High heat conductivity type graphite film-metal composite material and preparation method thereof

A technology of metal composite materials and high thermal conductivity graphite, which is applied in the field of materials, can solve the problems of easy powder drop, low density, and inability to meet the heat dissipation requirements of portable digital products, etc., to achieve powder drop, good pressure resistance, and good pressure resistance Effect

Inactive Publication Date: 2019-01-18
江苏墨泰新材料有限公司
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  • Summary
  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional heat dissipation materials are metals with high thermal conductivity such as copper, silver, and aluminum. The natural graphite film has higher thermal conductivity, lower density, and good material stability, so it has gradually been widely used in the electronics industry.
[0004]The natural graphite film is made of natural flake graphite or coal tar pitch. After the raw material is acidified, it is heated to expand the interlayer of natural graphite to obtain a worm-like structure. The bonding material is calendered under high temperature and high pressure to obtain a film-like graphite sheet. However, the thermal conductivity of natural graphite film generally does not exceed 400W / (m K), and there are also shortcomings such as easy powder loss, so it is increasingly unable to meet the needs of current portable digital products. cooling requirements

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  • High heat conductivity type graphite film-metal composite material and preparation method thereof
  • High heat conductivity type graphite film-metal composite material and preparation method thereof

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preparation example Construction

[0019] An embodiment of the present invention provides a method for preparing a high thermal conductivity graphite film-metal composite material, which includes:

[0020] A metal layer is sputtered on the surface of the graphite film by means of vacuum magnetron sputtering.

[0021] Natural graphite film has higher thermal conductivity, lower density, and good material stability, so it has gradually been widely used in the electronics industry. Natural graphite film is made of natural flake graphite or coal tar pitch. After the raw material is acidified, it is heated to expand the interlayer of natural graphite to obtain a worm-like structure. Then, it is calendered with the bonding material under high temperature and high pressure to obtain a film-like graphite sheet. , but the thermal conductivity of natural graphite film generally does not exceed 400W / (m·K), and it is easy to lose powder and other shortcomings, so it is increasingly unable to meet the heat dissipation requi...

Embodiment 1

[0055] The embodiment of the present invention provides a high thermal conductivity graphite film-metal composite material, the preparation method of which is as follows:

[0056] S1. Gradually raise the temperature of the polyimide film to 1300°C to obtain a carbonized film;

[0057] Wherein, the heating process includes multi-stage heating;

[0058] In the first stage, the temperature is raised from room temperature to 300 ° C, and the heating time is 40 minutes;

[0059] In the second stage, the temperature rises from 300°C to 480°C, and the heating time is 50 minutes;

[0060] In the third stage, the temperature is raised from 480°C to 600°C, and the heating time is 420min;

[0061] The fourth stage of heating, from 600°C to 700°C, the heating time is 240min;

[0062] In the fifth stage, the temperature is raised from 700°C to 900°C, and the heating time is 200min;

[0063] In the sixth stage, the temperature is raised from 900°C to 1300°C, and the heating time is 200m...

Embodiment 2

[0080] The embodiment of the present invention provides a high thermal conductivity graphite film-metal composite material, the preparation method of which is as follows:

[0081] S1. Gradually raise the temperature of the polyimide film to 1400°C to obtain a carbonized film;

[0082] Wherein, the heating process includes multi-stage heating;

[0083] In the first stage, the temperature is raised from room temperature to 310°C, and the heating time is 35 minutes;

[0084] In the second stage, the temperature is raised from 310 ° C to 490 ° C, and the heating time is 50 minutes;

[0085] In the third stage, the temperature rises from 490°C to 590°C, and the heating time is 425min;

[0086] In the fourth stage, the temperature is raised from 590°C to 710°C, and the heating time is 245min;

[0087] In the fifth stage, the temperature rises from 710°C to 890°C, and the heating time is 205min;

[0088] The temperature is raised in the sixth stage, from 890°C to 1400°C, and the ...

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Abstract

The invention provides a preparation method of a high heat conductivity type graphite film-metal composite material, and relates to the field of materials. The method is characterized in that a vacuummagnetron sputtering mode is used; a metal layer is sputtered on the surface of a graphite film. Therefore, due to the metal layer, the surface structure of the graphite film is stable, and the problem that powder falls off from the graphite film can be solved; moreover, the heat dissipating performance, the flexibility, the longitudinal electricity conductivity, the pressure resistance, and thelike of the graphite film can be improved based on the intrinsic heat conducting performance and electricity conducting performance of metal. The high heat conductivity type graphite film-metal composite material is prepared according to the preparation method and is outstanding in heat dissipating performance, flexibility, longitudinal electricity conductivity, pressure resistance, and the like.

Description

technical field [0001] The invention relates to the field of materials, in particular to a high thermal conductivity graphite film-metal composite material and a preparation method thereof. Background technique [0002] With the rapid development of semiconductor technology and the increasingly high requirements for portable performance of digital products (such as mobile phones, tablet computers, etc.), it is urgent for relevant manufacturers to improve the utilization rate of the internal space of electronic products. The heat is not easy to discharge, and it is easy to accumulate rapidly to form high temperature. Obviously, high temperature will reduce the performance, reliability and service life of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/18C23C14/02
CPCC23C14/02C23C14/185C23C14/35
Inventor 吴国明
Owner 江苏墨泰新材料有限公司
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