Multilayer insulation thermal interface material and preparation method thereof

A technology of thermal interface material and insulating heat-conducting layer, which is applied in the direction of chemical instruments and methods, lamination, layered products, etc., can solve the problems that the heat dissipation effect cannot meet the actual application, poor thermal conductivity, etc., and achieve favorable thermal conductivity , Excellent thermal conductivity, simple equipment effect

Inactive Publication Date: 2018-12-07
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the thermal interface materials prepared by these methods have excellent insulation properties, they all have poor thermal conductivity, and the thermal conductivity is generally only 0.5-1.5W m -1 K -1 , the heat dissipation effect cannot meet the practical application

Method used

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  • Multilayer insulation thermal interface material and preparation method thereof
  • Multilayer insulation thermal interface material and preparation method thereof
  • Multilayer insulation thermal interface material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4

[0038] A multi-layer insulating silica gel / boron nitride / graphene nanosheet insulating thermal interface material, which is prepared according to the following steps:

[0039] (1) 100g silicone rubber and 2g diisopropylaniline peroxide, 5g fumed silica and 2g dimethylsiloxane oligomer are uniformly mixed at room temperature by a two-roll mill to obtain a rubber compound, wherein The silicone rubber is made of low compression set silicone rubber with a vinyl molar fraction of 0.25%; then weigh 50g of boron nitride and 50g of graphene nanosheets and add them to the mixed rubber to prepare the blended rubber white material and the blended rubber black material;

[0040] (2) According to the size of the mold, take an appropriate amount of mixed rubber on the mold and put it into a flat vulcanizing machine, first cold press it at room temperature 10MPa for 1 minute, and exhaust it three times to avoid air bubbles inside the sample; use figure 1 The preparation process of the multi...

Embodiment 5～10

[0048] A kind of multi-layer insulating silica gel / aluminum oxide / graphite thermal interface material, its preparation is carried out according to the following steps:

[0049] (1) 100g of silicone rubber, 1g of 2,5-dimethyl-2,5-bis(tert-butyl peroxide) hexane and 5g of dimethylsiloxane oligomer were passed through a double-roller mill Mix evenly under room temperature; Wherein silicon rubber selects the low hardness methyl vinyl silicone rubber of 0.10% vinyl molar fraction for use; Then take 50g aluminum oxide or 100g graphite and join in the mixed rubber to make mixed rubber white material and Mixed rubber black material;

[0050] (2) Take an appropriate amount of mixed rubber on the mold and put it into a flat vulcanizing machine, first cold press it at room temperature 10MPa for 1 minute, and exhaust it three times to avoid air bubbles inside the sample; use figure 1 The preparation process of the multilayer insulating thermal interface material shown in the figure produ...

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Abstract

The invention belongs to the technical field of high molecular materials and particularly relates to a multilayer insulation thermal interface material and a preparation method thereof. The multilayerinsulation thermal interface material is an interface material which is formed through alternate distribution of insulation heat conduction layers and conductive heat conduction layers and is of a multilayer structure, wherein the insulation heat conduction layers are prepared by filling a ceramic-base heat conduction filler with silicone rubber, and the conductive heat conduction layers are prepared by filling a carbon-base heat conduction filler with silicone rubber; and the multilayer structure comprises 2n layers, and n is more than or equal to 1. The insulation thermal interface materialhas the multilayer structure, relatively high heat conductivity coefficient (reaching 6W/mK-11W/mK) and excellent electrical insulating property (volume resistivity reaches 10<11>ohmcm-10<13>ohmcm),disruptive strength (5KV/mm-9KV/mm) and mechanical property.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and specifically refers to a multilayer insulating thermal interface material and a preparation method thereof. Background technique [0002] In the field of electronic components and integrated electrical appliances, due to the rapid development of various technologies and the increasing integration of various electronic components, the heat required to be removed also increases, and the requirements for heat dissipation capabilities are also increasing. high. In the field of electronic appliances, insulating thermal interface materials are more popular than non-insulating thermal interface materials, because they can effectively transfer the heat generated by various electronic devices without causing short circuits of the devices. [0003] Thermal interface materials are generally prepared by adding highly thermally conductive fillers to polymers. Thermally conductive fillers can be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B25/20B32B25/04B32B37/10C08L83/04C08K5/14C08K3/36
CPCC08L83/04B32B25/042B32B25/20B32B37/10C08L2205/025B32B2307/302B32B2307/206B32B2307/202C08K5/14C08K3/36
Inventor 杨伟冯昌平白露包睿莹刘正英杨鸣波
Owner SICHUAN UNIV
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