Method for processing a workpiece
A technology of processed objects and processing methods, applied in metal processing equipment, manufacturing tools, laser welding equipment, etc., can solve the problem of chip flexural strength deterioration and other problems, and achieve the effect of improving productivity and improving flexural strength
Pending Publication Date: 2019-01-01
DISCO CORP
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[0011] However, in the processing method described in Patent Document 2, although the productivity is improved compared with the SD processing method using a cutting tool or a pulsed laser beam, and the ablation processing method, there is a problem that the chip is broken compared to dicing using a cutting tool. The problem of poor flexural strength
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[0025] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. figure 1 It shows that the protective tape 17 is pasted on lithium niobate (LiNbO 3 ) A perspective view of the situation on the front side 11 a of the wafer 11 . On the front surface 11a of a lithium niobate wafer (sometimes referred to as an LN wafer or simply a wafer) 11, SAW devices 15 such as a SAW filter are formed in each region divided by a plurality of planned division lines 13 formed in a grid pattern. . The SAW device 15 is formed using a thin film of aluminum or an aluminum alloy as a comb-shaped electrode having a period of about 2 to 5 μm, for example.
[0026] The thickness of the LN wafer 11 is about 350 μm, and the processing method of this embodiment includes a grinding step of grinding the back surface 11 b of the LN wafer 11 to a finished thickness of 130 μm.
[0027] In the processing method of this embodiment, an example in which an LN w...
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Abstract
The present invention provides a method for processing a workpiece capable of improving productivity without reduction of the chip breaking strength. According to the method, a plurality of crossed segmentation predetermined lines are arranged at the front surface of the workpiece, and the method comprises the following steps of: a maintenance step: employing a clamping disc workbench is configured to maintain the front surface of the workpiece; a laser processing step configured to irradiate a pulse laser beam with the transparence wavelength of the workpiece on the clamping disc workbench toform a plurality of shield tunnels at the front surface of the workpiece, the shield tunnel reaches above the finished product thickness of the workpiece, and is formed by a small hole and an amorphous or metamorphic layer around the small hole; and a grinding step configured to grind the back surface of the workpiece after the laser processing step to thin the workpiece to the finished product thickness.
Description
technical field [0001] The present invention relates to a method of processing a workpiece in which a plurality of crossing planned dividing lines are set on the front surface of the workpiece. Background technique [0002] Regarding the SAW filter (Surface Acoustic Wave Filter: Surface Acoustic Wave Filter) that extracts electrical signals of a specific band, it is used as an RF filter (Radio Frequency Filter: Radio Frequency Filter) or an IF filter (Intermediate Frequency Filter: Intermediate Frequency Filter) In addition to being used in most mobile phones, it is also widely used as a filter for digital TV, GPS, wireless LAM, etc. [0003] In the manufacturing process of SAW filter, lithium niobate (LiNbO 3 ) or lithium tantalate (LiTaO 3 ) and other single crystal ingots, thereafter, the ingot is cut into wafers, and then ground and polished by a grinding device or a grinding device to planarize (for example, refer to Patent Document 1). [0004] On the planarized lit...
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IPC IPC(8): H01L21/304B23K26/364B23K26/402
CPCH01L21/3043B23K26/364B23K26/402H01L21/78H01L21/76B23K26/38H01L21/304
Inventor 诸德寺匠桐林幸弘
Owner DISCO CORP