Anti-aging epoxy resin based packaging glue and preparation method thereof

A technology of epoxy resin and encapsulant, applied in the direction of epoxy resin, adhesive, adhesive type, etc., can solve the problems affecting the light transmittance of encapsulant, poor anti-aging performance of encapsulant, etc., and achieve excellent anti-aging properties , Improve the effect of anti-aging performance and good light transmittance

Inactive Publication Date: 2018-12-11
ANHUI NIKOLA ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the existing encapsulation adhesive has poor anti-aging performance, and the light transmittance of the encapsulation adhesive is easily affected under long-term ultraviolet irradiation, and a kind of anti-aging epoxy resin-based encapsulation adhesive and its preparation method are proposed

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A kind of anti-aging epoxy resin-based encapsulant that the present invention proposes, comprises the raw material of following weight part:

[0022] 80 parts of epoxy resin, 10 parts of isoprene-styrene copolymer, 3 parts of hexamethyldisilazane, 0.1 part of zingerone, 0.05 part of 2-D-bromoglucopyranose-tetrabenzyl ester , 1 part of sodium pyrophosphate, 0.5 part of glyceryl tristearate, 0.2 part of diaminocyclohexane, 1 part of trimethylhexamethylenediamine;

[0023] Its preparation method comprises the following steps:

[0024] S1, according to 80 parts of epoxy resin, 10 parts of isoprene-styrene copolymer, 3 parts of hexamethyldisilazane, 0.1 part of zingerone, 2-D-bromoglucopyranose-tetrabenzyl 0.05 part of ester, 1 part of sodium pyrophosphate, 0.5 part of glyceryl tristearate, 0.2 part of diaminocyclohexane, 1 part of trimethylhexamethylenediamine Weigh each raw material and set aside;

[0025] S2. Mix the zingerone and 2-D-bromoglucopyranose-tetrabenzyl este...

Embodiment 2

[0028] A kind of anti-aging epoxy resin-based encapsulant that the present invention proposes, comprises the raw material of following weight part:

[0029] 100 parts of epoxy resin, 20 parts of isoprene-styrene copolymer, 5 parts of hexamethyldisilazane, 0.3 part of zingerone, 0.1 part of 2-D-bromoglucopyranose-tetrabenzyl ester , 2 parts of sodium pyrophosphate, 1 part of glyceryl tristearate, 0.5 part of diaminocyclohexane, 1.5 parts of trimethylhexamethylenediamine;

[0030] Its preparation method comprises the following steps:

[0031] S1, according to 100 parts of epoxy resin, 20 parts of isoprene-styrene copolymer, 5 parts of hexamethyldisilazane, 0.3 parts of zingerone, 2-D-glucopyranose bromide-tetrabenzyl 0.1 part of ester, 2 parts of sodium pyrophosphate, 1 part of glyceryl tristearate, 0.5 part of diaminocyclohexane, 1.5 parts of trimethylhexamethylenediamine Weigh each raw material and set aside;

[0032] S2. Mix the zingerone and 2-D-bromoglucopyranose-tetraben...

Embodiment 3

[0035] A kind of anti-aging epoxy resin-based encapsulant that the present invention proposes, comprises the raw material of following weight part:

[0036] 120 parts of epoxy resin, 30 parts of isoprene-styrene copolymer, 8 parts of hexamethyldisilazane, 0.4 part of zingerone, 0.1 part of 2-D-bromoglucopyranose-tetrabenzyl ester , 3 parts of sodium pyrophosphate, 1.5 parts of glyceryl tristearate, 1 part of diaminocyclohexane, 2 parts of trimethylhexamethylenediamine;

[0037] Its preparation method comprises the following steps:

[0038] S1, according to 120 parts of epoxy resin, 30 parts of isoprene-styrene copolymer, 8 parts of hexamethyldisilazane, 0.4 parts of zingerone, 2-D-bromoglucopyranose-tetrabenzyl 0.1 part of ester, 3 parts of sodium pyrophosphate, 1.5 parts of glyceryl tristearate, 1 part of diaminocyclohexane, and 2 parts of trimethylhexamethylenediamine Weigh each raw material and set aside;

[0039] S2. Mix the zingerone and 2-D-bromoglucopyranose-tetrabenz...

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Abstract

The invention provides anti-aging epoxy rein based packaging glue and a preparation method thereof. The anti-aging epoxy rein based packaging glue contains the following raw materials: epoxy resin, isoprene-styrol copolymer, hexamethyl-disilazane, zingerone, 2-D-bromide pyranoglucose-tetra-benzyl ester, sodium pyrophosphate, tri-glyceryl stearate, diaminocyctohexane and trimethyl hexamethylene diamine; the preparation method comprises the following steps: S1, preparing raw materials; S2, premixing zingerone and 2-D-bromide pyranoglucose-tetra-benzyl ester; S3, totally mixing the raw materials,and stirring uniformly to obtain the anti-aging epoxy rein based packaging glue. The packaging glue provided by the invention is reasonable in formula, has excellent anti-aging property and good transmittance, and is wide in use scope and long in service life; and the preparation method is simple, small in inter-batch difference, applicable to industrial production, and especially suitable for being applied to the field of micro-electronic products.

Description

technical field [0001] The invention relates to the technical field of packaging glue, in particular to an anti-aging epoxy resin-based packaging glue and a preparation method thereof. Background technique [0002] Microelectronics technology is a new technology developed along with integrated circuits, especially VLSIs. At present, the microelectronics industry is in a stage of vigorous development, and the research on packaging materials for microelectronic systems is also in the ascendant. Encapsulation glue is one of the most commonly used auxiliary materials for microelectronic products. It is often used as an adhesive for certain components, used for sealing, encapsulating or potting of components. After packaging, it can be waterproof, moisture-proof, shockproof, Dustproof, heat dissipation, confidentiality and other functions. At present, the materials of packaging glue mainly include epoxy resin, polycarbonate, glass, silicone, etc. Among them, epoxy resin has bec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J147/00C09J11/06C09J11/04
CPCC08L2201/08C08L2203/206C09J11/04C09J11/06C09J163/00C08L47/00C08K13/02C08K5/544C08K3/32C08K5/103C08K5/17C08K5/07C08K5/1545
Inventor 夏森陈大龙黄耀操瑞谢荣婷
Owner ANHUI NIKOLA ELECTRONICS TECH CO LTD
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