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Thermal interface material and preparation method thereof

A thermal interface material and thermosetting technology, which is applied in heat exchange materials, chemical instruments and methods, etc., can solve problems such as insufficient thermal conductivity, and achieve the effects of cheap raw materials, stable performance and low viscosity.

Inactive Publication Date: 2018-12-21
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a thermal interface material and its preparation method to solve the technical problem that the thermal conductivity of the current thermal interface material is not good enough

Method used

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  • Thermal interface material and preparation method thereof
  • Thermal interface material and preparation method thereof
  • Thermal interface material and preparation method thereof

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preparation example Construction

[0037] Based on the above thermal interface material, an embodiment of the present invention also provides a preparation method of a thermal interface material, the preparation method includes the following steps:

[0038] S01: mixing the spherical boron nitride, thermosetting resin, curing agent, defoamer, coupling agent and diluent;

[0039] S02: heating and curing to obtain a thermal interface material.

[0040] The specific mixing process described in step S01 is to make the components mix uniformly, for example, a conventional mixing method can be used to mix the components. As in the specific embodiment, ball milling is used to mix the components thoroughly and evenly. When using ball milling for mixing treatment, the process parameters of the ball milling treatment are: ball milling speed 200-500 rpm; ball milling time 0.5-2 hours.

[0041] In addition, the components in step S01 are the same as those described in the thermal interface material above, and will not be ...

Embodiment 1

[0046] This embodiment provides a thermal interface material and a preparation method thereof. The thermal interface material is formed by components including the following mass percentages:

[0047] Spherical boron nitride: 30%, 5μm in diameter;

[0048] Thermosetting resin: 50% bisphenol A liquid epoxy resin;

[0049] Curing agent: 4% methyl hexahydrophthalic anhydride and 1% tris-(dimethylaminomethyl)phenol;

[0050] Coupling agent: 10% KH560 silane coupling agent;

[0051] Diluent: 5% n-butyl glycidyl ether.

[0052] The preparation method of the thermal interface material comprises the following steps:

[0053] The above raw materials are mixed evenly by ball milling process. The ball milling process parameters are: ball milling speed 500, ball milling time 0.5h. The resulting mixture was cured at 200° C. for 3 h to obtain the final thermal interface material.

Embodiment 2

[0055] This embodiment provides a thermal interface material and a preparation method thereof. The thermal interface material is formed by components including the following mass percentages:

[0056] Spherical boron nitride: 70%, 200μm in diameter;

[0057] Thermosetting resin: 20% bisphenol F type liquid epoxy resin;

[0058] Curing agent: 4% tetraethylenepentamine and 1% N,N-dimethylbenzylamine;

[0059] Coupling agent: 1% KH550 silane coupling agent;

[0060] Diluent: 4% 1,4-butanediol diglycidyl ether.

[0061] The preparation method of the thermal interface material comprises the following steps:

[0062] The above raw materials are mixed evenly by ball milling process. The ball milling process parameters are: ball milling speed 200, ball milling time 2h. The obtained mixture was cured at 200° C. for 2 h to obtain the final thermal interface material.

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Abstract

The invention relates to a thermal interface material and a preparation method thereof. The thermal interface material is prepared from 30 to 70 percent by weight of spherical boron nitride, 20 to 50percent by weight of thermosetting resin, 5 to 10 percent of a curing agent, 1 to 5 percent of a coupling agent, and 1 to 10 percent of a diluting agent. The preparation method comprises the followingstep of uniformly stirring and mixing the spherical boron nitride, thermosetting resin, the curing agent, defoaming agent, coupling agent and diluting agent. The thermal interface material is obtained by virtue of curing of a baking oven. The spherical boron nitride is adopted to substitute flaky boron nitride, so that the filling amount of boron nitride in the thermosetting resin can be improved, and the heat conduction coefficient of the thermal interface material can be improved; and meanwhile, spherical boron nitride can reduce the viscosity of the composite material, and the operabilityof the thermal interface material can be improved. The method is simple, easy, and low in price of raw materials, and the prepared thermal interface material is relatively high in heat conductivity coefficient and can be widely applied to the field of heat dissipation of high-density electron devices.

Description

technical field [0001] The invention belongs to the field of electronic packaging materials, and relates to a thermal interface material and a preparation method thereof. Background technique [0002] With the development of electronic devices in the direction of miniaturization and miniaturization, and the integration of electronic chips is getting higher and higher, the work efficiency and reliability of electronic devices are increasingly dependent on the solution of heat dissipation problems, so the heat dissipation of electronic packages has become more and more important. important. Thermal interface materials are generally applied to solid interfaces between integrated circuits (chips) or microprocessors and heat sinks or heat spreaders, and between heat spreaders and heat sinks. The thermal conductivity of the thermal interface material directly affects the heat dissipation performance of the chip. Therefore, it is particularly important to develop thermal interfac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K7/18C08K5/5435C08K5/544C09K5/14
CPCC08K5/5435C08K5/544C08K7/18C09K5/14C08L63/00
Inventor 孙蓉任琳琳曾小亮许建斌汪正平
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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