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Copper foil for printed circuit board and preparation method thereof

A technology for printed circuit boards and copper foils, which is applied in the field of improved copper foils for printed circuit boards and its preparation, can solve the problems of complex curing process and long process flow, and achieves the effect of overcoming technical prejudice and solving powder removal.

Active Publication Date: 2019-11-12
江西伟创丰电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Through the treatment process of the present invention, the production of copper powder is greatly reduced, and the copper foil is 10cm 2 The number of copper powder in the sample does not exceed 10, and the maximum diameter of copper powder does not exceed 30 μm, which greatly reduces the risk of short circuit in the process of making printed circuit boards. The process is complicated, the process is long, etc.

Method used

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  • Copper foil for printed circuit board and preparation method thereof
  • Copper foil for printed circuit board and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0034] Plating an untreated copper foil with a thickness of 15 microns and a roughness Rz of the surface to be treated = 3.8 μm, the plating solution is a conventional copper sulfate electrolyte, the concentration of copper sulfate is 70g / L, and the concentration of sulfuric acid is 110g / L , titanium tetrachloride 1.0g / L, niobium oxalate 0.2g / L, ammonium molybdate 3.5g / L, sodium cyanide 15g / L, potassium sodium tartrate 8g / L, the current density is 25A / dm 2 , the electroplating time is 8 seconds, the temperature of the electroplating solution is 40° C., and the thickness is 0.5 μm.

Embodiment 2

[0036] Plating an untreated copper foil with a thickness of 15 microns and a roughness Rz of the surface to be treated = 3.8 μm, the plating solution is a conventional copper sulfate electrolyte, the concentration of copper sulfate is 80g / L, and the concentration of sulfuric acid is 150g / L , titanium tetrachloride 0.6g / L, niobium oxalate 0.12g / L, sodium molybdate 1.8g / L, sodium cyanide 25g / L, potassium sodium tartrate 12g / L, the current density is 35A / dm 2 , the electroplating time is 6 seconds, the temperature of the electroplating solution is 35° C., and the thickness is 1.0 μm.

[0037] The above-mentioned electrolytically roughened alloy copper foil layer undergoes conventional follow-up treatment (including plating copper plating, nickel plating, zinc plating or a combination of any of them on the alloy layer), so as to be laminated with a resin substrate to prepare a printed circuit board laminate version and perform performance tests.

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Abstract

The invention relates to a copper foil for a printed circuit board. The copper foil and a resin substrate are joined by a copper alloy layer of Cu-Ti-Nb-Mo, the ratio of the three alloy elements Ti-Nb-Mo in the copper alloy layer is 0.0005 to 2% wt, Ti:Nb:Mo is10:1:39 in the copper alloy layer. The following preparation method comprises the following steps: plating the untreated copper foil, wherein the plating solution is a conventional copper sulfate electrolyte, the total amount of a compound containing Ti, Nb and Mo is 0.01 to 5 g / L, the prepared copper foil has a tensile strength of 2.0 to 2.5 kg / cm, a current density of 25 to 35 A / dm2 , the plating time is 4 to 8 seconds, and the thickness is 0.25 to 2.0 microns. According to the copper foil for a printed circuit board and the preparation method therefor, the phenomenon that a rough layer has no powder drop is realized, the tensile strength is high and electrical properties are good.

Description

technical field [0001] The invention relates to a printed circuit board (PCB), in particular to an improved copper foil for a printed circuit board and a preparation method thereof. Background technique [0002] Electronic circuit boards are used in electronic components to form predetermined circuit connections between electronic components, and play the role of relay transmission, which is a key electronic interconnection of electronic products. The copper foil used as a circuit board is the main original. In order to improve the bonding force with the resin substrate, the copper foil prepared by the prior art must also meet the specific electrical characteristics, heat resistance and etchability. The foil is roughened. Electrolytic roughening is one such treatment. [0003] The copper foil produced by the existing copper foil production process, due to the loose crystal structure deposited on the matte surface during the roughening process of the surface treatment, is e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/58C22C9/00
CPCC22C9/00C25D3/58
Inventor 李爱芝
Owner 江西伟创丰电路有限公司
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