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A low softening point lead-free glass composition and low-temperature lead-free sealing material and low-temperature lead-free solder paste comprising the glass composition

A technology of glass composition and lead-free glass, which is applied in the field of low-temperature lead-free sealing materials and low-temperature lead-free solder paste, which can solve the problems of no material available, increase of linear expansion coefficient, difficulty in popularization, etc., and achieve improved network structure composition , use performance reduction, optimize the effect of network composition

Active Publication Date: 2021-10-01
CHINA BUILDING MATERIALS ACAD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the relevant patent of Hitachi Chemical Co., Ltd. of Japan proposes a V 2 o 5 -TeO 2 -Ag 2 O system glass has a glass transition temperature as low as 200°C and a sealing temperature below 300°C, but the glass of this system has poor water resistance and is expensive, so it is difficult to be popularized; and the main components are vanadium oxide and tellurium oxide The glass has a very large linear expansion coefficient. It is modified by adding precious metal elements such as Ag and Te to further increase its linear expansion coefficient. A large amount of high-priced zirconium tungsten phosphate and other low thermal expansion fillers must be added, which affects the sealing material. Fluidity and wettability, it is easy to leave many bubbles in the sealing part and it is difficult to obtain high airtightness, it has not been applied in high-strength airtight sealing
[0005] In the field of vacuum glass, the existing commercial bismuth and vanadate sealing glasses are difficult to meet the requirements, especially the temperature required for tempered vacuum glass sealing is below 380°C, showing the current situation of no materials available

Method used

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  • A low softening point lead-free glass composition and low-temperature lead-free sealing material and low-temperature lead-free solder paste comprising the glass composition
  • A low softening point lead-free glass composition and low-temperature lead-free sealing material and low-temperature lead-free solder paste comprising the glass composition
  • A low softening point lead-free glass composition and low-temperature lead-free sealing material and low-temperature lead-free solder paste comprising the glass composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-19

[0059] When the glass composition contains only vanadium and, the glass is easily crystallized, and the moisture resistance is poor, and the third and above elements must be contained.

[0060] When the third element phosphor is contained, the softening temperature of the glass is raised as the vanadium content is lowered, and when the vanadium content exceeds 65% by weight, the moisture resistance is deteriorated; when the phosphorus content is less than 5% by weight, it is easy to generate crystallization. It also affects the low temperature fluidity of the glass, and when the phosphorus content exceeds 25% by weight, the softening point of the glass will rise.

[0061] Further, in order to improve the moisture resistance of the glass, the wire expansion coefficient is lowered, and the present invention proposes to introduce a metal or an alkaline earth metal oxide in the glass, with barium, tungsten, ferroxide to improve the moisture resistance, but the content exceeds 15% by w...

Embodiment 20-34

[0071] Further, based on the above-described Embodiments 1-19, the present invention is further reduced the wire expansion coefficient of the glass while improving the fluidity and infiltration of the surface of the low softened point glass, improve its chemical stability and water resistance, and preferred A low softened point glass composition is proposed, which mainly contains vanadium,,, aluminum, barium oxide, and the softening point of the glass composition is 300 ° C or lower, and 25 ° C of the glass composition. ~ 250 ° C linear wire expansion coefficient is 120 × 10 -7 / ° C or less.

[0072] The composition of the low softening point lead-free glass composition of the vanadium aluminum system is shown in Table 2. Among them, any component is represented according to the weight ratio shown in the oxide conversion, which contains vanadium,, aluminum, as a glass raw material, vanadium using V. 2 O 5 , Use TEO 2 Aluminum uses Al 2 O 3 At the same time, add modified component...

Embodiment 35

[0082] As a further embodiment, the study of hybrid filler is carried out for the low softening point lead-free glass composition, including the types and content of the filler. The VTP-7, 17, 21 of Table 1 in the above examples is typically representing a glass milling and over 300 mesh sieves, and a fine powder having a particle size of less than 50 microns is obtained. Further, the present embodiment is only 30 micromerates as a ceramic filler, and the low softening point glass composition powder and the ceramic filler are mixed in accordance with the weight ratio of 10: 1, 10: 2, 10: 3, and mixed the mixed powder. Study its softening temperature, change in flow flooding temperature and line expansion coefficient.

[0083] Filler, ratio and mixed material characteristics used in the examples

[0084]

[0085] As can be seen from the test results, as the added ratio of cordierite ceramic filler increases, the linear expansion coefficient of the glass mixture gradually decrease...

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Abstract

The object of the present invention is to provide a lead-free glass composition with a low softening point, a low-temperature lead-free sealing material and a low-temperature lead-free solder paste containing the glass composition. The glass composition is characterized in that, in terms of oxide conversion, in terms of mass percentage, it comprises the following components: V 2 o 5 , 35‑65%; TeO 2 , 10‑49%; P 2 o 5 , 0‑25%; Al 2 o 3 , 0‑16%; Sb 2 o 3 , SiO 2 、Ag 2 O, BaO, CuO, Fe 2 o 3 , ZnO, WO 3 、 Bi 2 o 3 The total content of ≦15%; the P 2 o 5 and Al 2 o 3 The total content of the two oxides is ≦25%; the low-temperature lead-free sealing material and the low-temperature lead-free solder paste contain the glass composition. It has excellent comprehensive performance, no crystallization, good chemical stability; and low linear expansion coefficient at low temperature.

Description

Technical field [0001] The present invention relates to a low-temperature sealing material, and more particularly to a low-softened point lead-free glass composition and a low-temperature lead-free sealing material comprising the glass composition and a low temperature lead-free welding material. Background technique [0002] Low-temperature gating glass is a sealing glass having a sealing temperature or less or less, which is applied to vacuum techniques and electronic technologies as a sealing solder, with better bond strength, airtightness, and electrical insulation performance. At present, in the sealing of electronic components and vacuum glass, low-temperature softening point glass compositions based on lead-to-lead-to-lead ingredients are applied to the sealing material, and a large number of applications are obtained, but they are lead, not environmentally friendly. . However, as people's environmental awareness is gradually enhanced, lead to human poisoning and contamina...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C8/24
CPCC03C8/24
Inventor 李要辉王晋珍黄幼榕张凡
Owner CHINA BUILDING MATERIALS ACAD
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