High-viscosity heat-resistant film

Abstract

The invention relates to a high-viscosity heat-resistant film. The high-viscosity heat-resistant film comprises an adhesive layer and a coating film, wherein the coating film comprises a modified PETfilm; and the adhesive layer comprises nanometer silica gel, an adhesive, polypropylene fiber / polylactic acid fiber / bionic fiber / mixed fiber, graphite powder, an emulsifying agent and absolute ethanol. The high-viscosity heat-resistant film mainly comprises the coating film and the adhesive layer in a macrostructure, and the adhesive layer comprises the nanometer silica gel, the adhesive, the polypropylene fiber / polylactic acid fiber / bionic fiber / mixed fiber, the graphite powder, the emulsifying agent and the absolute ethanol as main components; the high-viscosity heat-resistant film has relatively strong viscosity, is not directly adhered during adhesion, is slowly adhered to the surface of an object after a period of time after adhesion, has a large adhesive force and does not fall off;the high-viscosity heat-resistant film further has high heat resistance, a substance in the adhesive layer has relatively strong heat resistance, and the morphological change of the substance after being heated is not caused; and then, due to addition of the graphite powder into the adhesive, the high-viscosity heat-resistant film further has high antistatic ability.

Description

technical field [0001] The invention relates to a sticking film, in particular to a high-viscosity heat-resistant sticking film. Background technique [0002] From ordinary desktop computers, to laptops, tablets, and smartphones, technological innovation has advanced by leaps and bounds. Electronic products are becoming more portable, smaller in size, and more powerful in function, which leads to higher integration. This leads to shrinking volume and stronger functions, which directly leads to higher and higher heat dissipation requirements of electronic components. However, the fan-type heat dissipation used in the past was gradually eliminated by the market due to its large size and noise. Then there are other heat dissipation materials, such as copper foil and aluminum foil, but due to limited resources and high prices, the heat dissipation effect is not as good as expected. Slowly, people are looking for new and efficient heat dissipation materials. Secondly, due to t...

AI Technical Summary

Problems solved by technology

This leads to shrinking volume and stronger functions, which directly leads to higher and higher heat dissipation requirements of electronic components.

However, the fan type heat dissipation used in the past was gradually eliminated by the market due to its large size and noise.

In turn, other heat dissipation materials have been produced, such as copper foil and aluminum foil heat dissipation. However, due to limited resources and high prices, the heat dissipation effect is not as good as imagined. Slowly, they are all looking for new and efficient heat dissipation materials.

Secondly, due to the diversity of electronic products, existing products often need to be customized, which makes it difficult to apply to specific use occasions and limits the promotion of its application; Adhesive tapes that are thermally conductive and have antistatic properties have become the direction of efforts of ordinary skilled in the art