A kind of anti-cracking computer heat-conducting silicone grease and preparation method thereof

A heat-conducting silicone grease and computer technology, applied in the direction of chemical instruments and methods, heat exchange materials, etc., can solve the problems affecting the overall performance and service life of the computer, the reduction of thermal conductivity, troublesome hands-on ability, etc., to achieve good performance and improve heat conduction The effect of performance and easy maintenance

Active Publication Date: 2021-05-04
苏州博讯新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing thermal conductive silicone grease can generally meet the basic needs of heat conduction, but the thermal conductive silicone grease will gradually dry out after a period of use, resulting in a significant decrease in thermal conductivity. At this time, it is necessary to replace the thermal conductive silicone grease. It is more troublesome for people with poor ability. Many users have not replaced the thermal grease after using the computer for a long time, which causes some hardware of the computer to always be in a high temperature working state, which affects the overall performance and service life of the computer.

Method used

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  • A kind of anti-cracking computer heat-conducting silicone grease and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] An anti-cracking computer heat-conducting silicone grease, including the following raw materials in parts by weight: 30 parts of methyl silicone oil, 2 parts of vinyltrimethoxysilane, 3 parts of octylphenol polyoxyethylene ether, 6 parts of aluminum oxide, zinc oxide 4 parts, 3 parts of graphene, 4 parts of nano-silver, 5 parts of diamond powder, 1 part of ethylene glycol distearate, 2 parts of coupling agent, 2 parts of di(hydrogenated tallow) phthalic acid amide, 1 part of disodium diamine tetraacetate, 30 parts of absolute ethanol.

[0022] Wherein, the coupling agent is silane coupling agent KH560.

[0023] Wherein, the particle size of the diamond micropowder is not greater than 5 μm.

[0024] In this embodiment, the preparation method of the anti-cracking computer thermal grease, the steps are as follows:

[0025] 1) Mix vinyltrimethoxysilane, octylphenol polyoxyethylene ether, aluminum oxide, zinc oxide, graphene, ethylene glycol distearate, coupling agent, and...

Embodiment 2

[0030] A kind of anti-cracking computer heat-conducting silicone grease, including the following raw materials in parts by weight: 35 parts of methyl silicone oil, 3 parts of vinyltrimethoxysilane, 4 parts of octylphenol polyoxyethylene ether, 8 parts of aluminum oxide, zinc oxide 5 parts, 4 parts of graphene, 5 parts of nano-silver, 6 parts of diamond powder, 1.8 parts of ethylene glycol distearate, 4 parts of coupling agent, 5 parts of di(hydrogenated tallow) phthalic acid amide, 1.8 parts of disodium diamine tetraacetate, 45 parts of absolute ethanol.

[0031] Wherein, the coupling agent is silane coupling agent KH560.

[0032] Wherein, the particle size of the diamond micropowder is not greater than 5 μm.

[0033] In this embodiment, the preparation method of the anti-cracking computer thermal grease, the steps are as follows:

[0034] 1) Mix vinyltrimethoxysilane, octylphenol polyoxyethylene ether, aluminum oxide, zinc oxide, graphene, ethylene glycol distearate, coupli...

Embodiment 3

[0039] An anti-cracking computer heat-conducting silicone grease, comprising the following raw materials in parts by weight: 40 parts of methyl silicone oil, 4 parts of vinyltrimethoxysilane, 5 parts of octylphenol polyoxyethylene ether, 9 parts of aluminum oxide, zinc oxide 6 parts, 4.5 parts of graphene, 6 parts of nano-silver, 7 parts of diamond powder, 1.5 parts of ethylene glycol distearate, 3.5 parts of coupling agent, 3.5 parts of di(hydrogenated tallow base) phthalic acid amide, 1.5 parts of disodium diamine tetraacetate, 40 parts of absolute ethanol.

[0040] Wherein, the coupling agent is silane coupling agent KH560.

[0041] Wherein, the particle size of the diamond micropowder is not greater than 5 μm.

[0042] In this embodiment, the preparation method of the anti-cracking computer thermal grease, the steps are as follows:

[0043] 1) Mix vinyltrimethoxysilane, octylphenol polyoxyethylene ether, aluminum oxide, zinc oxide, graphene, ethylene glycol distearate, c...

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Abstract

The invention relates to the technical field of computer heat dissipation, and discloses a computer heat-conducting silicone grease for preventing dryness and cracking, which comprises the following raw materials in parts by weight: 30-50 parts of methyl silicone oil, 2-6 parts of vinyltrimethoxysilane, and octylphenol 3‑7 parts of polyoxyethylene ether, 6‑12 parts of aluminum oxide, 4‑8 parts of zinc oxide, 3‑6 parts of graphene, 4‑8 parts of nano silver, 5‑10 parts of diamond micropowder, ethylene glycol distearate 1-2 parts of acid ester, 2-5 parts of coupling agent, 2-6 parts of di(hydrogenated tallow) phthalic acid amide, 1-2 parts of disodium edetate, 30-50 parts of absolute ethanol . The invention also discloses a preparation method of the anti-drying and cracking computer heat-conducting silicone grease. The thermal conductive silicone grease prepared by the invention has good thermal conductivity, is not easy to volatilize in a high-temperature environment, and can effectively assist components to dissipate heat.

Description

technical field [0001] The invention relates to the technical field of computer heat dissipation, in particular to an anti-cracking computer heat-conducting silicone grease and a preparation method thereof. Background technique [0002] Thermally conductive silicone grease is commonly known as heat dissipation paste. Thermally conductive silicone grease is made of organic silicone as the main raw material, and materials with excellent heat resistance and thermal conductivity are added to form a thermally conductive silicone grease compound. It is used in power amplifiers, transistors, electronic tubes and other electronic components. The heat conduction and heat dissipation of the original device, so as to ensure the stability of the electrical performance of electronic instruments and meters. When the computer is working, the CPU and GPU will generate a lot of heat. In order to prevent the high temperature from affecting the performance, the CPU and GPU generally coat a lay...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/04C08L71/02C08K3/22C08K3/04C08K3/08C09K5/14
CPCC08K2003/0806C08K2003/2227C08K2003/2296C08K2201/011C08L83/04C09K5/14C08L71/02C08K3/22C08K3/04C08K3/08C08K3/042
Inventor 徐尚
Owner 苏州博讯新材料科技有限公司
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