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A kind of halogen-free resin composition and flexible copper-clad laminate prepared therefrom

A technology of resin composition and mixture, which is applied in the direction of epoxy resin glue, synthetic resin layered products, adhesive types, etc., and can solve the problems that flexible copper clad laminates cannot meet technical requirements, etc.

Active Publication Date: 2020-07-07
湖北恒驰电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Flexible copper clad laminates prepared with CTBN toughened modified epoxy resin compositions are clearly unable to meet increasingly stringent technical requirements

Method used

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  • A kind of halogen-free resin composition and flexible copper-clad laminate prepared therefrom
  • A kind of halogen-free resin composition and flexible copper-clad laminate prepared therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] 1. Halogen-free resin composition

[0036] 1. The halogen-free resin composition includes 5 parts of polyurethane modified epoxy resin (HyPox UA10), 20 parts of phenolic novolak epoxy resin, 40 parts of polyurethane and polyamide block copolymer, 10 parts of MQ resin, dicyandiamide 5 parts of amine, 0.2 part of 2-methylimidazole, 15 parts of phosphorus-containing flame retardant SPB-1001.

[0037] 2. The amine value of the polyurethane and polyamide block copolymer is 12mgKOH / g, wherein the number average molecular weight of the polyurethane segment is 1500, and the glass transition temperature Tg is -40°C; the number average molecular weight of the polyamide segment is 3000, the glass transition temperature Tg is 10°C; polyamide segments account for 60% of the total moles of polyurethane and polyamide segments in the copolymer, and polyurethane segments account for 40% of the total moles of polyurethane and polyamide segments in the copolymer %.

[0038] 3. Dissolvin...

Embodiment 2

[0042] 1. Halogen-free resin composition

[0043] 1. The halogen-free resin composition includes 7 parts of polyurethane modified epoxy resin (HyPox UA11), 25 parts of bisphenol A novolac epoxy resin, 45 parts of polyurethane and polyamide block copolymer, 12 parts of MQ resin, 5 parts of m-phenylenediamine, 0.3 parts of 2-undecylimidazole, and 18 parts of phosphorus-containing flame retardant (OP-935).

[0044] 2. The amine value of the polyurethane and polyamide block copolymer is 15mgKOH / g, wherein the number average molecular weight of the polyurethane segment is 1800, and the glass transition temperature Tg is -35°C; the number average molecular weight of the polyamide segment is 3500, the glass transition temperature Tg is 15°C; polyamide segments account for 70% of the total moles of polyurethane and polyamide segments in the copolymer, and polyurethane segments account for 30% of the total moles of polyurethane and polyamide segments in the copolymer %.

[0045] 3. D...

Embodiment 3

[0049] 1. Halogen-free resin composition

[0050] 1. The halogen-free resin composition includes 9 parts of polyurethane modified epoxy resin (NPER-133L), 28 parts of o-cresol novolac epoxy resin, 55 parts of polyurethane and polyamide block copolymer, 17 parts of MQ resin, 8 parts of 4,4'-diaminodiphenylsulfone, 0.5 parts of 2-phenylimidazole, and 20 parts of phosphorus-containing flame retardant (OP-930).

[0051] 2. The amine value of the polyurethane and polyamide block copolymer is 18mgKOH / g, wherein the number average molecular weight of the polyurethane segment is 2200, and the glass transition temperature Tg is -20°C; the number average molecular weight of the polyamide segment is 4500, the glass transition temperature Tg is 20°C; polyamide segments account for 80% of the total moles of polyurethane and polyamide segments in the copolymer, and polyurethane segments account for 20% of the total moles of polyurethane and polyamide segments in the copolymer %.

[0052] ...

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Abstract

The invention discloses a halogen-free resin composition. The halogen-free resin composition comprises the following components dispersing in an organic solvent, by weight: 5-10 parts of polyurethanemodified epoxy resin, 20-30 parts of multifunctional epoxy resin, 40-60 parts of a polyurethane and polyamide block copolymer, 10-20 parts of MQ resin, 5-10 parts of a curing agent, 0.2-0.5 part of acuring accelerator, and 15-20 parts of a phosphorus-containing flame retardant. The invention also discloses a flexible copper clad laminate prepared by using the halogen-free resin composition. The flexible copper clad laminate has excellent flexibility and folding resistance, low ion content, no dendritic crystallization during an ion migration test and good insulation property. Moreover, sincea toughening agent does not contain a saturated double bond, the flexible copper clad laminate has excellent aging resistance and can be applied in the field of high reliability requirements.

Description

technical field [0001] The invention relates to the field of polymer composite material manufacturing, in particular to a halogen-free resin composition and a flexible copper-clad laminate prepared therefrom. Background technique [0002] Flexible copper-clad laminate refers to a bendable sheet-like composite material made of insulating base film covered with copper foil. It is a large category of copper-clad laminates second only to rigid copper-clad laminates. In addition to the three major functions of insulation, mechanical support, flexible copper clad laminates can be bent, either statically or dynamically, which is very suitable for three-dimensional space installation. In recent years, the lightness, thinness and miniaturization of electronic products have directly promoted the rapid development of flexible copper clad laminates. [0003] At present, the common adhesives in adhesive flexible copper-clad laminates are mainly epoxy adhesives, and the epoxy adhesives u...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L77/06C08L75/08C08L83/08C09J163/00C09J177/06C09J175/08C09J183/08B32B15/08B32B15/20B32B27/28B32B33/00
CPCB32B15/08B32B15/20B32B27/281B32B33/00B32B2255/10B32B2255/26C08L63/00C08L2201/22C08L2205/035C09J163/00C08L77/06C08L75/08C08L83/08
Inventor 余鹏飞
Owner 湖北恒驰电子科技有限公司
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