Heat-conducting adhesive containing graphene as well as preparation method and application of heat-conducting adhesive

A heat-conducting adhesive and graphene technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of large diameter-thickness ratio of graphene materials, easy agglomeration, and difficult dispersion of nanomaterials. Achieve the effects of reducing interface thermal resistance, simple preparation process, and cost reduction

Inactive Publication Date: 2019-03-08
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process overcomes the problems of using mechanical stirring and other conventional processes in the preparation process due to the large diameter-thickness ratio of graphene materials, easy agglomeration, and difficulty in dispersing as nanomaterials.

Method used

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  • Heat-conducting adhesive containing graphene as well as preparation method and application of heat-conducting adhesive
  • Heat-conducting adhesive containing graphene as well as preparation method and application of heat-conducting adhesive
  • Heat-conducting adhesive containing graphene as well as preparation method and application of heat-conducting adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Put 1g of intercalated graphene powder, 20g of spherical alumina filler with an average particle size of 3 μm, 100g of acrylic resin with a solid content of 45% and 1g of isocyanate into a ball mill jar, and stir for 10 minutes at a speed of 100 rpm. Add 100 g of zirconia balls to the ball mill jar. The mixture was ball milled at a speed of 400 rpm for 10 hours. After the ball milling is completed, the mixture is taken out to obtain a graphene-containing thermally conductive adhesive composite material.

[0034] figure 1 Optical photographs of the prepared thermally conductive adhesive, figure 2 It can be seen from the scanning electron microscope photos that the graphene and alumina in the composite material are uniformly dispersed, and the graphene and alumina overlap and cooperate with each other to form a uniform and effective heat conduction network structure. Since the macroscopic and microscopic structures of the thermally conductive adhesives prepared in the...

Embodiment 2

[0037] Put 1g of intercalated graphene powder, 15g of aluminum nitride powder with an average particle size of 1 μm, 100g of acrylic resin with a solid content of 45% and 1g of isocyanate into a ball mill jar, and stir for 10 minutes at a speed of 100 rpm. Add 100 g of zirconia balls to the ball mill jar. The mixture was ball milled at a speed of 400 rpm for 10 hours. After the ball milling is completed, the mixture is taken out to obtain a graphene-containing thermally conductive adhesive composite material.

[0038] The thermal conductivity of the prepared graphene thermally conductive adhesive was measured to be 0.95W / mK. use Figure 5 The device shown is tested for cooling effect. The composite heat-dissipating film prepared by using this heat-conducting adhesive dissipates heat, and the center temperature of the ceramic heating sheet is 88.2°C.

Embodiment 3

[0040] Put 1g of electrolytic graphene powder, 15g of boron nitride powder with an average particle size of 1 μm, 100g of acrylic resin with a solid content of 45%, and 1g of isocyanate into a ball mill jar, and stir for 10 minutes at a speed of 100 rpm. Add 100 g of zirconia balls to the ball mill jar. The mixture was ball milled at a speed of 400 rpm for 10 hours. After the ball milling is completed, the mixture is taken out to obtain a graphene-containing thermally conductive adhesive composite material.

[0041] The thermal conductivity of the prepared graphene thermally conductive adhesive was measured to be 0.88W / mK. use Figure 5 The device shown is tested for cooling effect. The composite heat-dissipating film prepared by using this heat-conducting adhesive dissipates heat, and the center temperature of the ceramic heating sheet is 90.4°C.

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Abstract

The invention discloses a heat-conducting adhesive containing graphene as well as a preparation method and an application of the heat-conducting adhesive, and belongs to the technical field of new materials and applications of the new materials. The graphene composite heat-conducting adhesive material is prepared from graphene and conventional packing used cooperatively as heat-conducting packingas well as acrylic resin and other auxiliaries as a matrix with a simple process. Graphene and the conventional packing in the composite material are uniformly dispersed, the characteristics of high heat conductivity of graphene and massive filling capacity of the conventional packing are fully played, the prepared heat-conducting adhesive has properties remarkably better than those of a traditional heat-conducting adhesive, and heat-dissipating and cooling effects of electronic devices can be remarkably improved. The graphene composite heat-conducting adhesive adopts a simple process, can realize large-scale industrial production and can be taken as a novel efficient heat-conducting interface material to be applied to heat dissipation of electronic equipment independently or by cooperation with the base.

Description

technical field [0001] The invention relates to the technical field of new materials and their applications, in particular to a heat-conducting adhesive containing graphene and its preparation method and application. Background technique [0002] With the development of science and technology, the miniaturization and multi-functionalization of electronic components put forward higher requirements for the heat dissipation of the devices. The heat dissipation of devices has become a technical "bottleneck" faced by the rapidly developing telecom industry. The thermal resistance analysis shows that the interface thermal resistance between the device and the heat sink is large. The reason is that the solid surface is rough and uneven on the microscopic scale. Even if the contact pressure of the two solid surfaces is as high as 10 MPa, the actual contact area only accounts for 1-2% of the apparent contact area, and the rest is a microscopic surface filled with air. porosity. Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/00C09J11/04
CPCC08K2003/282C08K2003/385C09J11/04C09J133/00C08K9/00C08K3/042C08K7/18C08K3/28C08K3/38
Inventor 任文才马超群黄坤刘海超裴嵩峰成会明
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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