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A kind of dimer acid modified copolyester hot melt adhesive and preparation method thereof

A technology of copolyester and dimer acid, which is applied in the direction of adhesives, etc., can solve the problems of performance improvement, material low temperature resistance and limited influence of melt viscosity, etc., and achieve the effect of fast response, low melt viscosity and high melting point

Active Publication Date: 2020-09-15
广东舜天新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The high melting point copolyester in the above patents can introduce a small proportion of flexible segments such as methylene chains and ether bonds, which have limited impact on the low temperature resistance and melt viscosity of the material, and the performance needs to be improved.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A method for preparing a dimer acid-modified copolyester hot-melt adhesive. 168.3g of dimer acid, 54.1g of 1,4-butanediol and 0.2133g of tetrabutyl titanate are added to the reactor, and the temperature is rapidly raised to 160°C. Then raise the temperature to 210°C at a rate of 60°C / h, maintain until the effluent reaches the theoretical value, and complete the esterification reaction; then add 198.1g of PBT and 0.13g of triphenyl phosphite to the reaction system, and raise the temperature to 255°C. After clarification and transparency, keep the constant temperature for 10 minutes, slowly reduce the pressure to 60Pa, polycondense for 1.5 hours, and then cool down to 220°C and discharge to obtain a copolyester hot-melt adhesive. The melting point of the hot-melt adhesive is 176°C measured by a hot-table melting point tester, and it can withstand low temperature of -40°C without brittle fracture as measured by a low-temperature folding test, and its viscosity at 230°C is m...

Embodiment 2

[0025] A preparation method of a dimer acid-modified copolyester hot-melt adhesive, 8.3g isophthalic acid, 16.6g terephthalic acid, 84.2g dimer acid, 54.5g1,4-butanediol and 0.5g titanium Add tetrabutyl ester to the reaction kettle, rapidly raise the temperature to 160°C, then raise the temperature to 210°C at a rate of 60°C / h, and maintain until the effluent reaches the theoretical value to complete the esterification reaction; then add 154.2g of PBT () and 0.11g of triphosphite Add phenyl ester to the reaction system and raise the temperature to 255°C. After the reaction system becomes clear and transparent, keep the constant temperature for 10 minutes, slowly reduce the pressure to 60Pa, polycondense for 1 hour, and then cool down to 220°C to discharge the material to obtain a high-melting point copolyester hot-melt glue. The melting point of the hot melt adhesive measured by a hot-table melting point tester is 191°C, its brittle fracture temperature is -17°C measured by a ...

Embodiment 3

[0027] A preparation method of dimer acid modified copolyester hot melt adhesive, 8.3g isophthalic acid, 16.6g1,6-adipic acid, 84.2g dimer acid, 54.5g 1,3-propanediol, 0.2133 Add 1g of tetrabutyl titanate to the reactor, rapidly raise the temperature to 160°C, then raise the temperature to 210°C at a rate of 60°C / h, and maintain until the effluent reaches the theoretical value to complete the esterification reaction; then add 35.55g of polytrimethylene terephthalate Add ester and 0.711g triphenyl phosphite to the reaction system, and raise the temperature to 250°C. After the reaction system becomes clear and transparent, keep the constant temperature for 20min, slowly reduce the pressure to 80Pa, polycondense for 2h until the required viscosity is reached, discharge the material, and then cool down Discharging at 220°C to obtain a high-melting-point copolyester hot-melt adhesive. The melting point of the hot melt adhesive measured by a hot-table melting point tester is 190°C, ...

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Abstract

The invention provides a preparation method of a dimer acid modified copolyester hot melt adhesive. The preparation method comprises the following steps: (1) adding a dimer acid containing 36 carbon atoms, a dihydric alcohol containing 2-8 carbon atoms and a catalyst into a reaction kettle according to a certain proportion, uniformly carrying out mixing, and then carrying out an esterification reaction at a temperature of 160-210 DEG C; and (2) adding thermoplastic polyester and a stabilizer to a system obtained after the esterification reaction in the step (1) is completed, carrying out heating to 250-260 DEG C, keeping the temperature for 10-60 minutes after the reaction system becomes clear and transparent, reducing pressure to 60-140 Pa at a constant temperature of 250-260 DEG C, carrying out condensation polymerization for 1-4 hours until required viscosity is achieved, and then carrying out discharging to obtain the copolyester hot melt adhesive. The preparation method is rapid in reaction and high in yield, and the prepared hot melt adhesive has the characteristics of high melting point, high low-temperature tolerance, low melt viscosity and the like, and can meet requirements of many industries for polyester hot melt adhesives with high melting points and low-temperature resistance.

Description

technical field [0001] The invention relates to the technical field of copolyester hot-melt adhesives, in particular to a dimer acid-modified copolyester hot-melt adhesive and a preparation method thereof. Background technique [0002] Polyester hot-melt adhesives are widely used due to their strong adhesion, fast curing, and good weather resistance. However, due to the high crystallinity and strong molecular chain rigidity of the current medium and high temperature polyester hot melt adhesives, most of them have poor low temperature resistance and are prone to brittleness, and the melt viscosity of high molecular weight copolyesters is often relatively high. These deficiencies make the application field of polyester hot-melt adhesive be greatly restricted. [0003] Chinese patent CN103421460A discloses a method for preparing a crystallized and transparent copolyester hot-melt adhesive with a high melting point. The product is crystalline and transparent, has strong adhesi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G63/91C09J167/06
CPCC08G63/91C09J167/06
Inventor 冷先勇缪永建冷先强张家桔
Owner 广东舜天新材料有限公司
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