A gradient structure tialsiyn multi-component nano-coating and preparation method thereof
A gradient structure, nano-coating technology, applied in coating, metal material coating process, vacuum evaporation plating, etc.
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Embodiment 1
[0025] Put the cleaned substrate into the vacuum chamber of the multi-target plasma-enhanced cathodic arc plating and magnetron sputtering compound ion coating system, and wait for the back vacuum to reach 5.7×10 -2 At Pa, turn on the auxiliary heating device on the furnace wall to heat the substrate, and at the same time turn on the rotating power supply to make the substrate rotate continuously. After heating for 60 minutes, the temperature of the substrate reaches 345 °C; then pass argon into the vacuum chamber to adjust the flow of argon The guaranteed pressure is 1.8×10 -1 Pa, and then apply a DC bias of -200V and a pulse bias of -350V to the substrate, using ionized Ar + Etch the surface of the substrate, etch for 40 minutes, and the temperature of the substrate rises to 397°C; turn off the bias voltage of the substrate, turn off the argon gas, and feed nitrogen gas in turn, adjust the flow rate of nitrogen gas to ensure that the working pressure is 2.5Pa, and turn on th...
Embodiment 2
[0028] Put the cleaned substrate into the vacuum chamber of the multi-target plasma-enhanced cathodic arc plating and magnetron sputtering compound ion coating system, and wait for the background vacuum to reach 5.0×10 -2 At Pa, turn on the auxiliary heating device on the furnace wall to heat the substrate, and at the same time turn on the rotating power supply to make the substrate rotate continuously. After heating for 50 minutes, the temperature of the substrate reaches 325 °C; then pass argon gas into the vacuum chamber to adjust the flow rate of argon gas The guaranteed pressure is 1.0×10 -1 Pa, and then apply a DC bias of -100V and a pulse bias of -200V to the substrate, using ionized Ar + Etch the surface of the substrate, etch for 30 minutes, and the temperature of the substrate rises to 368°C; turn off the bias voltage of the substrate, turn off the argon gas, and feed nitrogen gas in turn, adjust the flow rate of nitrogen gas to ensure that the working pressure is 1....
Embodiment 3
[0031] Put the cleaned substrate into the vacuum chamber of the multi-target plasma-enhanced cathodic arc plating and magnetron sputtering composite ion coating system, and wait for the back vacuum to reach 5.5×10 -2 At Pa, turn on the auxiliary heating device on the furnace wall to heat the substrate, and at the same time turn on the rotating power supply to make the substrate rotate continuously. After heating for 80 minutes, the temperature of the substrate reaches 377°C; then pass argon gas into the vacuum chamber to adjust the flow rate of argon gas The guaranteed pressure is 2.5×10 -1 Pa, and then apply a DC bias of -200V and a pulse bias of -400V to the substrate, using ionized Ar + Etch the surface of the substrate, etch for 80 minutes, and the temperature of the substrate rises to 415°C; turn off the bias voltage of the substrate, turn off the argon gas, and feed nitrogen gas in turn, adjust the flow rate of nitrogen gas to ensure that the working pressure is 2.6Pa, a...
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