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A kind of infrared fast-curing water-based adhesive and coating method based on cus photothermal conversion mechanism

A technology of light-to-heat conversion and light-to-heat conversion materials, which is applied in the field of infrared fast-curing water-based adhesives, can solve the problems of long-term and unfavorable, achieve high solid content, increase volatilization speed, and remarkable effects

Active Publication Date: 2020-11-03
GUANGDONG TAIQIANG TECH IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, there are certain problems in this solution. If this solution wants to achieve a relatively large final adhesion, it will take a long time, which is unfavorable for the furniture processing industry.

Method used

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  • A kind of infrared fast-curing water-based adhesive and coating method based on cus photothermal conversion mechanism
  • A kind of infrared fast-curing water-based adhesive and coating method based on cus photothermal conversion mechanism
  • A kind of infrared fast-curing water-based adhesive and coating method based on cus photothermal conversion mechanism

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] An infrared fast-curing water-based organic adhesive based on CuS light-to-heat conversion mechanism, comprising the following components in parts by weight:

[0034] 31 parts of vinegar-acrylic emulsion for 9761 environmentally friendly adhesives of Dow Chemical;

[0035] 41 parts of aqueous maleic acid modified rosin resins;

[0036] 0.4 parts of TMDD wetting agent (2,4,7,9-tetramethyl-5-decyne-4,7-diol);

[0037] 0.8 parts of sodium lauryl sulfate;

[0038] 1 copy of AEO3;

[0039] 0.1 parts of CuS photothermal conversion material;

[0040] Add water to 100 parts. .

[0041] In the process of storage and transportation, the above materials are still stable after being fully mixed, and there will be no turbidity and stratification.

[0042] The CuS photothermal conversion material described in this example refers to CN201711337281.X, the applicant is Wuhan University of Technology’s water-soluble CuS nanocrystal and its synthesis method and application, which is...

Embodiment 2

[0044] An infrared fast-curing water-based organic adhesive based on CuS light-to-heat conversion mechanism, comprising the following components in parts by weight:

[0045] 32 parts of vinegar-acrylic emulsion for 9761 environmentally friendly adhesives of Dow Chemical;

[0046] 40 parts of aqueous maleic acid modified rosin resins;

[0047] 0.5 parts of TMDD wetting agent (2,4,7,9-tetramethyl-5-decyne-4,7-diol);

[0048] 1 part sodium lauryl sulfate;

[0049] AEO9 0.5 copies;

[0050] 0.2 parts of CuS photothermal conversion material;

[0051] Add water to 100 parts.

[0052] In the process of storage and transportation, the above materials are still stable after being fully mixed, and there will be no turbidity and stratification.

[0053] The CuS photothermal conversion material described in this example refers to CN201711337281.X, the applicant is Wuhan University of Technology’s water-soluble CuS nanocrystal and its synthesis method and application, which is specifi...

Embodiment 3

[0055] An infrared fast-curing water-based organic adhesive based on CuS light-to-heat conversion mechanism, comprising the following components in parts by weight:

[0056] 32 parts of vinegar-acrylic emulsion for 9761 environmentally friendly adhesives of Dow Chemical;

[0057] 40 parts of aqueous maleic acid modified rosin resins;

[0058] 0.5 parts of TMDD wetting agent (2,4,7,9-tetramethyl-5-decyne-4,7-diol);

[0059] 1 part sodium lauryl sulfate;

[0060] AEO3 0.5 copies;

[0061] 0.2 parts of CuS photothermal conversion material;

[0062] 1.5 parts of γ-mercaptopropyltrimethoxysilane;

[0063] Add water to 100 parts.

[0064] In the process of storage and transportation, the above materials are still stable after being fully mixed, and there will be no turbidity and stratification.

[0065] The CuS photothermal conversion material described in this example refers to CN201711337281.X, the applicant is Wuhan University of Technology’s water-soluble CuS nanocrystal a...

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Abstract

The invention discloses infrared fast-curing water-based laminator glue based on a CuS photothermal conversion mechanism. The glue comprises, by weight, 31-32 parts of vinyl acetate-acrylic emulsion,40-41 parts of modified rosin resin, 0.3-0.5 part of TMDD (target mediated drug disposition) wetting agents, 0.5-1 part of lauryl sodium sulfate, 0.5-1 part of fatty alcohol-polyoxyethylene ether, 0.1-0.2 part of CuS photothermal conversion materials and the balance water added to reach 100 parts. The glue has the advantages that solid content is high, viscosity is low, infrared radiation is performed after coating, short time is needed to reach target final viscous force, water of the coated laminator glue can be rapidly volatilized by the scheme, and curing time is further shortened.

Description

technical field [0001] The invention relates to the field of mechanical adhesives, in particular to an infrared fast-curing water-based mechanical adhesive based on a CuS light-to-heat conversion mechanism. Background technique [0002] CN201711247580.4 discloses a high-solid-content, low-viscosity vinegar-acrylic emulsion and a preparation method thereof. The preparation method of the present invention comprises the following steps: adding butyl acrylate, vinyl acetate, isooctyl acrylate, functional monomers and emulsifiers into water, stirring and emulsifying evenly to obtain a pre-emulsion; Octyl esters and functional monomers are mixed to obtain mixed monomers; inorganic peroxide initiators are prepared into solutions. Mix water, emulsifier, protective colloid, buffer, functional monomer and mixed monomer, stir and emulsify, heat at 75-85°C; add initiator solution dropwise, stir and polymerize to obtain seed emulsion; add pre-emulsion, remaining The mixed monomer, the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J193/04C09J11/04C09J11/06C09J11/08
CPCC08K2003/3009C08L2205/03C09J11/04C09J11/06C09J11/08C09J193/04C08L31/04C08L71/02C08K3/30C08K5/41
Inventor 李满林张凤帮林成辉胡赞军刘志军
Owner GUANGDONG TAIQIANG TECH IND CO LTD