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Method for preparing carrier resin for high-temperature-resistant molding process coloring materials

A technology of carrier resin and coloring material, applied in the field of preparation of carrier resin for color paste, can solve the problems of high price, strength aging and heat resistance, poor color paste stability, etc., to reduce the amount of small molecules and improve the resistance The effect of high temperature performance

Inactive Publication Date: 2019-04-05
镇江利德尔复合材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Monomers often have the following disadvantages: first, the price is high; second, the prepared color paste has poor stability and is easy to delaminate; third, when used, it has poor compatibility with unsaturated polyester resin and affects the quality of the finished product. intensity; four is a certain smell
Low-reactivity unsaturated polyester often has the following disadvantages: First, when used, it affects the performance of unsaturated polyester resin, especially strength, aging and heat resistance; second, due to low reactivity, there will be more volatiles, Harmful to the human body and the environment; third, insufficient flexibility; fourth, affects the strength of the product to a certain extent

Method used

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  • Method for preparing carrier resin for high-temperature-resistant molding process coloring materials
  • Method for preparing carrier resin for high-temperature-resistant molding process coloring materials
  • Method for preparing carrier resin for high-temperature-resistant molding process coloring materials

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preparation example Construction

[0031] The invention provides a method for preparing a carrier resin used in a high temperature resistant molding process coloring material, comprising the following steps:

[0032] Step 1: Mix and stir 70-100 parts of dihydric alcohol, 60-100 parts of polybasic acid and 15-25 parts of dianhydride in a nitrogen atmosphere according to the parts by weight, and gradually heat up to 195-235°C for condensation reaction. After the reaction system becomes uniform and transparent, keep warm and continue the reaction until the measured acidity value of the reaction product is less than or equal to 18mgKOH / g, wherein the dihydric alcohol is diethylene glycol or dipropylene glycol, and the polybasic acid is adipic acid Or sebacic acid, the dianhydride is maleic anhydride.

[0033] Gradually raise the temperature to 195-235°C to carry out the condensation reaction, and the heating rate satisfies:

[0034]

[0035] Among them, V Tu is the heating rate (°C / h), ζ is the temperature ris...

Embodiment 1

[0043] Step 1: According to the parts by weight, mix and stir 70 parts of diethylene glycol, 60 parts of adipic acid and 15 parts of maleic anhydride in a nitrogen atmosphere, the stirring speed is 5r / s, and gradually heat up to 195 Condensation reaction is carried out at ℃, after the reaction system becomes uniform and transparent, keep warm and continue the reaction until the measured acidity value of the reaction product is less than or equal to 18mgKOH / g.

[0044] The initial viscosity of the mixed solution is 4.0mPa·s, the mass fraction of diethylene glycol in the mixed solution is 0.48, the mass fraction of adipic acid in the mixed solution is 0.41, and the mass fraction of maleic anhydride in the mixed solution The mass fraction in is 0.11.

[0045] Gradually raise the temperature to 195°C to carry out the condensation reaction, and the heating rate satisfies:

[0046]

[0047] When diethylene glycol, adipic acid and maleic anhydride are mixed and stirred under a ni...

Embodiment 2

[0054] Step 1: According to the parts by weight, mix and stir 100 parts of dipropylene glycol, 100 parts of sebacic acid and 25 parts of maleic anhydride in a nitrogen atmosphere, the stirring speed is 7r / s, and the temperature is gradually raised to 235°C Carry out the condensation reaction, after the reaction system becomes uniform and transparent, keep warm and continue the reaction until the acidity value of the reaction product is less than or equal to 18mgKOH / g.

[0055] The initial viscosity of the mixed solution is 4.5mPa·s, the mass fraction of dipropylene glycol in the mixed solution is 0.44, the mass fraction of adipic acid in the mixed solution is 0.44, and the mass fraction of maleic anhydride in the mixed solution The mass fraction is 0.12.

[0056] Gradually raise the temperature to 195°C to carry out the condensation reaction, and the heating rate satisfies:

[0057]

[0058] When dipropylene glycol, sebacic acid and maleic anhydride are mixed and stirred u...

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Abstract

The invention discloses a method for preparing carrier resin for high-temperature-resistant molding process coloring materials. The method includes steps of 1, uniformly mixing and stirring, by weight, 70-100 parts of dihydric alcohol, 60-100 parts of polyacid and 15-25 parts of diacid anhydride with one another to obtain first mixtures in nitrogen atmosphere, gradually heating the first mixturesuntil the temperatures of the first mixtures reach 195-235 DEG C, carrying out condensation reaction, preserving heat after reaction systems become uniform and transparent, and continuing to carry outreaction; 2, cooling products obtained at the step 1 until the temperatures of the products reach 175-185 DEG C, adding 7-8 parts of p-dihydroxybenzene into the products, uniformly stirring the p-dihydroxybenzene and the products to obtain second mixtures, then cooling the second mixtures until the temperatures of the second mixtures are lower than 45 DEG C, and filtering the second mixtures to obtain the carrier resin. The method for preparing the carrier resin for the high-temperature-resistant molding process coloring materials has the advantages that the dihydric alcohol, the polyacid anddiacid are mixed with one another to obtain the first mixtures in the nitrogen atmosphere, the first mixtures are heated until the temperatures of the first mixtures reach 195-235 DEG C, the condensation reaction is carried out, the heating rates can be accurately controlled, accordingly, products only contain few small molecules and are in excellent liquid states, and the high-temperature resistance of the products can be improved.

Description

technical field [0001] The invention relates to the technical field of preparation of a carrier resin for color paste, and more specifically, the invention relates to a method for preparing a carrier resin used for coloring materials in a high-temperature-resistant molding process. Background technique [0002] Compression molding (also known as compression molding or compression molding) is to put the powdery, granular or fibrous plastic impregnated with color paste into the mold cavity at the molding temperature, and then close the mold and pressurize it to form and solidify. Operation. The compression molding process uses the characteristics of each stage in the resin curing reaction to realize product molding, that is, the molding material is plasticized, flows and fills the mold cavity, and the resin is cured. During the flow process of the molding material filling the mold cavity, not only the resin flows, but also the reinforcing material flows with it. Therefore, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G63/676
CPCC08G63/676
Inventor 谢富平邱丰曹统洲
Owner 镇江利德尔复合材料有限公司
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