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Resin spacer for chip stack packaging and preparation method thereof

A technology of chip stacking and resin, which is applied in the field of resin gasket and its preparation, can solve the problems of high production cost, thick gasket, fragile silicon-based wafer gasket, etc., and achieve easy storage, excellent electrical insulation, unbreakable effect

Active Publication Date: 2020-04-07
SU ZHOU DREAM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a resin pad for chip stack packaging in order to solve the technical problems of the existing silicon-based wafer gasket for chip packaging, which are fragile, high production cost, and thick. Tablets and their preparation method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] This embodiment provides a resin gasket for chip stack packaging, with a thickness of 0.07 mm and a base material of 100-mesh fiberglass cloth. The weight ratio of the fiberglass cloth is 60 wt%, and the following components are attached to it: Points, in percentage of the total weight of the resin gasket: naphthol type epoxy resin 8wt%, 200 mesh quartz powder 10wt%, 400 mesh alumina 10wt%, 300 mesh calcium oxide 8wt%, polyamide 4wt%.

[0029] The preparation method of the above-mentioned resin gasket for chip stack packaging includes the following steps:

[0030] S1: Glue adjustment: Add 8 parts by weight of naphthol-type epoxy resin, 10 parts by weight of quartz powder, 10 parts by weight of alumina, and 8 parts by weight of calcium oxide into ethyl acetate, stir to dissolve, and add 4 parts by weight The polyamide is uniformly dispersed to obtain resin glue;

[0031] S2: Glue dipping: immerse 60 parts by weight of fiberglass cloth in the prepared resin glue solution...

Embodiment 2

[0035] This embodiment provides a resin spacer for chip stack packaging, with a thickness of 0.1mm and a base material of 200-mesh fiberglass cloth, the weight of the fiberglass cloth is 10wt%, and the following components are attached to it: Points, as a percentage of the total weight of the resin gasket: bisphenol A epoxy resin 17wt%, biphenyl epoxy resin 20wt%, 400 mesh quartz powder 30wt%, 600 mesh alumina 10wt%, 400 mesh calcium oxide 2wt %, fatty amine 8wt%, 3wt% white carbon black.

[0036] The preparation method of the above-mentioned resin gasket for chip stack packaging includes the following steps:

[0037] S1: glue adjustment: add 20 parts by weight of bisphenol A epoxy resin, 20 parts by weight of biphenyl epoxy resin, 30 parts by weight of quartz powder, 10 parts by weight of alumina, and 2 parts by weight of calcium oxide into N , in N-dimethylformamide, stir and dissolve, add 8 parts by weight of aliphatic amine, disperse evenly, and obtain resin glue;

[003...

Embodiment 3

[0042] This embodiment provides a resin spacer for chip stack packaging, with a thickness of 0.13mm and a base material of 150-mesh fiberglass cloth, the weight of the fiberglass cloth is 40wt%, and the following components are attached to it: Points, as a percentage of the total weight of the resin gasket: novolak epoxy resin 19wt%, dicyclopentadiene epoxy resin 10wt%, 300 mesh quartz powder 20wt%, 500 mesh alumina 2wt%, 200 mesh calcium oxide 7wt %, imidazole 1wt%, 1wt% pearl powder.

[0043] The preparation method of the above-mentioned resin gasket for chip stack packaging includes the following steps:

[0044] S1: glue adjustment: add 20 parts by weight of novolac epoxy resin, 10 parts by weight of dicyclopentadiene epoxy resin, 20 parts by weight of quartz powder, 2 parts by weight of alumina, and 7 parts by weight of calcium oxide into acetone , stir to dissolve, add 1 part by weight of imidazole, disperse evenly, and obtain resin glue;

[0045] S2: Glue dipping: immers...

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Abstract

The invention relates to a resin pad for chip stack packaging, which uses fiberglass cloth as the base material, and the weight ratio of the fiberglass cloth is 10-60wt%, and the following components are attached to it to account for the resin pad Percentage of total sheet weight: epoxy resin 8-40wt%, quartz powder 10-30wt%, aluminum oxide 2-10wt%, calcium oxide 1-8wt%, curing agent 1-8wt%, and the resin gasket is passed It is made of resin blending, dipping, semi-curing, stacking and pressing. The resin spacer used for chip stack packaging of the present invention has good flexibility and is not easy to break, can realize more layers of chips stacked on the substrate, and effectively avoids reducing the warping of the packaging structure and the risk of internal chip fragmentation. In addition, , the resin spacer of the present invention has excellent electrical insulation and good hydrophilic effect, and can replace silicon-based spacers widely used in chip stack packaging at present.

Description

technical field [0001] The invention relates to a resin gasket used for chip stack packaging and a preparation method thereof, belonging to the technical field of gaskets for packaging chips. Background technique [0002] With the development of modern integrated circuits, chip packaging technology in the microelectronics industry has developed rapidly from two-dimensional to three-dimensional stacked packaging to adapt to lighter, thinner, smaller, high-performance, low-power, and low-cost chip packaging structures. Market requirements. The three-dimensional stacked packaging technology not only increases the packaging density and reduces the cost without increasing the package size, but also reduces the length of the interconnection wires between chips, thereby improving the operating speed of the device, and through the stacked package. Multifunctionalization of the device can be realized. [0003] The current three-dimensional stacked packaging forms mainly include: st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K13/04C08K7/14C08K3/36C08K3/22H01L23/31
CPCH01L23/31C08K3/22C08K3/36C08K7/14C08K13/04C08K2003/2206C08K2003/2227C08L2201/08C08J5/244C08J5/249C08L63/00C08J5/043C08J2363/00H01L2225/06575H01L25/0657C08J5/10C08G59/40B32B27/18C08J5/24C08G59/4014C08K3/04C08K2201/002H01L23/293
Inventor 杨国宏
Owner SU ZHOU DREAM TECH CO LTD
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