Preparation method of metal helical micro-nano structure
A micro-nano structure and spiral technology, which is applied in micro-lithography exposure equipment, metal material coating process, photo-engraving process coating equipment, etc. Preparation process, reducing preparation cost, and protecting the effect of helical micro-nano structure
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Embodiment 1
[0024] A method for preparing a metal helical micro-nano structure, comprising the following steps:
[0025] Step 1: Prepare the glass substrate 100, prepare the ITO glass substrate 100 and wash and dry it for use;
[0026] in particular:
[0027] Prepare an ITO glass substrate 100 with a thickness of 1.0mm and a length and width of 20.0mm*20.0mm, and put the prepared ITO glass into a washing solution to clean it. After ultrasonication with deionized water for 15 minutes, ultrasonication with acetone for 15 minutes, and alcohol Sonicate for 15 minutes, then use deionized water to sonicate for 5 minutes, and finally dry it with a nitrogen gun and put it in a nitrogen cabinet for later use.
[0028] Step 2: Coating photoresist on the glass substrate 100, and throwing two layers of photoresist on the surface of the substrate 100 with a glue throwing machine;
[0029] in particular:
[0030] The concrete steps of described glue rejection are, as figure 2 As shown, on the prep...
Embodiment 2
[0048] The metal helical micro-nanostructure prepared in this example is roughly the same as the preparation process in Example 1.
[0049] Step 1: preparing a glass substrate 100;
[0050] Step 2: Coating photoresist, on the glass substrate 100, the thickness of the positive resist 101 is 80nm, and the thickness of the negative resist 102 is 30nm.
[0051] Step 3: Electron beam exposure structure graphics, design graphics such as the graphics proposed in Example 1, bombard the first rectangle 1, the second rectangle 2, the third rectangle 3 and the fourth rectangle 4 with different measurements respectively, and expose the first rectangle The depth of rectangle 1 is 50nm, the depth of exposed second rectangle 2 is 70nm, the depth of exposed third rectangle 3 is 90nm, and the depth of exposed fourth rectangle 4 is 110nm.
[0052] Step 4: Positive photolithography and fixing treatment;
[0053] Step five: vertically vapor-deposit the metal material 103 with an electron beam v...
Embodiment 3
[0058] For the metal helical micro-nano structure prepared in this example, only the pattern of the electron beam exposure structure in Step 3 in Example 1 is changed, and the pattern is designed by a pattern generator. The pattern is a six-close-packed periodic array structure, such as Figure 9 As shown, each unit of the six close-packed periodic array structure is a circle, and a ring is nested in each circular unit, and the ring is evenly divided into at least 4 equal parts. After the graphics are designed, different aliquots of the ring are sequentially exposed with a scanning electron microscope, and the exposure depths are different for different regions.
[0059] Other steps of the preparation method of this embodiment are the same as in Example 1.
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