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Metal-based copper surface anti-oxidizing enhancer used for pretreatment of PCB/FPC dry film and treatment method thereof
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An anti-oxidation, metal-based technology, applied in the direction of jewelry, etc., can solve the problems of anti-oxidation and bonding force, and achieve the effects of saving labor and time, improving bonding force, and strong temperature tolerance
Inactive Publication Date: 2019-01-29
SHENZHEN RUN SUN CHEM TECH
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[0004] The purpose of the present invention is to solve the problem of difficult balance between anti-oxidation and binding force in the prior art, and provide a medicament for anti-oxidation of copper foil before dry film or ink and other processes while improving the binding force between the surface of copper foil and dry film, etc. , in the production process, this kind of agent can replace the agent for anti-oxidation and chemical (micro-etching) or mechanical roughening before the process. It is deposited by chemical deposition or electrodeposition or a combination of composite or single The metal nano layer has dual functions of anti-oxidation and enhancing binding force on the copper surface
Method used
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Embodiment 1
[0024] 1) The copper surface anti-oxidation enhancer composition used for PCB / FPC dry film pretreatment, the composition is as follows:
[0034] At room temperature, prepare deionized water, appropriate amount (less than 1L), add zinc sulfate and nickel sulfate, stir, the solution is mixed evenly and the solution is clear, and solution A is obtained;
[0035] Add disodium ethylenediamine tetraacetate to the prepared solution A, stir, the solution is mixed evenly, and the solution is a stable sligh...
Embodiment 3
[0064] 1) Composition of copper surface anti-oxidation enhancer composition for PCB / FPC dry film pretreatment:
[0074] At room temperature, add nickel sulfate to deionized water, stir, the solution is mixed uniformly and the solution is clear, and solution A is obtained;
[0075] Add sodium citrate and ammoniumchloride to the prepared solution A, stir, the solution is mixed evenly, and the solution is a stable slightly turbid uniform liquid B;
[0076] Continue to add ammonia water to the prepared solution B, and stir evenly to ...
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Abstract
A metal-based copper surface anti-oxidizing enhancer used for pretreatment of a PCB / FPC dry film and a treatment method thereof. The invention relates to a metal-based copper surface anti-oxidizing enhancer composition for pretreatment of the PCB / FPC dry film. For solving the problems that it is difficult to give consideration to both anti-oxidization effect and combination force in the prior art,the enhancer includes 10-150 g / L of a metal main agent, 30-300 g / L of a complexing agent, 20-150 g / L of a pH regulator, 30-150 g / L of a reducing agent, and 0.001-1 g / L of an electric potentialregulator. The enhancer can adapt high-temperature production environment and can improve the combination force between the copper surface and the dry film, or printing ink or like, can omit chemical (micro-etching) or mechanical roughening step, that is, the enhancer has both functions. During production, the enhancer can completely replace chemical organic film anti-oxidizing and copper surface roughening processes at the same time, thus improving product quality, shortening process steps and saving labor intensity and time.
Description
technical field [0001] The invention relates to a metal-based copper surface anti-oxidation enhancer composition for pretreatment of PCB / FPC dry film, in particular to the field of anti-oxidation treatment of PCB, FPC and related copper foil surfaces. Background technique [0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The design, wiring, and production of printed circuit boards are all based on copper substrates. Copper is an active element, which is very easy to oxidize in the air. After oxidation, the conductivity of copper becomes poor, and the bonding force becomes lower. Therefore, anti-oxidation treatment of copper surface is required between processes. The current process technology is: after the substrate plate is electroplated, the organic composition is soaked for anti-oxidation, and then the copper surface is chemically or mechanically roughened by microetching or brushing. ...
Claims
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