Cutting fluid of solar silicon wafer and preparation method thereof

Abstract

The invention discloses a cutting fluid of a solar silicon wafer. The cutting fluid is prepared from the following raw materials in parts by weight: 20-50 parts of water-based polyether, 30-60 parts of polyethylene glycol with molecular weight of 400, 2-5 parts of alkylphenol ethoxylates, 16-19 parts of tall oil triethanolamine ester, 14-17 parts of polymaleic anhydride with molecular weight of 600, 3.4-6.4 parts of tetramethyl sodium hydroxide (25% aqueous solution), 0.2-0.5 part of methyl-silicone de-foaming agent, 5-8 parts of triethanolamine borate, 0.8-1.1 parts of bactericide and 8.6-11.6 parts of deionized water. The cutting fluid of the solar silicon wafer has the advantages of environmental protection and high efficiency, generates no bubble, has small self-loss, can increase thecutting quality and has a long use period.

Description

technical field [0001] The invention relates to the technical field of cutting fluid, in particular to a solar silicon chip cutting fluid and a preparation method thereof. Background technique [0002] With the increasingly prominent problems of global energy shortage and environmental pollution, solar photovoltaic power generation has become an emerging industry that is generally concerned and focused on development by countries all over the world because of its cleanness, safety, convenience, and high efficiency. , silicon wafer cutting fluid is an auxiliary consumable product that must be used in the silicon wafer cutting process, and its consumption is also expanding with the growth of the photovoltaic solar energy industry and China's silicon wafer processing industry. Cooling, suspending, dispersing, lubricating and other multiple functions. [0003] However, the existing common cutting fluids cannot have both environmental protection and cutting efficiency. The use e...

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Problems solved by technology

[0003] However, the existing ordinary cutting fluids cannot have both environmental protection and cutting efficiency. The use effect is not good, the loss is large during the cutting process, and foam is easily generated in high-speed friction, which affects the cutting quality, and the use cycle is short.