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Copper electroplating additive and preparation method thereof

An additive and electroplating copper technology, applied in the field of electroplating copper additive and its preparation, can solve the problems of easy deposition of anode slime and low electroplating Tp value, etc., and achieve the effect of reducing anode slime and high electroplating Tp value

Inactive Publication Date: 2019-04-12
南通赛可特电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Current bath additives, especially current levelers, do not always provide level copper deposits between the substrate surface and filled vias and blind holes, tend to deposit anode slime, and have relatively low plating Tp values

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] The electroplating copper additive consists of the following raw materials in parts by weight:

[0038] 50% sulfuric acid 5kg;

[0039] Copper sulfate 1kg;

[0040] Sodium polydisulfide dipropane sulfonate 1kg;

[0041] Propanesulfonic acid pyridinium salt 1kg;

[0042] Alkyl dimethyl ammonium chloride and sulfur dioxide polymerized quaternary ammonium salt 1kg;

[0043] Polyoxyethylene-polypropylene oxide monobutyl ether 80kg;

[0044] PEG 1kg.

[0045] The preparation method of electroplating copper additive, concrete preparation steps are:

[0046] 1.1 Add about 85L of pure water and start stirring;

[0047] 1.2 Add the specified amount of sulfuric acid and stir until completely dissolved;

[0048] 1.3 Add the specified amount of copper sulfate and stir until completely dissolved;

[0049] 1.4 Add the specified amount of sodium polydisulfide dipropane sulfonate and stir until completely dissolved;

[0050] 1.5 Add the specified amount of propanesulfonic acid...

Embodiment 2

[0056] The electroplating copper additive consists of the following raw materials in parts by weight:

[0057] 50% sulfuric acid 10kg;

[0058] Copper sulfate 5kg;

[0059] Sodium polydithiodipropane sulfonate 6kg;

[0060] Propanesulfonic acid pyridinium salt 6kg;

[0061] Alkyl dimethyl ammonium chloride and sulfur dioxide polymerization quaternary ammonium salt 5kg;

[0062] Polyoxyethylene-polypropylene oxide monobutyl ether 150kg;

[0063] PEG 1-8kg.

[0064] The preparation method of electroplating copper additive, concrete preparation steps are:

[0065] 1.1 Add about 85L of pure water and start stirring;

[0066] 1.2 Add the specified amount of sulfuric acid and stir until completely dissolved;

[0067] 1.3 Add the specified amount of copper sulfate and stir until completely dissolved;

[0068] 1.4 Add the specified amount of sodium polydisulfide dipropane sulfonate and stir until completely dissolved;

[0069] 1.5 Add the specified amount of propanesulfonic a...

Embodiment 3

[0075] The electroplating copper additive consists of the following raw materials in parts by weight:

[0076] 50% sulfuric acid 7kg;

[0077] Copper sulfate 3kg;

[0078] Sodium polydisulfide dipropane sulfonate 4kg;

[0079] Propanesulfonic acid pyridinium salt 3kg;

[0080] Alkyl dimethyl ammonium chloride and sulfur dioxide polymerized quaternary ammonium salt 2kg;

[0081] Polyoxyethylene-polypropylene oxide monobutyl ether 100kg;

[0082] PEG 5kg.

[0083] The preparation method of electroplating copper additive, concrete preparation steps are:

[0084] 1.1 Add about 85L of pure water and start stirring;

[0085] 1.2 Add the specified amount of sulfuric acid and stir until completely dissolved;

[0086] 1.3 Add the specified amount of copper sulfate and stir until completely dissolved;

[0087] 1.4 Add the specified amount of sodium polydisulfide dipropane sulfonate and stir until completely dissolved;

[0088] 1.5 Add the specified amount of propanesulfonic acid ...

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PUM

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Abstract

The invention discloses a copper electroplating additive and a preparation method of the copper electroplating additive. The copper electroplating additive is prepared from, by weight, 5-10kg of 50% sulfuric acid, 1-5kg of copper sulfate, 1-6kg of bis-(sodium sulfopropyl)-disulfide, 1-6kg of propane pyridinium sulfonate salt, 1-5kg of alkyl dimethyl ammonium chloride and sulfur dioxide polymerizedquaternary ammonium salt, 80-150kg of polyoxycyclohexane-polypropylene oxide monobutyl ether and 1-8kg of PEG. The preparation method comprises the specific steps that 1.1, about 85 L of pure water is added, and stirring is started; 1.2, sulfuric acid is added and stirred till being completely dissolved; 1.3, copper sulfate is added and stirred till being completely dissolved; 1.4, bis-(sodium sulfopropyl)-disulfide is added and stirred till being completely dissolved; 1.5, propane pyridinium sulfonate salt is added and stirred till being completely dissolved; 1.6, alkyl dimethyl ammonium chloride and sulfur dioxide polymerized quaternary ammonium salt are added and stirred till being completely dissolved; 1.7, polyoxycyclohexane-polypropylene oxide monobutyl ether is added and stirred till being completely dissolved; and 1.8, PEG8000 is added and stirred till being completely dissolved. Brightness of an electroplated copper layer can be ensured, plate burning is prevented, anode slime is reduced, and the electroplating Tp value is high.

Description

technical field [0001] The invention relates to an electroplating copper additive and a preparation method thereof. Background technique [0002] Electrolytic copper plating solutions are used in a variety of industrial applications, such as decorative and anti-corrosion coatings, and in the electronics industry, especially in the manufacture of printed circuit boards and semiconductors. Printed Circuit Board (PCB) is one of the important components of the electronics industry and is the support of electronic components. Generally, the process of manufacturing printed circuit boards includes double-sided copper cladding → mechanical processing → copper sinking → film (screen printing) → electroplating copper → electroplating tin → etching → stripping tin → processing. For circuit board manufacturing, copper is plated on selected portions of the printed circuit board surface, in blind holes and trenches, and on the walls of through-holes passing between the surfaces of the c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 刘政刘波隋广宇
Owner 南通赛可特电子有限公司
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