinding of conventional base wafers. For the 3D packaging technology of electronic product chips, the base wafer is required to be very thin. The grinding wheel of this invention is not suitable for this special wafer grinding process.

There is no relevant report on the grinding wheel for wafer thinning in the 3D packaging technology of electronic product chips. Therefore, for the existing technology, there is a need for further improvement.

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