A kind of ultra-high-purity tantalum with controllable structure and texture, its preparation method and application

Abstract

The invention relates to an ultra-pure tantalum with controllable tissues and textures and a preparation method and application thereof. The purity of ultra-pure tantalum is greater than or equal to 99.995%, the grain size degree is 45-80 [mu]m, the{100} texture content is not greater than 15% in the thickness direction of a panel, the {111}texture content is greater than or equal to 33%, the ultimate strength is 372-410 MPa, the yield strength is 260-287 MPa, the ductility is 41-46%, and the hardness is 87-89 HV. The preparation method comprises the steps of high vacuum degree (10<-4>Pa) electron beam smelting furnace, argon chamber stainless steel sleeve packaging, three-dimension heat forging cogging of cooperative control of gate forging deformation amount and total deformation amount,multiple variable angle control rolling and heat treatment, turning, packaging and the like. According to the process, the distribution of grain sizes and the grain size degree of finished products can be effectively controlled, and the finished products and texture distribution of the finished products in the thickness direction are effectively regulated and controlled. Necessary conditions areprovided for the finished products to be used as high-quality target materials.

Description

technical field [0001] The invention relates to an ultra-high-purity tantalum with controllable structure and texture, a preparation method and application thereof, and belongs to the technical field of design and preparation of special materials. Background technique [0002] Tantalum is a valve metal with high conductivity, high thermal stability and barrier effect on foreign atoms, so it is widely used in the new generation of information technology industry (computer, communication and other electronic equipment), advanced semiconductor materials, aerospace equipment, Biomedicine and high-performance medical devices and other fields. [0003] With the continuous development of the new generation of information technology industry technology, the demand for high-purity metal materials and sputtering targets will also increase, providing opportunities for the development of high-end non-ferrous metal materials industry. At the same time, it also has strict requirements on...

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Problems solved by technology

[0018] The purpose of the present invention is to overcome the uneven distribution of the grain size of the existing tantalum target for magnetron sputtering, the proportion of {111} texture is small, generally not more than 33%, and the proportion of {100} along the thickness direction of the target is more , and the distribution along the thickness direction is uneven, which leads to problems such as low effective use of the target and uneven thickness of the sputtered film.

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