Large-height-width-ratio microstructure transfer printing method

Abstract

The invention relates to a large-aspect-ratio microstructure transfer printing method. According to the method, the template with the convex micro-nano structure is used as a mother mold, the liquid polydimethylsiloxane(PDMS) is poured to the mother mold, and heating is carried out to manufacture the PDMS soft die; a liquid conductive material is filled into the groove of the PDMS soft die throughan electric wetting auxiliary scraping and coating mode, and the conductive material is pre-cured at a certain temperature; the conductive material is transferred to the target substrate through a UVauxiliary transfer printing technology; the conductive structure on the target substrate is further processed to obtain the conductive structure which is good in consistency, high in precision and excellent in electric conduction performance.

Description

technical field [0001] The invention belongs to the technical field of micro-nano manufacturing, and in particular relates to a large aspect ratio microstructure transfer printing method. Background technique [0002] Micro-nano devices have broad application prospects in information, energy, medical, national defense and other fields, and are developing in the direction of intelligence and flexibility in recent years. The manufacturing technology and level of micro-nano directly determine the comprehensive performance of micro-components such as solar panels, micro-LEDs, flexible conductive films, sensors, biological devices, and wearable electronic devices. With the integration and development of multiple disciplines, more fields need to integrate micro-nano functional structural devices to meet different application requirements, thus posing new challenges to the manufacture of micro-nano structures. Micro-nano manufacturing technology requires low manufacturing cost, un...

AI Technical Summary

Problems solved by technology

[0003] Compared with positive transfer printing, negative transfer printing and printing transfer printing, ink transfer printing has the advantages of lower cost, lower environmental requirements in the process and higher efficiency, and is more suitable for micro-nano devices with high yield requirements However, for the transfer printing of devices requiring large aspect ratio microstructures, the success rate of ink transfer is low or it is difficult to achieve the transfer printing of large aspect ratio microstructures, while in OLED, RFID, solar cells, In many fields of optoelectronics, such as touch display screen, transparent electric heating film, transparent electrode, etc., the conductive microstructure with large aspect ratio can meet the higher demand of optoelectronic performance.

Therefore, the current micro-transfer printing technology is difficult to achieve the effective transfer of high-aspect-ratio microstructures, which has become a major bottleneck for its wide application.

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