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Conductive paste and method for forming conductive pattern

A conductivity and patterning technology, which is applied in the formation of conductive patterns, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve problems such as difficult to print with thin lines, poor transfer of substrates, etc.

Active Publication Date: 2020-12-29
BANDO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, a solvent with high swelling property is easy to impart printing adaptability, but on the other hand, it is especially difficult to use for fine line printing of 5 μm or less
Specifically, the amount of solvent contained in the conductive paste printed as an ultra-fine line pattern is extremely small, so when a solvent with a high swelling rate to the rubber sheet is used, it dries quickly and causes transfer to the substrate. Poor printing

Method used

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  • Conductive paste and method for forming conductive pattern
  • Conductive paste and method for forming conductive pattern
  • Conductive paste and method for forming conductive pattern

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0124] 9.0 g of 3-methoxypropylamine (a primary reagent manufactured by Wako Pure Chemical Industries, Ltd.), and 0.2 g of DISPERBYK-102 (DISPERBYK)-102 as a polymer dispersant Chemicals (manufactured by BYK Chemie)) were mixed and fully stirred with a magnetic stirrer to generate an amine mixed liquid. Then, while stirring, 3.0 g of silver oxalate was added. After the silver oxalate was added, stirring was continued at room temperature to change the silver oxalate into a viscous white substance, and the stirring was terminated when it was confirmed that the change was complete in appearance.

[0125] The obtained mixed solution was transferred to an oil bath, and heated and stirred at 120°C. Immediately after the start of stirring, the reaction accompanied by the generation of carbon dioxide was started, and then the stirring was continued until the generation of carbon dioxide was completed, thereby obtaining a suspension in which silver microparticles were suspended in the...

Embodiment 2

[0143] For 80 parts by weight of silver nanoparticle slurry obtained in the same manner as in Example 1, the organic solvent added was changed to 17 parts by weight from 1,3-butanediol (a first-class reagent manufactured by Wako Pure Chemical Industry Co., Ltd.). An implementation conductive paste 2 was obtained in the same manner as in Example 1 except that 2 ethyl-1,3-hexanediol isomer mixture (first-class reagent manufactured by Wako Pure Chemical Industries, Ltd.) was used. Moreover, the evaluation of implementing the electrically conductive paste 2 was performed similarly to Example 1, and the obtained result is shown in Table 2.

Embodiment 3

[0145] Add 3 parts by weight of S-REC KS-10 (manufactured by Sekisui Chemical Co., Ltd.) ), 0.5 parts by weight of Kulistasen (Crystasense) MP (manufactured by Kuo De (CLODA) company) as a thixotropic agent, 0.5 parts by weight of Susperse (SOLSPERSE) 41000 (SOLSPERSE) 41000 (Japan) as a polymer dispersant Lubrizol (manufactured by Japan Lubrizol)) dissolved in 16 parts by weight of 2 ethyl-1,3-hexanediol isomer mixture (a primary reagent manufactured by Wako Pure Chemical Industries, Ltd.) Except having added 20 weight part of solutions in total, it carried out similarly to Example 1, and obtained the implementation conductive paste 3. Moreover, the evaluation of implementing the electrically conductive paste 3 was performed similarly to Example 1, and the obtained result is shown in Table 2.

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Abstract

The present invention provides a conductive paste capable of forming a fine conductive pattern with sufficient conductivity and good adhesion to a substrate and a method for forming a conductive pattern, and more specifically, provides a method that can be printed using gravure offset A conductive paste for forming a conductive pattern with a line width of 5 μm or less and a method for forming a conductive pattern. The conductive paste includes silver microparticles and an organic solvent, and the organic solvent includes a low-swellability organic solvent with a rubber sheet swelling rate of 2.0% or less, and the content of the low-swellability organic solvent is 3.0 wt% to 3.0% by weight. 30 wt%.

Description

technical field [0001] The present invention relates to a conductive paste and a method for forming a conductive pattern using the conductive paste. The conductive paste is used to form wiring or electrode patterns of semiconductor integrated circuits and the like and contributes to the formation of conductive patterns. Thinning. Background technique [0002] Since ink formulations containing silver nanoparticles show good printing results, silver nanoparticle technology has recently been actively researched and developed for printed electronics applications. [0003] In addition, in recent years, among the above-mentioned printed electronics, methods using printing methods such as letterpress printing, gravure printing, screen printing, or inkjet printing have been proposed as simpler and less expensive methods of forming conductive film patterns, Conductive inks, conductive pastes, and the like suitable for these printing methods are being actively researched and develope...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22C09D11/52H01B13/00H05K1/09H05K3/12
CPCC09D11/52H01B1/22H01B13/00H05K1/09H05K3/12
Inventor 新谷祐树外村卓也
Owner BANDO CHEM IND LTD
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