A kind of bismuth-based alloy solder paste composition
A composition and alloy technology, applied in metal processing equipment, welding equipment, manufacturing tools, etc., can solve the problems of poor corrosion resistance, poor oxidation resistance, process performance and welding performance can not be satisfied at the same time, to achieve enhanced strength and corrosion resistance, the effect of enhancing the oxidation resistance
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[0068] In order to solve the above problems, a second aspect of the present invention provides a method for preparing a bismuth-based alloy solder paste composition, the preparation method comprising the following steps:
[0069] A1: Preparation of tin alloy powder;
[0070] A2: Preparation of soldering paste: Mix rosin, solvent, thickener, activator, corrosion inhibitor and protective agent in the formula, heat until dissolved, stir evenly, and cool to room temperature to obtain soldering paste;
[0071] A3: Preparation of the bismuth-based alloy-containing solder paste composition: mix the solder paste and tin alloy powder in proportion to obtain the bismuth-based alloy-containing solder paste composition.
[0072] During the whole preparation process, there is no limit to the heating temperature and time, the purpose is to dissolve, and there is no limit to the stirring time and stirring speed, the purpose is to stir evenly, and the room temperature refers to 20±5°C.
[00...
Embodiment 1
[0099] The first aspect of Example 1 provides a bismuth-based alloy-containing solder paste composition, including solder paste and tin alloy powder, and the weight ratio of the solder paste to the tin alloy is 12%.
[0100] In terms of weight percentage, tin alloy powder contains:
[0101] Ag 3.25%, P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al 0.1%, Cu 0.95%, Zr 0.65%, In 0.35%, and the rest is Sn. Among them, the RE component is a combination of Ga and Ce at a ratio of 1:1.
[0102] In terms of parts by weight, the solder paste contains the following components:
[0103] 35 parts of rosin, 35 parts of solvent, 8 parts of thickener, 6 parts of active agent, 3 parts of corrosion inhibitor and antioxidant and 3 parts of protective agent. The rosin is selected from disproportionated rosin; the solvent is selected from the combination of tetraethylene glycol methyl ether and tripropylene glycol methyl ether in parts by weight; the thickener is selected from palm wa...
Embodiment 2
[0118] The first aspect of Example 2 provides a bismuth-based alloy-containing solder paste composition, including solder paste and tin alloy powder, and the weight ratio of the solder paste to tin alloy is 12%.
[0119] In terms of weight percentage, tin alloy powder contains:
[0120] Ag 3%, P 0.02%, RE 40%, Co 1%, Pd 2%, Bi 0.4%, Mg 0.05%, Al 0.05%, Cu0.8%, Zr 0.5%, In 0.3%, and the rest is Sn. Among them, the RE component is a combination of Ga and Ce at a ratio of 1:1.
[0121] The composition of the flux paste is the same as in Example 1. The preparation method of the protective agent is the same as in Example 1.
[0122] The second aspect of Example 2 provides a preparation method of a bismuth-based alloy-containing solder paste composition, the preparation method is the same as that of Example 1, and the preparation method of the tin alloy is also the same as that of Example 1.
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