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Method for molding high-frequency and high-speed acrylic resin copper-cladded plate

A nitrile-based resin and molding process technology, which is applied in the field of high-frequency and high-speed nitrile resin copper-clad laminate molding technology, can solve the problems of increased residual copper-clad laminates, cumbersome dispersion steps, low efficiency, etc., and achieve outstanding dielectric properties , the synthetic method is simple, the effect of high efficiency

Active Publication Date: 2019-03-26
汕头超声覆铜板科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional CCL preparation process includes filler modification of the resin matrix, filler dispersion, resin pretreatment, gluing, resin curing and molding, etc. The steps of filler modification and dispersion are cumbersome and inefficient, which easily lead to defective CCL products. volume increase

Method used

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  • Method for molding high-frequency and high-speed acrylic resin copper-cladded plate
  • Method for molding high-frequency and high-speed acrylic resin copper-cladded plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041](1) Synthesis of Nitrile Resin

[0042] (1) First, dry bisphenol S, 4-(3-aminophenoxy)phthalonitrile, and paraformaldehyde in a drying oven at 80°C for 2 hours;

[0043] (2) 28 grams of bisphenol S, 42 grams of 4-(3-aminophenoxy) phthalonitrile, 3.5 grams of aniline, and 12 grams of paraformaldehyde were added to a tank containing 23.2 grams of DMF and 11.6 grams of toluene In the three-necked flask, stir at room temperature at 120 rpm for 10 minutes, then raise the temperature to 100 °C at a heating rate of 5 °C / min, keep the stirring speed at 120 rpm, and keep the temperature constant until the end of the reaction. The constant temperature reaction time is 6 hours;

[0044] (3) After the reaction, raise the temperature to 130°C, keep stirring at a constant temperature to continue the reaction for 2.5 hours, and distill 10 grams of toluene solvent;

[0045] (4) After the reaction, a viscous brown liquid is obtained, which is a nitrile-based resin that can be used in th...

Embodiment 2

[0054] (1) Synthesis of Nitrile Resin

[0055] (1) First, dry bisphenol A, 4-(3-aminophenoxy)phthalonitrile, and paraformaldehyde in a drying oven at 80° C. for 2 hours;

[0056] (2) 22.8 grams of bisphenol A, 42 grams of 4-(3-aminophenoxy) phthalonitrile, 3.5 grams of aniline, and 12 grams of paraformaldehyde were added to a tank containing 23.2 grams of DMF and 11.6 grams of toluene In the three-necked flask, stir at room temperature at 120 rpm for 10 minutes, then raise the temperature to 110 °C at a heating rate of 5 °C / min, keep the stirring speed at 120 rpm, and keep the temperature constant until the end of the reaction. The constant temperature reaction time is 5 hours;

[0057] (3) After the reaction is completed, the temperature is raised to 135° C., and the reaction is continued for 2.5 hours while stirring at a constant temperature, and 10 grams of toluene solvent is evaporated;

[0058] (4) After the reaction, a viscous brown liquid is obtained, which is a nitril...

Embodiment 3

[0067] (1) Synthesis of Nitrile Resin

[0068] (1) First, phenolphthalein, 4-(4-aminophenoxy)phthalonitrile, and paraformaldehyde were dried in a drying oven at 80° C. for 2 hours;

[0069] (2) Add 31.8 grams of phenolphthalein, 40 grams of 4-(4-aminophenoxy)phthalonitrile, 4.65 grams of benzene, and 12 grams of paraformaldehyde to a three-necked flask containing 30.3 grams of DMF and 15.1 grams of toluene in sequence , after stirring at 120 rpm at room temperature for 10 minutes, the temperature was raised to 110 °C at a heating rate of 5 °C / min, and the stirring speed was maintained at 120 rpm, and the temperature was kept constant until the reaction was completed, and the constant temperature reaction time was 4 hours;

[0070] (3) After the reaction, the temperature was raised to 130° C., and the reaction was continued for 3 hours while stirring at a constant temperature, and 14 grams of toluene solvent was evaporated;

[0071] (4) A viscous tan liquid is obtained after t...

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Abstract

The invention discloses a process for molding a high-frequency and high-speed acrylic resin copper-cladded plate. The process mainly comprises acrylic resin synthesis and an acrylic resin copper-cladded plate molding process, wherein solute in preparation of the acrylic resin is aromatic diphenol, arylamine and paraformaldehyde, solvent is N,N-dimethyl formamide and methylbenzene, and the molar ratio of the solute to the solvent is 1:(0.3-0.6), and an acrylic resin monomer with controllable structure can be obtained according to a reaction structural formula in a certain proportion; then, thehigh-frequency high-speed acrylic resin copper-cladded plate can be directly obtained by combining a copper-cladding and laminating process and optimizing reaction steps and reaction parameters. The high-frequency high-speed acrylic resin copper-cladded plate has high heat resistance, high TG, no halogen and excellent flame retardance. Compared with a traditional copper-cladded plate molding process, the process has the advantages that rubber mixing or particle modification and dispersion is not required, steps are simple, and efficiency is relatively high.

Description

technical field [0001] The invention relates to the technical field of preparation and manufacture of polymer-based composite materials, and more specifically relates to a molding process of high-frequency and high-speed nitrile-based resin copper-clad laminates. Background technique [0002] With the rapid development of the information industry and the electronics industry represented by smart electronic products, digital circuits have gradually stepped into the stage of high-speed information processing and high-frequency signal transmission, and the entire electronic system is moving towards light, thin, multi-functional, high-density, Develop in the direction of high reliability and low cost. [0003] The molding process of the substrate material greatly affects the electron transmission performance, reliability and cost of high-frequency and high-speed copper-clad laminates. The traditional CCL preparation process includes filler modification of the resin matrix, fill...

Claims

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Application Information

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IPC IPC(8): C08J5/24C08G14/06C08L61/34C08K7/14
CPCC08G14/06C08J5/24C08J2361/34C08K7/14
Inventor 徐明珍刘孝波黄少伟郭瑞珂王岳群王东林
Owner 汕头超声覆铜板科技有限公司
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