A kind of preparation method of organosilicon composition
A technology of organosilicon and composition, which is applied in the field of preparation of organosilicon defoaming composition, can solve the problem of not long time to control foam, and achieve the effect of eliminating harmful foam
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Embodiment 1
[0057] The preparation of active silicone resin C-1:
[0058] At room temperature, add hexamethyldisiloxane (or hydrogen-containing capping agent or vinyl-containing capping agent), ethyl orthosilicate, water, hydrochloric acid, and ethanol into the flask for hydrolysis at 40°C for 1 hour, then After polymerization at 50°C for 4 hours, sodium hydroxide was added for neutralization, and toluene was added to the flask to extract the resulting polymer product. The water phase was separated, and the obtained oil phase was evaporated to remove toluene to obtain an active silicone resin, and the hydroxyl content and alkoxy content were tested.
[0059] Through this method, the following active silicone resin C-1 can be obtained:
[0060] Silicone resin n (M链节) ： n (Q链节)
Embodiment 2
[0062] Preparation of inert silicone resin C-2:
[0063] At room temperature, add trimethylchlorosilane, water glass, water, hydrochloric acid, and ethanol to the flask for hydrolysis at 60°C for 1 hour, then polymerize at 60°C for 4 hours, add sodium hydroxide to neutralize, and add xylene to the flask The resulting polymer product was extracted. The water phase was separated, potassium hydroxide was added to the oil phase, and the temperature was raised to 130°C for 2 hours, and finally the solvent was distilled off under reduced pressure to obtain an inert silicone resin.
[0064] The following inert silicone resin C-2 can be obtained by this method:
[0065] Silicone resin n (M链节) ： n (Q链节)
Embodiment 3
[0067] At room temperature, add 65 parts of inert trimethylsiloxy-terminated polydimethylsiloxane A (viscosity 350 mPa s) and 18.9 parts active hydroxyl-terminated polydimethylsiloxane B (viscosity 20,000 mPa Add 0.5 parts of phosphoric acid to s), let the mixture react at 50°C for 0.5h; then add 5 parts of silicone resin C-1B to it, and add 0.6 parts of phosphoric acid and 2 parts of water again, and keep warm at the above reaction temperature for 1h Vacuumize to remove small molecules; then add 1 part of potassium hydroxide to the mixture obtained above, keep warm at 110°C for 4 hours, add 3 parts of hydrophobic precipitated silica D10 and 3 parts of silicone resin C-2B to the system, And react at 150°C for 3 hours to make the hydrophobic precipitated silica D10 and silicone resin C-2B uniformly dispersed, and finally add 1 part of phosphoric acid to neutralize, and lower the reaction temperature to room temperature to obtain the silicone composition of the present invention....
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