The application provides a
semiconductor low-resistance
ohmic contact structure based on LSPR and a preparation method, and belongs to the field of semiconductors. The low-resistance
ohmic contact structure is integrated on the upper surface of the
contact layer of a
semiconductor epitaxial
wafer, and comprises, from bottom to top, a plasmonic functional layer, a transparent conductive layer and a
metal electrode; the plasmonic functional layer comprises a
metal nanostructure layer and a
dielectric spacer layer; the
metal nanostructure layer is composed of a periodic
nanoparticle array or a nanoisland array, is used for generating and regulating LSPR effect, and forms a strong local
electric field; the
dielectric spacer layer covers the surface and the periphery of the metal
nanostructure layer, is used for passivating the metal nanostructure layer, fixing the LSPR characteristics of the metal nanostructure layer, and providing a controllable spacing. The application directly reduces the
Schottky barrier through the
physical field modulation effect of plasmonic
resonance, realizes a substantial reduction of the
contact resistance under the premise that the light
transmittance of the transparent conductive layer is not significantly sacrificed, and solves the contradiction between high transparency and
low resistance in the prior art.